{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,6,1]],"date-time":"2025-06-01T04:11:18Z","timestamp":1748751078176,"version":"3.41.0"},"reference-count":12,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2015,8]]},"DOI":"10.1109\/3dic.2015.7334621","type":"proceedings-article","created":{"date-parts":[[2015,11,23]],"date-time":"2015-11-23T22:46:57Z","timestamp":1448318817000},"page":"TS11.3.1-TS11.3.4","source":"Crossref","is-referenced-by-count":4,"title":["Silicon interposer platform with low-loss through-silicon vias using air"],"prefix":"10.1109","author":[{"given":"Hanju","family":"Oh","sequence":"first","affiliation":[]},{"given":"Gary S.","family":"May","sequence":"additional","affiliation":[]},{"given":"Muhannad S.","family":"Bakir","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2010.09.031"},{"key":"ref3","article-title":"Xilinx stacked silicon interconnect technology delivers breakthrough FPGA capacity, bandwidth, and power efficiency","author":"dorsey","year":"2010","journal-title":"Tech Rep WP38"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1016\/j.mee.2015.07.005"},{"key":"ref6","first-page":"1946","article-title":"High RF performance TSV silicon carrier for high frequency application","author":"ho","year":"2008","journal-title":"Proc IEEE Electron Components and Technol Conf"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2013.2279688"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2010.5490837"},{"journal-title":"Microwave Engineering","year":"2005","author":"pozar","key":"ref12"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2013.2261122"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/3DIC.2009.5306542"},{"key":"ref2","doi-asserted-by":"crossref","DOI":"10.1002\/9783527670109","author":"garrou","year":"2014","journal-title":"Handbook of 3D Integration Volume 3-3D Process Technology"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1142\/9789812707581_0004"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1147\/rd.462.0245"}],"event":{"name":"2015 International 3D Systems Integration Conference (3DIC)","start":{"date-parts":[[2015,8,31]]},"location":"Sendai, Japan","end":{"date-parts":[[2015,9,2]]}},"container-title":["2015 International 3D Systems Integration Conference (3DIC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/7328029\/7334459\/07334621.pdf?arnumber=7334621","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,5,31]],"date-time":"2025-05-31T13:53:33Z","timestamp":1748699613000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/7334621\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2015,8]]},"references-count":12,"URL":"https:\/\/doi.org\/10.1109\/3dic.2015.7334621","relation":{},"subject":[],"published":{"date-parts":[[2015,8]]}}}