{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,4]],"date-time":"2024-09-04T23:52:40Z","timestamp":1725493960487},"reference-count":11,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2015,8]]},"DOI":"10.1109\/3dic.2015.7334592","type":"proceedings-article","created":{"date-parts":[[2015,11,23]],"date-time":"2015-11-23T22:46:57Z","timestamp":1448318817000},"page":"TS8.22.1-TS8.22.5","source":"Crossref","is-referenced-by-count":1,"title":["Electrical interconnect test of 3D ICs made of dies without ESD protection circuits with a built-in test circuit"],"prefix":"10.1109","author":[{"given":"Kosuke","family":"Nanbara","sequence":"first","affiliation":[]},{"given":"Akihiro","family":"Odoriba","sequence":"additional","affiliation":[]},{"given":"Masaki","family":"Hashizume","sequence":"additional","affiliation":[]},{"given":"Hiroyuki","family":"Yotsuyanagi","sequence":"additional","affiliation":[]},{"family":"Shyue-Kung Lu","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"doi-asserted-by":"publisher","key":"ref4","DOI":"10.2197\/ipsjtsldm.7.56"},{"doi-asserted-by":"publisher","key":"ref3","DOI":"10.1109\/TEST.2009.5355573"},{"doi-asserted-by":"publisher","key":"ref10","DOI":"10.1109\/ESTC.2012.6542127"},{"doi-asserted-by":"publisher","key":"ref6","DOI":"10.1109\/ATS.2010.73"},{"doi-asserted-by":"publisher","key":"ref11","DOI":"10.1109\/3DIC.2014.7152148"},{"doi-asserted-by":"publisher","key":"ref5","DOI":"10.1109\/APCCAS.2010.5775087"},{"key":"ref8","first-page":"907","article-title":"Possibility of Logical Error Caused by Open Defects in TSVs","author":"hashizume","year":"2010","journal-title":"Proc 2010 International Technical Conference on Circuits Computers and Communications"},{"doi-asserted-by":"publisher","key":"ref7","DOI":"10.1109\/ATS.2009.42"},{"year":"2009","author":"pavlidis","journal-title":"Three-Dimensional Integrated Circuit Design","key":"ref2"},{"doi-asserted-by":"publisher","key":"ref9","DOI":"10.1109\/3DIC.2012.6262968"},{"doi-asserted-by":"publisher","key":"ref1","DOI":"10.1109\/VTS.2010.5469559"}],"event":{"name":"2015 International 3D Systems Integration Conference (3DIC)","start":{"date-parts":[[2015,8,31]]},"location":"Sendai, Japan","end":{"date-parts":[[2015,9,2]]}},"container-title":["2015 International 3D Systems Integration Conference (3DIC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/7328029\/7334459\/07334592.pdf?arnumber=7334592","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,24]],"date-time":"2017-03-24T23:52:52Z","timestamp":1490399572000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/7334592\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2015,8]]},"references-count":11,"URL":"https:\/\/doi.org\/10.1109\/3dic.2015.7334592","relation":{},"subject":[],"published":{"date-parts":[[2015,8]]}}}