{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,5]],"date-time":"2024-09-05T20:44:39Z","timestamp":1725569079062},"reference-count":13,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2016,11]]},"DOI":"10.1109\/3dic.2016.7969998","type":"proceedings-article","created":{"date-parts":[[2017,7,10]],"date-time":"2017-07-10T21:54:38Z","timestamp":1499723678000},"page":"1-5","source":"Crossref","is-referenced-by-count":1,"title":["From 2D to monolithic 3D predictive design platform: An innovative migration methodology for benchmark purpose"],"prefix":"10.1109","author":[{"given":"Gerald","family":"Cibrario","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Nour","family":"Ben Salem","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Joris","family":"Lacord","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Karim","family":"Azizi-Mourier","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Olivier","family":"Rozeau","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Etienne","family":"Maurin","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Olivier","family":"Billoint","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Sebastien","family":"Thuries","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Alexandre","family":"Valentian","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"journal-title":"skills","year":"0","key":"ref10"},{"journal-title":"ELDO","year":"0","key":"ref11"},{"key":"ref12","article-title":"Performance benchmarking of device architectures for the sub-10nm CMOS technological nodes","author":"rozeau","year":"2015","journal-title":"IWNA Vung Tau"},{"journal-title":"Guidelines on 3DVLSI design regarding the intermediate BEOL process influence S3S","year":"2015","author":"ayres","key":"ref13"},{"journal-title":"Tcl Developer Xchange","year":"0","key":"ref4"},{"journal-title":"Extensible Markup Language (XML)","year":"0","key":"ref3"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/ICICDT.2014.6838599"},{"key":"ref5","article-title":"Power Benefit Study of Monolithic 3D IC at the 7nm Technology node","author":"chang","year":"2015","journal-title":"ISLPED Rome"},{"key":"ref8","article-title":"High Performance CMOS FDSOI Devices activated at Low Temperature","author":"pasini","year":"2015","journal-title":"VLSI Kyoto"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/ESSDERC.2016.7599625"},{"key":"ref2","article-title":"First demonstration of a CMOS over CMOS 3D VLSI CoolCube integration on 300mm wafers","author":"brunet","year":"2016","journal-title":"VLSI Honolulu"},{"journal-title":"Monolithic 3D integration A powerful alternative to classical 2D scaling S3S","year":"2014","author":"vinet","key":"ref1"},{"journal-title":"Bourne Again Shell (BASH)","year":"0","key":"ref9"}],"event":{"name":"2016 IEEE International 3D Systems Integration Conference (3DIC)","start":{"date-parts":[[2016,11,8]]},"location":"San Francisco, CA, USA","end":{"date-parts":[[2016,11,11]]}},"container-title":["2016 IEEE International 3D Systems Integration Conference (3DIC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/7959775\/7969992\/07969998.pdf?arnumber=7969998","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,10,3]],"date-time":"2017-10-03T03:05:25Z","timestamp":1506999925000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/7969998\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2016,11]]},"references-count":13,"URL":"https:\/\/doi.org\/10.1109\/3dic.2016.7969998","relation":{},"subject":[],"published":{"date-parts":[[2016,11]]}}}