{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,10,29]],"date-time":"2024-10-29T09:16:20Z","timestamp":1730193380867,"version":"3.28.0"},"reference-count":5,"publisher":"IEEE","license":[{"start":{"date-parts":[[2019,10,1]],"date-time":"2019-10-01T00:00:00Z","timestamp":1569888000000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2019,10,1]],"date-time":"2019-10-01T00:00:00Z","timestamp":1569888000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2019,10,1]],"date-time":"2019-10-01T00:00:00Z","timestamp":1569888000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2019,10]]},"DOI":"10.1109\/3dic48104.2019.9058786","type":"proceedings-article","created":{"date-parts":[[2020,4,10]],"date-time":"2020-04-10T05:10:46Z","timestamp":1586495446000},"page":"1-3","source":"Crossref","is-referenced-by-count":0,"title":["Hydrolysis-Tolerant Hybrid Bonding in Ambient Atmosphere for 3D Integration"],"prefix":"10.1109","author":[{"given":"Akitsu","family":"Shigetou","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Tilo H.","family":"Yang","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"C. Robert","family":"Kao","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"journal-title":"Int'l Patent application PCT\/JP2019\/19757","year":"2019","key":"ref4"},{"journal-title":"No","year":"2017","key":"ref3"},{"key":"ref5","doi-asserted-by":"crossref","first-page":"1","DOI":"10.1038\/s41598-018-37186-2","volume":"9","author":"yang","year":"2019","journal-title":"Nature Scientific Reports"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1021\/acs.langmuir.7b02010"},{"key":"ref1","first-page":"1498","author":"shigetou","year":"0","journal-title":"IEEE 65th ECTC 2015"}],"event":{"name":"2019 International 3D Systems Integration Conference (3DIC)","start":{"date-parts":[[2019,10,8]]},"location":"Sendai, Japan","end":{"date-parts":[[2019,10,10]]}},"container-title":["2019 International 3D Systems Integration Conference (3DIC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/9043388\/9058772\/09058786.pdf?arnumber=9058786","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,7,18]],"date-time":"2022-07-18T14:47:21Z","timestamp":1658155641000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9058786\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2019,10]]},"references-count":5,"URL":"https:\/\/doi.org\/10.1109\/3dic48104.2019.9058786","relation":{},"subject":[],"published":{"date-parts":[[2019,10]]}}}