{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,3,4]],"date-time":"2026-03-04T16:41:00Z","timestamp":1772642460236,"version":"3.50.1"},"reference-count":6,"publisher":"IEEE","license":[{"start":{"date-parts":[[2023,5,10]],"date-time":"2023-05-10T00:00:00Z","timestamp":1683676800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2023,5,10]],"date-time":"2023-05-10T00:00:00Z","timestamp":1683676800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2023,5,10]]},"DOI":"10.1109\/3dic57175.2023.10155075","type":"proceedings-article","created":{"date-parts":[[2023,6,26]],"date-time":"2023-06-26T18:07:49Z","timestamp":1687802869000},"page":"1-4","source":"Crossref","is-referenced-by-count":8,"title":["Design Enablement of 3-Dies Stacked 3D-ICs Using Fine-Pitch Hybrid-Bonding and TSVs"],"prefix":"10.1109","author":[{"given":"Mohamed","family":"Naeim","sequence":"first","affiliation":[{"name":"Cadence Design System,San Jose,USA"}]},{"given":"Hanqi","family":"Yang","sequence":"additional","affiliation":[{"name":"Cadence Design System,San Jose,USA"}]},{"given":"Pinhong","family":"Chen","sequence":"additional","affiliation":[{"name":"Cadence Design System,San Jose,USA"}]},{"given":"Rong","family":"Bao","sequence":"additional","affiliation":[{"name":"Cadence Design System,San Jose,USA"}]},{"given":"Antoine","family":"Dekeyser","sequence":"additional","affiliation":[{"name":"Cadence Design System,San Jose,USA"}]},{"given":"Giuliano","family":"Sisto","sequence":"additional","affiliation":[{"name":"IMEC,Heverlee,Belgium"}]},{"given":"Moritz","family":"Brunion","sequence":"additional","affiliation":[{"name":"IMEC,Heverlee,Belgium"}]},{"given":"Rongmei","family":"Chen","sequence":"additional","affiliation":[{"name":"IMEC,Heverlee,Belgium"}]},{"given":"Geert","family":"Van der Plas","sequence":"additional","affiliation":[{"name":"IMEC,Heverlee,Belgium"}]},{"given":"Eric","family":"Beyne","sequence":"additional","affiliation":[{"name":"IMEC,Heverlee,Belgium"}]},{"given":"Dragomir","family":"Milojevic","sequence":"additional","affiliation":[{"name":"IMEC,Heverlee,Belgium"}]}],"member":"263","reference":[{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/MM.2022.3202254"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/3DIC48104.2019.9058901"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1145\/2872362.2872414"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1145\/3531437.3539702"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/MDAT.2016.2544837"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM19574.2021.9720614"}],"event":{"name":"2023 IEEE International 3D Systems Integration Conference (3DIC)","location":"Cork, Ireland","start":{"date-parts":[[2023,5,10]]},"end":{"date-parts":[[2023,5,12]]}},"container-title":["2023 IEEE International 3D Systems Integration Conference (3DIC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/10154896\/10154899\/10155075.pdf?arnumber=10155075","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2023,9,11]],"date-time":"2023-09-11T17:49:45Z","timestamp":1694454585000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10155075\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023,5,10]]},"references-count":6,"URL":"https:\/\/doi.org\/10.1109\/3dic57175.2023.10155075","relation":{},"subject":[],"published":{"date-parts":[[2023,5,10]]}}}