{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,10,23]],"date-time":"2024-10-23T05:15:37Z","timestamp":1729660537716,"version":"3.28.0"},"reference-count":25,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2016,11]]},"DOI":"10.1109\/3dic.2016.7970031","type":"proceedings-article","created":{"date-parts":[[2017,7,10]],"date-time":"2017-07-10T17:54:38Z","timestamp":1499709278000},"page":"1-4","source":"Crossref","is-referenced-by-count":1,"title":["Drastic reduction of keep-out-zone in 3D-IC by local stress suppression with negative-CTE filler"],"prefix":"10.1109","author":[{"given":"Hisashi","family":"Kino","sequence":"first","affiliation":[]},{"given":"Takafumi","family":"Fukushima","sequence":"additional","affiliation":[]},{"given":"Tetsu","family":"Tanaka","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2006.346877"},{"key":"ref11","first-page":"18","article-title":"The Impact of Externally Applied Mechanical Stress on Analog and RF Performances of SOI MOSFETs","volume":"10","author":"emam","year":"2009","journal-title":"J Telecommun Inf Tech"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.7567\/JJAP.52.04CB11"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.7567\/SSDM.2011.C-5-2"},{"key":"ref14","first-page":"411","article-title":"Impacts of Bending Stress on MOSFET Characteristics by LSI Stacking for 3D-LSI","volume":"j94 c","author":"kino","year":"2011","journal-title":"IEICE Trans Electronics Jpn Edition"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.7567\/SSDM.1997.A-14-3"},{"key":"ref16","first-page":"8.1","article-title":"BCurrent and future 3 dimensional LSI technologies","author":"motoyoshi","year":"2007","journal-title":"Tech Dig Int 3D System Integration Conf"},{"key":"ref17","doi-asserted-by":"crossref","first-page":"2799","DOI":"10.1109\/TED.2006.884079","article-title":"Three-Dimensional Integration Technology Based on Wafer Bonding with Vertical Buried Interconnections","volume":"53","author":"tanaka","year":"2006","journal-title":"IEEE Trans Electron Devices"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2009.5424353"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2009.5073988"},{"key":"ref4","first-page":"55","article-title":"Roadblocks in Achieving Three-Dimensional LSI","author":"koyanag","year":"1989","journal-title":"Proc 8th Symp Future Electron Devices"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2010.2099870"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1143\/APEX.3.086601"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/VLSIT.2012.6242515"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2014.2335154"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TADVP.2009.2021661"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2009.5424305"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2013.6575596"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2006.884079"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/3DIC.2009.5306532"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1063\/1.2147726"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1143\/JJAP.45.3030"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1063\/1.3540604"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1063\/1.2831715"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1111\/j.1551-2916.2009.03297.x"}],"event":{"name":"2016 IEEE International 3D Systems Integration Conference (3DIC)","start":{"date-parts":[[2016,11,8]]},"location":"San Francisco, CA, USA","end":{"date-parts":[[2016,11,11]]}},"container-title":["2016 IEEE International 3D Systems Integration Conference (3DIC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/7959775\/7969992\/07970031.pdf?arnumber=7970031","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2019,9,29]],"date-time":"2019-09-29T06:34:52Z","timestamp":1569738892000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/7970031\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2016,11]]},"references-count":25,"URL":"https:\/\/doi.org\/10.1109\/3dic.2016.7970031","relation":{},"subject":[],"published":{"date-parts":[[2016,11]]}}}