{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,6,28]],"date-time":"2025-06-28T06:24:41Z","timestamp":1751091881016,"version":"3.33.0"},"reference-count":8,"publisher":"IEEE","license":[{"start":{"date-parts":[[2024,9,25]],"date-time":"2024-09-25T00:00:00Z","timestamp":1727222400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2024,9,25]],"date-time":"2024-09-25T00:00:00Z","timestamp":1727222400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2024,9,25]]},"DOI":"10.1109\/3dic63395.2024.10830233","type":"proceedings-article","created":{"date-parts":[[2025,1,14]],"date-time":"2025-01-14T19:41:41Z","timestamp":1736883701000},"page":"1-3","source":"Crossref","is-referenced-by-count":1,"title":["Face-Down and Heterogeneous Chip Bonding Technology on Waffle-Wafer for Bumpless Chip-an-Wafer (COW) Package"],"prefix":"10.1109","author":[{"given":"Yoshiaki","family":"Satake","sequence":"first","affiliation":[{"name":"Tokyo Institute of Technology,Kanagawa,Japan"}]},{"given":"Tatsuya","family":"Funaki","sequence":"additional","affiliation":[{"name":"Tokyo Institute of Technology,Kanagawa,Japan"}]},{"given":"Wataru","family":"Doi","sequence":"additional","affiliation":[{"name":"Murata Manufacturing Co., Ltd.,Kyoto,Japan"}]},{"given":"Hajime","family":"Kato","sequence":"additional","affiliation":[{"name":"Tokyo Institute of Technology,Kanagawa,Japan"}]},{"given":"Shogo","family":"Okita","sequence":"additional","affiliation":[{"name":"Tokyo Institute of Technology,Kanagawa,Japan"}]},{"given":"Takayuki","family":"Ohba","sequence":"additional","affiliation":[{"name":"Tokyo Institute of Technology,Kanagawa,Japan"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/ectc.2012.6248841"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2014.7047117"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC32696.2021.00040"},{"key":"ref4","article-title":"Development of the Waffle wafer for Bumpless Via- Last Chip-on-Wafer (COW) Integration","author":"Kato","year":"2023","journal-title":"DPS"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.23919\/ICEP61562.2024.10535645"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.23919\/ICEP58572.2023.10129700"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1016\/j.mee.2009.07.006"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2018.00295"}],"event":{"name":"2024 International 3D Systems Integration Conference (3DIC)","start":{"date-parts":[[2024,9,25]]},"location":"Sendai, Japan","end":{"date-parts":[[2024,9,27]]}},"container-title":["2024 International 3D Systems Integration Conference (3DIC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/10829990\/10830027\/10830233.pdf?arnumber=10830233","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,1,15]],"date-time":"2025-01-15T07:12:10Z","timestamp":1736925130000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10830233\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,9,25]]},"references-count":8,"URL":"https:\/\/doi.org\/10.1109\/3dic63395.2024.10830233","relation":{},"subject":[],"published":{"date-parts":[[2024,9,25]]}}}