{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,12,31]],"date-time":"2025-12-31T06:51:44Z","timestamp":1767163904626,"version":"build-2238731810"},"reference-count":28,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2016,11]]},"DOI":"10.1109\/3dic.2016.7970037","type":"proceedings-article","created":{"date-parts":[[2017,7,10]],"date-time":"2017-07-10T17:54:38Z","timestamp":1499709278000},"page":"1-5","source":"Crossref","is-referenced-by-count":4,"title":["Towards high density 3D interconnections"],"prefix":"10.1109","author":[{"given":"S.","family":"Cheramy","sequence":"first","affiliation":[]},{"given":"A.","family":"Jouve","sequence":"additional","affiliation":[]},{"given":"L.","family":"Arnaud","sequence":"additional","affiliation":[]},{"given":"C.","family":"Fenouillet-Beranger","sequence":"additional","affiliation":[]},{"given":"P.","family":"Batude","sequence":"additional","affiliation":[]},{"given":"M.","family":"Vinet","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2016.27"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/3DIC.2013.6702315"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/EPTC.2013.6745705"},{"key":"ref13","author":"batude","year":"2009","journal-title":"IEEE VLSI"},{"key":"ref14","author":"batude","year":"2009","journal-title":"IEEE IEDM"},{"key":"ref15","author":"irisawa","year":"2013","journal-title":"IEEE VLSI"},{"key":"ref16","author":"irisawa","year":"2014","journal-title":"IEEE VLSI"},{"key":"ref17","author":"ouerghi","year":"2014","journal-title":"IEEE IEDM"},{"key":"ref18","volume":"2","author":"batude","year":"2012","journal-title":"Journal on Emerging and Selected Topics in Circuits and Systems"},{"key":"ref19","author":"coudrain","year":"2008","journal-title":"IEEE IEDM"},{"key":"ref28","year":"2015","journal-title":"IEEE Rebooting Computing"},{"key":"ref4","first-page":"81","article-title":"An overview of patterned metal \/ dielectric surface bonding: mechanism, alignment and characterization","author":"di","year":"2011","journal-title":"JECS"},{"key":"ref27","doi-asserted-by":"crossref","DOI":"10.1109\/EPTC.2015.7412403","article-title":"<200 nm Wafer-to-Wafer Overlay Accuracy in Wafer Level Cu\/SiO2 Hybrid Bonding for BSI CIS","author":"rebhanl","year":"2015","journal-title":"17th Electronics Packaging Technology Conference 2015"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2010.5490697"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/EPTC.2015.7412373"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2016.202"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2010.5490904"},{"key":"ref7","article-title":"Advances Toward Reliable High Density Cu-Cu Interconnects by Cu-SiO2 Direct Hybrid Bonding","author":"beilliard","year":"2014","journal-title":"IEEE International 3D System Intearation Conference (3DIC)"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1149\/1.3187271"},{"key":"ref9","first-page":"13","article-title":"Development of fine pitch interconnects for 3D integrated circuits","author":"bana","year":"2016","journal-title":"Electronics System Integration Technology Conference"},{"key":"ref1","year":"2016"},{"key":"ref20","author":"deprat","year":"2016","journal-title":"EMRS"},{"key":"ref22","author":"choi","year":"0","journal-title":"S3S 2016"},{"key":"ref21","author":"brunet","year":"0","journal-title":"ECS 2015"},{"key":"ref24","author":"pasini","year":"0","journal-title":"VLSID 2016"},{"key":"ref23","author":"pasini","year":"0","journal-title":"VLSI 2015"},{"key":"ref26","author":"brunet","year":"0","journal-title":"VLSID 2016"},{"key":"ref25","author":"benoit","year":"0","journal-title":"IEDM 2015"}],"event":{"name":"2016 IEEE International 3D Systems Integration Conference (3DIC)","location":"San Francisco, CA, USA","start":{"date-parts":[[2016,11,8]]},"end":{"date-parts":[[2016,11,11]]}},"container-title":["2016 IEEE International 3D Systems Integration Conference (3DIC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/7959775\/7969992\/07970037.pdf?arnumber=7970037","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2020,10,11]],"date-time":"2020-10-11T19:25:17Z","timestamp":1602444317000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/7970037\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2016,11]]},"references-count":28,"aliases":["10.1109\/3dic.2016.7970025"],"URL":"https:\/\/doi.org\/10.1109\/3dic.2016.7970037","relation":{},"subject":[],"published":{"date-parts":[[2016,11]]}}}