{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,11,11]],"date-time":"2025-11-11T13:58:26Z","timestamp":1762869506760,"version":"3.33.0"},"reference-count":7,"publisher":"IEEE","license":[{"start":{"date-parts":[[2024,9,25]],"date-time":"2024-09-25T00:00:00Z","timestamp":1727222400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2024,9,25]],"date-time":"2024-09-25T00:00:00Z","timestamp":1727222400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2024,9,25]]},"DOI":"10.1109\/3dic63395.2024.10830109","type":"proceedings-article","created":{"date-parts":[[2025,1,14]],"date-time":"2025-01-14T19:41:41Z","timestamp":1736883701000},"page":"1-5","source":"Crossref","is-referenced-by-count":2,"title":["A Novel Direct Transfer Bonding Process with Particle Less Tapes for Die to Wafer Integration"],"prefix":"10.1109","author":[{"given":"Tomoka","family":"Kirihata","sequence":"first","affiliation":[{"name":"LINTEC Corporation,Saitama,JAPAN"}]},{"given":"Masanori","family":"Yamagishi","sequence":"additional","affiliation":[{"name":"LINTEC Corporation,Saitama,JAPAN"}]},{"given":"Ichiro","family":"Sano","sequence":"additional","affiliation":[{"name":"TAZMO CO.,LTD.,Okayama,JAPAN"}]},{"given":"Haruka","family":"Morita","sequence":"additional","affiliation":[{"name":"TAZMO CO.,LTD.,Okayama,JAPAN"}]},{"given":"Yusuke","family":"Fumita","sequence":"additional","affiliation":[{"name":"LINTEC Corporation,Tokyo,JAPAN"}]},{"given":"Shinya","family":"Takyu","sequence":"additional","affiliation":[{"name":"LINTEC Corporation,Tokyo,JAPAN"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/EPTC.2015.7412409"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/ESTC60143.2024.10712144"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/ICEPT59018.2023.10491982"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/estc55720.2022.9939476"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC51906.2022.00062"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC51909.2023.00059"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1063\/1.4923357"}],"event":{"name":"2024 International 3D Systems Integration Conference (3DIC)","start":{"date-parts":[[2024,9,25]]},"location":"Sendai, Japan","end":{"date-parts":[[2024,9,27]]}},"container-title":["2024 International 3D Systems Integration Conference (3DIC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/10829990\/10830027\/10830109.pdf?arnumber=10830109","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,1,15]],"date-time":"2025-01-15T07:11:37Z","timestamp":1736925097000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10830109\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,9,25]]},"references-count":7,"URL":"https:\/\/doi.org\/10.1109\/3dic63395.2024.10830109","relation":{},"subject":[],"published":{"date-parts":[[2024,9,25]]}}}