{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,2,14]],"date-time":"2026-02-14T10:25:08Z","timestamp":1771064708076,"version":"3.50.1"},"reference-count":0,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2015,8]]},"DOI":"10.1109\/3dic.2015.7334619","type":"proceedings-article","created":{"date-parts":[[2015,11,23]],"date-time":"2015-11-23T22:46:57Z","timestamp":1448318817000},"page":"TS11.1.1-TS11.1.3","source":"Crossref","is-referenced-by-count":16,"title":["Active Si interposer for 3D IC integrations"],"prefix":"10.1109","author":[{"given":"Joungho","family":"Kim","sequence":"first","affiliation":[]}],"member":"263","event":{"name":"2015 International 3D Systems Integration Conference (3DIC)","location":"Sendai, Japan","start":{"date-parts":[[2015,8,31]]},"end":{"date-parts":[[2015,9,2]]}},"container-title":["2015 International 3D Systems Integration Conference (3DIC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/7328029\/7334459\/07334619.pdf?arnumber=7334619","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,2,12]],"date-time":"2022-02-12T01:08:16Z","timestamp":1644628096000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/7334619\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2015,8]]},"references-count":0,"URL":"https:\/\/doi.org\/10.1109\/3dic.2015.7334619","relation":{},"subject":[],"published":{"date-parts":[[2015,8]]}}}