{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,3]],"date-time":"2024-09-03T18:45:12Z","timestamp":1725389112257},"reference-count":8,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2015,8]]},"DOI":"10.1109\/3dic.2015.7334594","type":"proceedings-article","created":{"date-parts":[[2015,11,23]],"date-time":"2015-11-23T17:46:57Z","timestamp":1448300817000},"page":"TS8.24.1-TS8.24.4","source":"Crossref","is-referenced-by-count":0,"title":["On TSV array defect detection method using two ring-oscillators considering signal transitions at adjacent TSVs"],"prefix":"10.1109","author":[{"given":"Hiroyuki","family":"Yotsuyanagi","sequence":"first","affiliation":[]},{"given":"Akihiro","family":"Fujiwara","sequence":"additional","affiliation":[]},{"given":"Masaki","family":"Hashizume","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/ATS.2010.73"},{"key":"ref3","first-page":"11-1-1","article-title":"Testing of TSV-induced Small Delay Faults for Three Dimensional Integrated Circuits","author":"kuo","year":"2012","journal-title":"IEEE International Workshop on Testing Three-Dimensional Stacked Integrated Circuits"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/VTEST.2003.1197647"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.5104\/jiepeng.4.119"},{"key":"ref8","first-page":"1","article-title":"A unified method for parametric fault characterization of post-bond TSVs","author":"lin","year":"2012","journal-title":"IEEE International Test Conference"},{"key":"ref7","article-title":"Delay Line Embedded in Boundary Scan for Testing TSVs","author":"yotsuyanagi","year":"2014","journal-title":"IEEE International Workshop on Testing Three-Dimensional Stacked Integrated Circuits"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/VTS.2014.6818772"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1007\/s10836-011-5269-9"}],"event":{"name":"2015 International 3D Systems Integration Conference (3DIC)","start":{"date-parts":[[2015,8,31]]},"location":"Sendai, Japan","end":{"date-parts":[[2015,9,2]]}},"container-title":["2015 International 3D Systems Integration Conference (3DIC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/7328029\/7334459\/07334594.pdf?arnumber=7334594","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,25]],"date-time":"2017-03-25T01:08:45Z","timestamp":1490404125000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/7334594\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2015,8]]},"references-count":8,"URL":"https:\/\/doi.org\/10.1109\/3dic.2015.7334594","relation":{},"subject":[],"published":{"date-parts":[[2015,8]]}}}