{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,10,29]],"date-time":"2024-10-29T09:16:26Z","timestamp":1730193386406,"version":"3.28.0"},"reference-count":19,"publisher":"IEEE","license":[{"start":{"date-parts":[[2019,10,1]],"date-time":"2019-10-01T00:00:00Z","timestamp":1569888000000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2019,10,1]],"date-time":"2019-10-01T00:00:00Z","timestamp":1569888000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2019,10,1]],"date-time":"2019-10-01T00:00:00Z","timestamp":1569888000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2019,10]]},"DOI":"10.1109\/3dic48104.2019.9058859","type":"proceedings-article","created":{"date-parts":[[2020,4,10]],"date-time":"2020-04-10T01:10:46Z","timestamp":1586481046000},"page":"1-6","source":"Crossref","is-referenced-by-count":1,"title":["Hierarchical Design Methodology and Optimization for Proximity Communication based Contactless 3D ThruChip Interface"],"prefix":"10.1109","author":[{"given":"Srinivasan","family":"Gopal","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Deukhyoun","family":"Heo","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Tanay","family":"Karnik","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/MWSYM.2019.8700900"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2018.2883531"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2018.8310356"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2018.2860019"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2019.2914900"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/MWSYM.2019.8701023"},{"key":"ref16","first-page":"1","article-title":"Power analysis and optimization for highspeed I\/O transceivers","author":"jung","year":"0","journal-title":"2011 IEEE 54th International Midwest Symposium on Circuits and Systems (MWSCAS)"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2014.2335426"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/MWSYM.2019.8701097"},{"key":"ref19","first-page":"249","article-title":"A lTB\/s 1 pJ\/b 6.4 mmi\/TB\/s QDR Inductive-Coupling Interface Between 65-nm CMOS Logic and Emulated 100-rnii DRAM","volume":"2","author":"miura","year":"2012","journal-title":"IEEE JETCAS"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2018.2865704"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/MWSYM.2018.8439430"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2017.8501894"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1145\/3130218.3130224"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/MWSYM.2017.8058801"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/MWSYM.2018.8439862"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/JETCAS.2018.2852624"},{"journal-title":"Three-Dimensional Integrated Circuit Design","year":"2009","author":"pavlidis","key":"ref1"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2018.2856890"}],"event":{"name":"2019 International 3D Systems Integration Conference (3DIC)","start":{"date-parts":[[2019,10,8]]},"location":"Sendai, Japan","end":{"date-parts":[[2019,10,10]]}},"container-title":["2019 International 3D Systems Integration Conference (3DIC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/9043388\/9058772\/09058859.pdf?arnumber=9058859","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,7,18]],"date-time":"2022-07-18T11:16:30Z","timestamp":1658142990000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9058859\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2019,10]]},"references-count":19,"URL":"https:\/\/doi.org\/10.1109\/3dic48104.2019.9058859","relation":{},"subject":[],"published":{"date-parts":[[2019,10]]}}}