{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,1,16]],"date-time":"2026-01-16T07:01:38Z","timestamp":1768546898837,"version":"3.49.0"},"reference-count":15,"publisher":"IEEE","license":[{"start":{"date-parts":[[2024,9,25]],"date-time":"2024-09-25T00:00:00Z","timestamp":1727222400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2024,9,25]],"date-time":"2024-09-25T00:00:00Z","timestamp":1727222400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2024,9,25]]},"DOI":"10.1109\/3dic63395.2024.10830178","type":"proceedings-article","created":{"date-parts":[[2025,1,14]],"date-time":"2025-01-14T19:41:41Z","timestamp":1736883701000},"page":"1-6","source":"Crossref","is-referenced-by-count":2,"title":["Process Development for a Novel Low Loss and Non-PFAS Photo Imageable Dielectric for RF Silicon Interposer Applications"],"prefix":"10.1109","author":[{"given":"Hamideh","family":"Jafarpoorchekab","sequence":"first","affiliation":[{"name":"Imec,Pathfinding Integration,Leuven,Belgium"}]},{"given":"Xiao","family":"Sun","sequence":"additional","affiliation":[{"name":"Imec,3DSIP Systems,Leuven,Belgium"}]},{"given":"Angel","family":"Uruena","sequence":"additional","affiliation":[{"name":"Imec,Advanced Patterning,Leuven,Belgium"}]},{"given":"Siddhartha","family":"Sinha","sequence":"additional","affiliation":[{"name":"Imec,Advanced RF communications,Leuven,Belgium"}]},{"given":"Nelson","family":"Pinho","sequence":"additional","affiliation":[{"name":"Imec,Pathfinding Integration,Leuven,Belgium"}]},{"given":"Andy","family":"Miller","sequence":"additional","affiliation":[{"name":"Imec,Compute System Scaling,Leuven,Belgium"}]},{"given":"Nadine","family":"Collaert","sequence":"additional","affiliation":[{"name":"Imec,Connected Computing,Leuven,Belgium"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/GCWkshps52748.2021.9682092"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/JMW.2020.3032891"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/MMM.2022.3148328"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/MMM.2019.2941632"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/ICCD50377.2020.00030"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/ESTC.2016.7764493"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC51906.2022.00009"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1007\/s11664-012-1944-6"},{"key":"ref9","first-page":"37","article-title":"Low Loss Photodielectric Materials for 5G HS\/HFApplications","volume-title":"IMAPSource Proceedings","author":"Hayes","year":"2019"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2011.5898543"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/ESTC.2014.6962789"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/EPTC.2017.8277536"},{"key":"ref13","article-title":"Efficient wet stripping of photoresist by UV flood exposure","author":"Diaz","year":"2024","journal-title":"presented at SPCC"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2022.3210375"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/OJAP.2020.3004533"}],"event":{"name":"2024 International 3D Systems Integration Conference (3DIC)","location":"Sendai, Japan","start":{"date-parts":[[2024,9,25]]},"end":{"date-parts":[[2024,9,27]]}},"container-title":["2024 International 3D Systems Integration Conference (3DIC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/10829990\/10830027\/10830178.pdf?arnumber=10830178","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,1,15]],"date-time":"2025-01-15T06:53:28Z","timestamp":1736924008000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10830178\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,9,25]]},"references-count":15,"URL":"https:\/\/doi.org\/10.1109\/3dic63395.2024.10830178","relation":{},"subject":[],"published":{"date-parts":[[2024,9,25]]}}}