{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,7,27]],"date-time":"2025-07-27T07:47:36Z","timestamp":1753602456767,"version":"3.28.0"},"reference-count":27,"publisher":"IEEE","license":[{"start":{"date-parts":[[2023,5,10]],"date-time":"2023-05-10T00:00:00Z","timestamp":1683676800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2023,5,10]],"date-time":"2023-05-10T00:00:00Z","timestamp":1683676800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2023,5,10]]},"DOI":"10.1109\/3dic57175.2023.10154923","type":"proceedings-article","created":{"date-parts":[[2023,6,26]],"date-time":"2023-06-26T18:07:49Z","timestamp":1687802869000},"page":"1-7","source":"Crossref","is-referenced-by-count":1,"title":["Review of Hybrid Integration Techniques for Integrating III-V Onto Silicon"],"prefix":"10.1109","author":[{"given":"Erik W.","family":"Masselink","sequence":"first","affiliation":[{"name":"Electro-Optical Systems Laboratory,Atlanta,USA"}]},{"given":"Andrew","family":"Stark","sequence":"additional","affiliation":[{"name":"Electro-Optical Systems Laboratory,Atlanta,USA"}]},{"given":"Benjamin B.","family":"Yang","sequence":"additional","affiliation":[{"name":"Georgia Tech Research Institute,Cybersecurity, Information Protection, and Hardware Evaluation Research Laboratory,Atlanta,USA"}]},{"given":"T. Robert","family":"Harris","sequence":"additional","affiliation":[{"name":"Electro-Optical Systems Laboratory,Atlanta,USA"}]}],"member":"263","reference":[{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/JSTQE.2016.2593637"},{"key":"ref12","first-page":"1","article-title":"Wafer-Scale Hybrid Integration of InP DFB Lasers on Si Photonics by Flip-Chip Bonding With sub-300 nm Alignment Precision","volume":"29","author":"marinins","year":"2023","journal-title":"IEEE Journal of Selected Topics in Quantum Electronics"},{"key":"ref15","article-title":"Self-Aligned Silicon Interposer Tiles and Silicon Bridges Using Positive Self-Alignment Structures and Rematable Me-chanically Flexible Interconnects","volume":"4","author":"yang","year":"2014","journal-title":"IEEE Transactions on Components Packaging and Manufacturing Technology"},{"key":"ref14","article-title":"High Density and Low-Temperature Interconnection Enabled by Mechanical Self-Alignment and Electroless Plating; High Density and Low-Temperature Interconnection Enabled by Mechanical Self-Alignment and Electroless Plating","author":"rajan","year":"0","journal-title":"2019 International 3D Systems Integration Conference (3DIC)"},{"key":"ref11","first-page":"1061","article-title":"A Four-Channel Silicon Photonic Carrier with Flip-Chip Integrated Semiconductor Optical Amplifier (SOA) Array Providing 10-dB Gain","author":"fuad","year":"0","journal-title":"2016 IEEE 66th Electronic Components and Technology Conference (ECTC) ECTC"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/JLT.2020.2972065"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.3390\/cryst10121163"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1016\/j.pquantelec.2019.05.002"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1117\/12.281219"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2021.3109913"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1117\/12.854403"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/GROUP4.2008.4638097"},{"key":"ref24","first-page":"122","article-title":"Vertical-cavity surface-emitting laser flip-chip bonding to silicon photonics chip","author":"wang","year":"0","journal-title":"2015 IEEE Optical Interconnects Conference (OI) OI"},{"key":"ref23","first-page":"14.3","article-title":"Photonic Integrated Circuits: Assessment of State-of-the-Art Manufacturing Industrial Base Capabilities and Needs (PICASSO'S MUSICIANS)","author":"stark","year":"2023","journal-title":"GOMACTech"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1364\/OE.24.016258"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/ICIPRM.2010.5516229"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2022.3207195"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1145\/3453688.3461515"},{"key":"ref21","article-title":"Silicon Photonics","author":"debray","year":"2021","journal-title":"Yole Developpement Tech Rep"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1109\/JLT.2006.885782"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/CLEOPR.2017.8118971"},{"journal-title":"FINEPLACER Lambda 2 Technical report","year":"0","key":"ref7"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/ICSJ.2013.6756091"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1088\/0268-1242\/28\/9\/094001"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/MNANO.2019.2891369"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1016\/j.yofte.2018.02.019"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/GROUP4.2012.6324123"}],"event":{"name":"2023 IEEE International 3D Systems Integration Conference (3DIC)","start":{"date-parts":[[2023,5,10]]},"location":"Cork, Ireland","end":{"date-parts":[[2023,5,12]]}},"container-title":["2023 IEEE International 3D Systems Integration Conference (3DIC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/10154896\/10154899\/10154923.pdf?arnumber=10154923","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2023,9,11]],"date-time":"2023-09-11T17:49:46Z","timestamp":1694454586000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10154923\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023,5,10]]},"references-count":27,"URL":"https:\/\/doi.org\/10.1109\/3dic57175.2023.10154923","relation":{},"subject":[],"published":{"date-parts":[[2023,5,10]]}}}