{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,6]],"date-time":"2024-09-06T21:14:31Z","timestamp":1725657271645},"reference-count":7,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2015,8]]},"DOI":"10.1109\/3dic.2015.7334602","type":"proceedings-article","created":{"date-parts":[[2015,11,23]],"date-time":"2015-11-23T17:46:57Z","timestamp":1448300817000},"page":"TS8.31.1-TS8.31.5","source":"Crossref","is-referenced-by-count":10,"title":["Enabling automatic system design optimization through Assembly Design Kits"],"prefix":"10.1109","author":[{"given":"Andy","family":"Heinig","sequence":"first","affiliation":[{"name":"Fraunhofer Institute for Integrated Circuits, Design Automation Division, Dresden, Germany"}]},{"given":"Robert","family":"Fischbach","sequence":"additional","affiliation":[{"name":"Fraunhofer Institute for Integrated Circuits, Design Automation Division, Dresden, Germany"}]}],"member":"263","reference":[{"journal-title":"OpenAccess","year":"0","key":"ref4"},{"journal-title":"RS274X (Gerber) file format specification","year":"0","key":"ref3"},{"journal-title":"EIA\/JESD59","article-title":"Bond Wire Modeling Standard","year":"1997","key":"ref6"},{"journal-title":"Cadence SiP Layout","year":"0","key":"ref5"},{"key":"ref7","first-page":"183","article-title":"Effizienter Design Rule Check von 3D Systemaufbauten mit einer hierarchischen XML-basierten Modellierungssprache","author":"fischbach","year":"2014","journal-title":"MBMV"},{"key":"ref2","article-title":"Silicon-Package Co-Design Challenges from 2D to 3D","author":"kimmich","year":"0","journal-title":"DATE Friday Workshop"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/MDT.2012.2215302"}],"event":{"name":"2015 International 3D Systems Integration Conference (3DIC)","start":{"date-parts":[[2015,8,31]]},"location":"Sendai, Japan","end":{"date-parts":[[2015,9,2]]}},"container-title":["2015 International 3D Systems Integration Conference (3DIC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/7328029\/7334459\/07334602.pdf?arnumber=7334602","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2021,6,8]],"date-time":"2021-06-08T06:27:38Z","timestamp":1623133658000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/7334602\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2015,8]]},"references-count":7,"URL":"https:\/\/doi.org\/10.1109\/3dic.2015.7334602","relation":{},"subject":[],"published":{"date-parts":[[2015,8]]}}}