{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,1,12]],"date-time":"2026-01-12T04:46:44Z","timestamp":1768193204807,"version":"3.49.0"},"reference-count":8,"publisher":"IEEE","license":[{"start":{"date-parts":[[2019,10,1]],"date-time":"2019-10-01T00:00:00Z","timestamp":1569888000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2019,10,1]],"date-time":"2019-10-01T00:00:00Z","timestamp":1569888000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2019,10]]},"DOI":"10.1109\/3dic48104.2019.9058783","type":"proceedings-article","created":{"date-parts":[[2020,4,10]],"date-time":"2020-04-10T01:10:46Z","timestamp":1586481046000},"page":"1-5","source":"Crossref","is-referenced-by-count":8,"title":["Towards a Complete Direct Hybrid Bonding D2W Integration Flow: Known-Good-Dies and Die Planarization Modules Development"],"prefix":"10.1109","author":[{"given":"E.","family":"Bourjot","sequence":"first","affiliation":[{"name":"Univ. Grenoble Alpes, CEA, LETI,Grenoble,38000"}]},{"given":"P.","family":"Stewart","sequence":"additional","affiliation":[{"name":"Univ. Grenoble Alpes, CEA, LETI,Grenoble,38000"}]},{"given":"C.","family":"Dubarry","sequence":"additional","affiliation":[{"name":"Univ. Grenoble Alpes, CEA, LETI,Grenoble,38000"}]},{"given":"E.","family":"Lagoutte","sequence":"additional","affiliation":[{"name":"Univ. Grenoble Alpes, CEA, LETI,Grenoble,38000"}]},{"given":"E.","family":"Rolland","sequence":"additional","affiliation":[{"name":"Univ. Grenoble Alpes, CEA, LETI,Grenoble,38000"}]},{"given":"N.","family":"Bresson","sequence":"additional","affiliation":[{"name":"Univ. Grenoble Alpes, CEA, LETI,Grenoble,38000"}]},{"given":"G.","family":"Romano","sequence":"additional","affiliation":[{"name":"Univ. Grenoble Alpes, CEA, LETI,Grenoble,38000"}]},{"given":"D.","family":"Scevola","sequence":"additional","affiliation":[{"name":"Univ. Grenoble Alpes, CEA, LETI,Grenoble,38000"}]},{"given":"V.","family":"Balan","sequence":"additional","affiliation":[{"name":"Univ. Grenoble Alpes, CEA, LETI,Grenoble,38000"}]},{"given":"J.","family":"Dechamp","sequence":"additional","affiliation":[{"name":"Univ. Grenoble Alpes, CEA, LETI,Grenoble,38000"}]},{"given":"M.","family":"Zussy","sequence":"additional","affiliation":[{"name":"Univ. Grenoble Alpes, CEA, LETI,Grenoble,38000"}]},{"given":"G.","family":"Mauguen","sequence":"additional","affiliation":[{"name":"Univ. Grenoble Alpes, CEA, LETI,Grenoble,38000"}]},{"given":"C.","family":"Castan","sequence":"additional","affiliation":[{"name":"Univ. Grenoble Alpes, CEA, LETI,Grenoble,38000"}]},{"given":"L.","family":"Sanchez","sequence":"additional","affiliation":[{"name":"Univ. Grenoble Alpes, CEA, LETI,Grenoble,38000"}]},{"given":"A.","family":"Jouve","sequence":"additional","affiliation":[{"name":"Univ. Grenoble Alpes, CEA, LETI,Grenoble,38000"}]},{"given":"F.","family":"Fournel","sequence":"additional","affiliation":[{"name":"Univ. Grenoble Alpes, CEA, LETI,Grenoble,38000"}]},{"given":"S.","family":"Cheramy","sequence":"additional","affiliation":[{"name":"Univ. Grenoble Alpes, CEA, LETI,Grenoble,38000"}]}],"member":"263","reference":[{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1149\/07509.0145ecst"},{"key":"ref3","author":"jouve","year":"2017","journal-title":"1?m pitch direct hybrid bonding with"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2018.8614570"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2016.202"},{"key":"ref8","first-page":"1","article-title":"Silicon based dry-films evaluation for 2.5 D and 3D Wafer-Level system integration improvement","author":"jouve","year":"0","journal-title":"3D Systems Integration Conference (3DIC)"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TEST.2018.8624731"},{"key":"ref2","first-page":"1","article-title":"Generalized cost model for 3D systems","author":"gitlin","year":"0","journal-title":"2013 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S)"},{"key":"ref1","author":"jouve","year":"0","journal-title":"Die-to-Wafer Direct hybrid Bonding process improvements and electrical characterization"}],"event":{"name":"2019 International 3D Systems Integration Conference (3DIC)","location":"Sendai, Japan","start":{"date-parts":[[2019,10,8]]},"end":{"date-parts":[[2019,10,10]]}},"container-title":["2019 International 3D Systems Integration Conference (3DIC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/9043388\/9058772\/09058783.pdf?arnumber=9058783","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,8,19]],"date-time":"2025-08-19T18:12:59Z","timestamp":1755627179000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9058783\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2019,10]]},"references-count":8,"URL":"https:\/\/doi.org\/10.1109\/3dic48104.2019.9058783","relation":{},"subject":[],"published":{"date-parts":[[2019,10]]}}}