{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,6,24]],"date-time":"2026-06-24T16:25:03Z","timestamp":1782318303955,"version":"3.54.5"},"reference-count":7,"publisher":"IEEE","license":[{"start":{"date-parts":[[2019,10,1]],"date-time":"2019-10-01T00:00:00Z","timestamp":1569888000000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2019,10,1]],"date-time":"2019-10-01T00:00:00Z","timestamp":1569888000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2019,10,1]],"date-time":"2019-10-01T00:00:00Z","timestamp":1569888000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2019,10]]},"DOI":"10.1109\/3dic48104.2019.9058873","type":"proceedings-article","created":{"date-parts":[[2020,4,10]],"date-time":"2020-04-10T05:10:46Z","timestamp":1586495446000},"page":"1-4","source":"Crossref","is-referenced-by-count":17,"title":["Low Temperature Cu to Cu Direct Bonding below 150 \u00b0C with Au Passivation Layer"],"prefix":"10.1109","author":[{"given":"Demin","family":"Liu","sequence":"first","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Po-Chih","family":"Chen","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Yi-Chieh","family":"Tsai","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Kuan-Neng","family":"Chen","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref4","first-page":"1","article-title":"3D integration by Cu-Cu thermo-compression bonding of extremely thinned bulk-Si die containing 10 (.im pitch through-Si vias","author":"swinnen","year":"0","journal-title":"2006 International Electron Devices Meeting"},{"key":"ref3","doi-asserted-by":"crossref","DOI":"10.1002\/9783527670109","author":"garrou","year":"2014","journal-title":"Handbook of 3D Integration Volume 3-3D Process Technology"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/LED.2013.2285702"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/LED.2006.873424"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1016\/0001-6160(82)90201-2"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1145\/981066.981091"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/3DIC.2016.7970009"}],"event":{"name":"2019 International 3D Systems Integration Conference (3DIC)","location":"Sendai, Japan","start":{"date-parts":[[2019,10,8]]},"end":{"date-parts":[[2019,10,10]]}},"container-title":["2019 International 3D Systems Integration Conference (3DIC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/9043388\/9058772\/09058873.pdf?arnumber=9058873","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2023,9,29]],"date-time":"2023-09-29T19:57:09Z","timestamp":1696017429000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9058873\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2019,10]]},"references-count":7,"URL":"https:\/\/doi.org\/10.1109\/3dic48104.2019.9058873","relation":{},"subject":[],"published":{"date-parts":[[2019,10]]}}}