{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,5]],"date-time":"2024-09-05T06:46:25Z","timestamp":1725518785163},"reference-count":4,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2015,8]]},"DOI":"10.1109\/3dic.2015.7334616","type":"proceedings-article","created":{"date-parts":[[2015,11,23]],"date-time":"2015-11-23T17:46:57Z","timestamp":1448300817000},"page":"TS10.2.1-TS10.2.4","source":"Crossref","is-referenced-by-count":5,"title":["Thermal simulation of heterogeneous GaN\/ InP\/silicon 3DIC stacks"],"prefix":"10.1109","author":[{"given":"T. Robert","family":"Harris","sequence":"first","affiliation":[]},{"given":"Eric J.","family":"Wyers","sequence":"additional","affiliation":[]},{"family":"Lee Wang","sequence":"additional","affiliation":[]},{"given":"Samuel","family":"Graham","sequence":"additional","affiliation":[]},{"given":"Georges","family":"Pavlidis","sequence":"additional","affiliation":[]},{"given":"Paul D.","family":"Franzon","sequence":"additional","affiliation":[]},{"given":"W. Rhett","family":"Davis","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2014.2321005"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/IITC.2001.930045"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2011.2178414"},{"key":"ref1","article-title":"DAHI Foundry Technology BAA Overview","author":"raman","year":"2012","journal-title":"DAHI Foundary Technology Proposer's Day Workshop"}],"event":{"name":"2015 International 3D Systems Integration Conference (3DIC)","start":{"date-parts":[[2015,8,31]]},"location":"Sendai, Japan","end":{"date-parts":[[2015,9,2]]}},"container-title":["2015 International 3D Systems Integration Conference (3DIC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/7328029\/7334459\/07334616.pdf?arnumber=7334616","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,25]],"date-time":"2017-03-25T01:08:50Z","timestamp":1490404130000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/7334616\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2015,8]]},"references-count":4,"URL":"https:\/\/doi.org\/10.1109\/3dic.2015.7334616","relation":{},"subject":[],"published":{"date-parts":[[2015,8]]}}}