{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,9,23]],"date-time":"2025-09-23T12:42:35Z","timestamp":1758631355877},"reference-count":11,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2016,11]]},"DOI":"10.1109\/3dic.2016.7970007","type":"proceedings-article","created":{"date-parts":[[2017,7,10]],"date-time":"2017-07-10T17:54:38Z","timestamp":1499709278000},"source":"Crossref","is-referenced-by-count":12,"title":["Thermal performance of CoolCube\u2122 monolithic and TSV-based 3D integration processes"],"prefix":"10.1109","author":[{"given":"C.","family":"Santos","sequence":"first","affiliation":[]},{"given":"P.","family":"Vivet","sequence":"additional","affiliation":[]},{"given":"S.","family":"Thuries","sequence":"additional","affiliation":[]},{"given":"O.","family":"Billoint","sequence":"additional","affiliation":[]},{"given":"J.-P.","family":"Colonna","sequence":"additional","affiliation":[]},{"given":"P.","family":"Coudrain","sequence":"additional","affiliation":[]},{"given":"L.","family":"Wang","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/3DIC.2014.7152163"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/3DIC.2015.7334472"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2016.2523983"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2014.6897395"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/HPCA.2014.6835959"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1145\/2593069.2593140"},{"key":"ref8","first-page":"146","article-title":"A 4×4×2 Homogeneous Scalable 3D Network-on-Chip Circuit with 326 MFlit\/s 0.66 pJ\/bit Robust and Fault Tolerant Asynchronous 3D links","author":"vivet","year":"2016","journal-title":"IEEE InternationalSolid-State Circuits Conference (ISSCC)"},{"key":"ref7","first-page":"869","article-title":"Reliable 300mm Wafer Level Hybrid Bonding for 3D Stacked CMOS Image Sensors","author":"lhostis","year":"2016","journal-title":"IEEE Electronic Components and Technology Conference (ECTC)"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/VLSIT.2016.7573428"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/3DIC.2014.7152167"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/VLSIT.2015.7223698"}],"event":{"name":"2016 IEEE International 3D Systems Integration Conference (3DIC)","location":"San Francisco, CA, USA","start":{"date-parts":[[2016,11,8]]},"end":{"date-parts":[[2016,11,11]]}},"container-title":["2016 IEEE International 3D Systems Integration Conference (3DIC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/7959775\/7969992\/07970007.pdf?arnumber=7970007","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,8,16]],"date-time":"2017-08-16T11:37:26Z","timestamp":1502883446000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/7970007\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2016,11]]},"references-count":11,"URL":"https:\/\/doi.org\/10.1109\/3dic.2016.7970007","relation":{},"subject":[],"published":{"date-parts":[[2016,11]]}}}