{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,10,23]],"date-time":"2024-10-23T07:37:09Z","timestamp":1729669029160,"version":"3.28.0"},"reference-count":11,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2016,11]]},"DOI":"10.1109\/3dic.2016.7970027","type":"proceedings-article","created":{"date-parts":[[2017,7,10]],"date-time":"2017-07-10T21:54:38Z","timestamp":1499723678000},"page":"1-5","source":"Crossref","is-referenced-by-count":0,"title":["Nano-scale Cu direct bonding using ultra-high density Cu nano-pillar (CNP) for high yield exascale 2.5\/3D integration applications"],"prefix":"10.1109","author":[{"given":"Kangwook","family":"Lee","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Ai","family":"Nakamura","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Jicheol","family":"Bea","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Takafumi","family":"Fukushima","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Suresh","family":"Ramalingam","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Xin","family":"Wu","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Tanaka","family":"Tanaka","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Mitsumasa","family":"Koyanagi","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref4","first-page":"295","article-title":"Cu-SiO2 Hybrid Bonding","author":"di","year":"2014","journal-title":"Handbook of 3D Integration"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.7567\/SSDM.2009.D-1-2"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/3DIC.2015.7334589"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/3DIC.2015.7334471"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2015.7409652"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2012.6249108"},{"key":"ref8","doi-asserted-by":"crossref","first-page":"411","DOI":"10.1149\/1.2781142","article-title":"Structure Features of Oxide Coatings on Aluminum","volume":"100","author":"keller","year":"1953","journal-title":"J Electrochem Soc"},{"key":"ref7","first-page":"571","article-title":"Copper-filled Anodized Aluminum Oxide","author":"yamashita","year":"2015","journal-title":"ICEP-IAAC"},{"journal-title":"3D Architectures for Semiconductor Integration and Packaging Conference San Francisco (USA)","year":"2014","author":"wu","key":"ref2"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1143\/JJAP.35.L126"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.4071\/isom-2013-TP11"}],"event":{"name":"2016 IEEE International 3D Systems Integration Conference (3DIC)","start":{"date-parts":[[2016,11,8]]},"location":"San Francisco, CA, USA","end":{"date-parts":[[2016,11,11]]}},"container-title":["2016 IEEE International 3D Systems Integration Conference (3DIC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/7959775\/7969992\/07970027.pdf?arnumber=7970027","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2019,9,29]],"date-time":"2019-09-29T10:35:06Z","timestamp":1569753306000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/7970027\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2016,11]]},"references-count":11,"URL":"https:\/\/doi.org\/10.1109\/3dic.2016.7970027","relation":{},"subject":[],"published":{"date-parts":[[2016,11]]}}}