{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,6,10]],"date-time":"2025-06-10T12:48:15Z","timestamp":1749559695316,"version":"3.28.0"},"reference-count":17,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2015,8]]},"DOI":"10.1109\/3dic.2015.7334585","type":"proceedings-article","created":{"date-parts":[[2015,11,23]],"date-time":"2015-11-23T17:46:57Z","timestamp":1448300817000},"page":"TS8.16.1-TS8.16.5","source":"Crossref","is-referenced-by-count":3,"title":["Influential factors in low-temperature direct bonding of silicon dioxide"],"prefix":"10.1109","author":[{"given":"Ryouya","family":"Shirahama","sequence":"first","affiliation":[]},{"given":"Sethavut","family":"Duangchan","sequence":"additional","affiliation":[]},{"given":"Yusuke","family":"Koishikawa","sequence":"additional","affiliation":[]},{"given":"Akiyoshi","family":"Baba","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.7567\/JJAP.53.04EP16"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2015.7159590"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1016\/S0925-4005(01)00951-0"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1016\/S0924-4247(00)00420-9"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1016\/j.sna.2005.11.003"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1007\/s11664-008-0489-1"},{"key":"ref16","doi-asserted-by":"crossref","first-page":"29","DOI":"10.1109\/84.285720","article-title":"Low temperature wafer direct bonding","volume":"3","author":"cha","year":"1994","journal-title":"J Microelectromechanical Syst"},{"journal-title":"Semiconductor Wafer Bonding Science and Technology","year":"1998","author":"tong","key":"ref17"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/3DIC.2012.6262942"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2012.08.011"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1016\/S0924-4247(99)00246-0"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2011.03.038"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1149\/1.2982858"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1016\/S0924-4247(98)00310-0"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/EuroSimE.2013.6529968"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/TSM.2014.2323941"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TADVP.2006.875070"}],"event":{"name":"2015 International 3D Systems Integration Conference (3DIC)","start":{"date-parts":[[2015,8,31]]},"location":"Sendai, Japan","end":{"date-parts":[[2015,9,2]]}},"container-title":["2015 International 3D Systems Integration Conference (3DIC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/7328029\/7334459\/07334585.pdf?arnumber=7334585","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,6,23]],"date-time":"2017-06-23T20:14:26Z","timestamp":1498248866000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/7334585\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2015,8]]},"references-count":17,"URL":"https:\/\/doi.org\/10.1109\/3dic.2015.7334585","relation":{},"subject":[],"published":{"date-parts":[[2015,8]]}}}