{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,2,12]],"date-time":"2026-02-12T11:29:01Z","timestamp":1770895741433,"version":"3.50.1"},"reference-count":18,"publisher":"IEEE","license":[{"start":{"date-parts":[[2021,10,1]],"date-time":"2021-10-01T00:00:00Z","timestamp":1633046400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2021,10,1]],"date-time":"2021-10-01T00:00:00Z","timestamp":1633046400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/100000028","name":"Semiconductor Research Corporation (SRC)","doi-asserted-by":"publisher","id":[{"id":"10.13039\/100000028","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/100000185","name":"DARPA","doi-asserted-by":"publisher","id":[{"id":"10.13039\/100000185","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2021,10]]},"DOI":"10.1109\/3dic52383.2021.9687612","type":"proceedings-article","created":{"date-parts":[[2022,1,31]],"date-time":"2022-01-31T22:30:39Z","timestamp":1643668239000},"page":"1-5","source":"Crossref","is-referenced-by-count":6,"title":["Thermal Reliability Considerations of Resistive Synaptic Devices for 3D CIM System Performance"],"prefix":"10.1109","author":[{"given":"Ankit","family":"Kaul","sequence":"first","affiliation":[{"name":"School of Electrical and Computer Engineering, Georgia Institute of Technology,Atlanta,GA,30332"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yandong","family":"Luo","sequence":"additional","affiliation":[{"name":"School of Electrical and Computer Engineering, Georgia Institute of Technology,Atlanta,GA,30332"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Xiaochen","family":"Peng","sequence":"additional","affiliation":[{"name":"School of Electrical and Computer Engineering, Georgia Institute of Technology,Atlanta,GA,30332"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Shimeng","family":"Yu","sequence":"additional","affiliation":[{"name":"School of Electrical and Computer Engineering, Georgia Institute of Technology,Atlanta,GA,30332"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Muhannad S.","family":"Bakir","sequence":"additional","affiliation":[{"name":"School of Electrical and Computer Engineering, Georgia Institute of Technology,Atlanta,GA,30332"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM19573.2019.8993491"},{"key":"ref11","first-page":"1","article-title":"Het-erogeneous 3-d integration of multitier compute-in-memory accelerators: An electrical-thermal co-design","author":"peng","year":"2021","journal-title":"IEEE Trans Electron Devices"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1038\/nature22994"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/CICC48029.2020.9075901"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC32862.2020.00231"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1007\/978-3-319-44586-1_2"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2016.2642587"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/JXCDC.2021.3092436"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/3DIC.2016.7969996"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC19947.2020.9062957"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/ISOCC.2016.7799847"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1038\/srep13504"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1002\/aelm.201800143"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2014.2364742"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/IRPS46558.2021.9405210"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM13553.2020.9372120"},{"key":"ref1","article-title":"Very deep convolutional networks for large-scale image recognition","author":"simonyan","year":"2014","journal-title":"ArXiv Preprint"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2015.2492421"}],"event":{"name":"2021 IEEE International 3D Systems Integration Conference (3DIC)","location":"Raleigh, NC, USA","start":{"date-parts":[[2021,10,26]]},"end":{"date-parts":[[2021,10,29]]}},"container-title":["2021 IEEE International 3D Systems Integration Conference (3DIC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/9687597\/9687598\/09687612.pdf?arnumber=9687612","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,6,20]],"date-time":"2022-06-20T21:08:55Z","timestamp":1655759335000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9687612\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2021,10]]},"references-count":18,"URL":"https:\/\/doi.org\/10.1109\/3dic52383.2021.9687612","relation":{},"subject":[],"published":{"date-parts":[[2021,10]]}}}