{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,1,16]],"date-time":"2025-01-16T11:10:21Z","timestamp":1737025821336,"version":"3.33.0"},"reference-count":8,"publisher":"IEEE","license":[{"start":{"date-parts":[[2024,9,25]],"date-time":"2024-09-25T00:00:00Z","timestamp":1727222400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2024,9,25]],"date-time":"2024-09-25T00:00:00Z","timestamp":1727222400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2024,9,25]]},"DOI":"10.1109\/3dic63395.2024.10830250","type":"proceedings-article","created":{"date-parts":[[2025,1,14]],"date-time":"2025-01-14T19:41:41Z","timestamp":1736883701000},"page":"1-5","source":"Crossref","is-referenced-by-count":0,"title":["Clean Dicing: An Alternative Blade Dicing Technique for Minimising Particles in 3D Heterogeneous Integration"],"prefix":"10.1109","author":[{"given":"Akito","family":"Hiro","sequence":"first","affiliation":[{"name":"imec,Leuven,Belgium"}]},{"given":"Damien Jon","family":"Leech","sequence":"additional","affiliation":[{"name":"imec,Leuven,Belgium"}]},{"given":"Geert","family":"Schoofs","sequence":"additional","affiliation":[{"name":"imec,Leuven,Belgium"}]},{"given":"John","family":"Slabbekoorn","sequence":"additional","affiliation":[{"name":"imec,Leuven,Belgium"}]},{"given":"Alain","family":"Phommahaxay","sequence":"additional","affiliation":[{"name":"imec,Leuven,Belgium"}]},{"given":"Koen","family":"Kennes","sequence":"additional","affiliation":[{"name":"imec,Leuven,Belgium"}]},{"given":"Gerald","family":"Beyer","sequence":"additional","affiliation":[{"name":"imec,Leuven,Belgium"}]},{"given":"Eric","family":"Beyne","sequence":"additional","affiliation":[{"name":"imec,Leuven,Belgium"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC32696.2021.00075"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1016\/j.jmapro.2014.04.002"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2017.269"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC51529.2024.00015"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/ESTC60143.2024.10712068"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC51909.2023.00099"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1149\/2.006306ssl"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1149\/2162-8777\/ac7662"}],"event":{"name":"2024 International 3D Systems Integration Conference (3DIC)","start":{"date-parts":[[2024,9,25]]},"location":"Sendai, Japan","end":{"date-parts":[[2024,9,27]]}},"container-title":["2024 International 3D Systems Integration Conference (3DIC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/10829990\/10830027\/10830250.pdf?arnumber=10830250","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,1,15]],"date-time":"2025-01-15T06:53:31Z","timestamp":1736924011000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10830250\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,9,25]]},"references-count":8,"URL":"https:\/\/doi.org\/10.1109\/3dic63395.2024.10830250","relation":{},"subject":[],"published":{"date-parts":[[2024,9,25]]}}}