{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,10,29]],"date-time":"2024-10-29T09:16:13Z","timestamp":1730193373184,"version":"3.28.0"},"reference-count":5,"publisher":"IEEE","license":[{"start":{"date-parts":[[2019,10,1]],"date-time":"2019-10-01T00:00:00Z","timestamp":1569888000000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2019,10,1]],"date-time":"2019-10-01T00:00:00Z","timestamp":1569888000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2019,10,1]],"date-time":"2019-10-01T00:00:00Z","timestamp":1569888000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2019,10]]},"DOI":"10.1109\/3dic48104.2019.9058773","type":"proceedings-article","created":{"date-parts":[[2020,4,10]],"date-time":"2020-04-10T05:10:46Z","timestamp":1586495446000},"page":"1-4","source":"Crossref","is-referenced-by-count":0,"title":["Cu-Cu Bonding Challenges with \u2018i-ACF\u2019 for Advanced 3D Integration"],"prefix":"10.1109","author":[{"given":"Shunji","family":"Kurooka","sequence":"first","affiliation":[]},{"given":"Yoshinori","family":"Hotta","sequence":"additional","affiliation":[]},{"given":"Ai","family":"Nakamura","sequence":"additional","affiliation":[]},{"given":"Mitsumasa","family":"Koyanagi","sequence":"additional","affiliation":[]},{"given":"Takahumi","family":"Fukushima","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref4","doi-asserted-by":"crossref","first-page":"411","DOI":"10.1149\/1.2781142","article-title":"Structural Features of Oxide Coatings on Aluminum","volume":"100","author":"keller","year":"1953","journal-title":"J Electrochem Soc"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/ICEP-IAAC.2015.7111079"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1143\/JJAP.35.L126"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2015.7409652"},{"key":"ref1","first-page":"937","article-title":"Cu-Filled Anodic Aluminum Oxide: A potential substrate material for a high density interconnection","author":"horiuchi","year":"0","journal-title":"Proc ECTC"}],"event":{"name":"2019 International 3D Systems Integration Conference (3DIC)","start":{"date-parts":[[2019,10,8]]},"location":"Sendai, Japan","end":{"date-parts":[[2019,10,10]]}},"container-title":["2019 International 3D Systems Integration Conference (3DIC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/9043388\/9058772\/09058773.pdf?arnumber=9058773","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,7,18]],"date-time":"2022-07-18T15:16:30Z","timestamp":1658157390000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9058773\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2019,10]]},"references-count":5,"URL":"https:\/\/doi.org\/10.1109\/3dic48104.2019.9058773","relation":{},"subject":[],"published":{"date-parts":[[2019,10]]}}}