{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,7]],"date-time":"2024-09-07T15:29:49Z","timestamp":1725722989133},"reference-count":9,"publisher":"IEEE","license":[{"start":{"date-parts":[[2019,10,1]],"date-time":"2019-10-01T00:00:00Z","timestamp":1569888000000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2019,10,1]],"date-time":"2019-10-01T00:00:00Z","timestamp":1569888000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2019,10,1]],"date-time":"2019-10-01T00:00:00Z","timestamp":1569888000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2019,10]]},"DOI":"10.1109\/3dic48104.2019.9058785","type":"proceedings-article","created":{"date-parts":[[2020,4,10]],"date-time":"2020-04-10T05:10:46Z","timestamp":1586495446000},"page":"1-4","source":"Crossref","is-referenced-by-count":1,"title":["Triple-Layering Technology for Pixel-Parallel CMOS Image Sensors Developed by Hybrid Bonding of SOI Wafers"],"prefix":"10.1109","author":[{"given":"Masahide","family":"Goto","sequence":"first","affiliation":[]},{"given":"Joeri","family":"De Vos","sequence":"additional","affiliation":[]},{"given":"Toshihisa","family":"Watabe","sequence":"additional","affiliation":[]},{"given":"Kei","family":"Hagiwara","sequence":"additional","affiliation":[]},{"given":"Masakazu","family":"Nanba","sequence":"additional","affiliation":[]},{"given":"Yoshinori","family":"Iguchi","sequence":"additional","affiliation":[]},{"given":"Eiji","family":"Higurashi","sequence":"additional","affiliation":[]},{"given":"Yuki","family":"Honda","sequence":"additional","affiliation":[]},{"given":"Takuya","family":"Saraya","sequence":"additional","affiliation":[]},{"given":"Masaharu","family":"Kobayashi","sequence":"additional","affiliation":[]},{"given":"Hiroshi","family":"Toshiyoshi","sequence":"additional","affiliation":[]},{"given":"Toshiro","family":"Hiramotoi","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2014.2331975"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2017.7870268"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2014.7046980"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1149\/06405.0391ecst"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2018.2885072"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/ISCAS.2018.8351002"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/VLSIT.2014.6894429"},{"key":"ref9","first-page":"187","author":"ohta","year":"2007","journal-title":"Smart CMOS Image Sensors and Applications"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2015.7062951"}],"event":{"name":"2019 International 3D Systems Integration Conference (3DIC)","start":{"date-parts":[[2019,10,8]]},"location":"Sendai, Japan","end":{"date-parts":[[2019,10,10]]}},"container-title":["2019 International 3D Systems Integration Conference (3DIC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/9043388\/9058772\/09058785.pdf?arnumber=9058785","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,7,18]],"date-time":"2022-07-18T14:47:21Z","timestamp":1658155641000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9058785\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2019,10]]},"references-count":9,"URL":"https:\/\/doi.org\/10.1109\/3dic48104.2019.9058785","relation":{},"subject":[],"published":{"date-parts":[[2019,10]]}}}