{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,5,22]],"date-time":"2025-05-22T05:49:05Z","timestamp":1747892945381},"reference-count":18,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2015,8]]},"DOI":"10.1109\/3dic.2015.7334603","type":"proceedings-article","created":{"date-parts":[[2015,11,23]],"date-time":"2015-11-23T22:46:57Z","timestamp":1448318817000},"page":"TS8.32.1-TS8.32.6","source":"Crossref","is-referenced-by-count":1,"title":["Cost modeling and analysis for the design, manufacturing and test of 3D-ICs"],"prefix":"10.1109","author":[{"given":"Armin","family":"Gruenewald","sequence":"first","affiliation":[]},{"given":"Michael","family":"Wahl","sequence":"additional","affiliation":[]},{"given":"Rainer","family":"Brueck","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/VTS.2014.6818763"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/IEMT.2012.6521773"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/TEST.2009.5355573"},{"article-title":"Modellierung von Herstellungs- und Testkosten für die Entwicklung von 3D-Systemen","year":"2014","author":"soest","key":"ref13"},{"article-title":"Implementierung eines Tools zur Berechnung von Herstellungs- und Testkosten bei der Entwicklung von 3D-Systemen","year":"2015","author":"timmermann","key":"ref14"},{"key":"ref15","article-title":"3D integration by Cu-Cu thermo-compression bonding of extremely thinned bulk-Si die containing 10 um pitch through-Si vias","author":"swinnen","year":"2006","journal-title":"International Electron Devices Meeting (IEDM)"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/ESSCIRC.2010.5619857"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2010.5490716"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2009.2034508"},{"key":"ref4","article-title":"Fabrication Cost Analysis for 2D, 2.5D, and 3D IC Designs","author":"zhang","year":"2011","journal-title":"IEEE International 3D Systems Integration Conference (3DIC)"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/3DIC.2009.5306575"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/DDECS.2011.5783107"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2010.5490828"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/ASPDAC.2009.4796486"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/ATS.2010.80"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1007\/978-3-642-30572-6"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1002\/9783527623051"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/3DIC.2013.6702351"}],"event":{"name":"2015 International 3D Systems Integration Conference (3DIC)","start":{"date-parts":[[2015,8,31]]},"location":"Sendai, Japan","end":{"date-parts":[[2015,9,2]]}},"container-title":["2015 International 3D Systems Integration Conference (3DIC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/7328029\/7334459\/07334603.pdf?arnumber=7334603","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,25]],"date-time":"2017-03-25T00:10:43Z","timestamp":1490400643000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/7334603\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2015,8]]},"references-count":18,"URL":"https:\/\/doi.org\/10.1109\/3dic.2015.7334603","relation":{},"subject":[],"published":{"date-parts":[[2015,8]]}}}