{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,6]],"date-time":"2024-09-06T03:34:29Z","timestamp":1725593669876},"reference-count":10,"publisher":"IEEE","license":[{"start":{"date-parts":[[2019,11,1]],"date-time":"2019-11-01T00:00:00Z","timestamp":1572566400000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2019,11,1]],"date-time":"2019-11-01T00:00:00Z","timestamp":1572566400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2019,11,1]],"date-time":"2019-11-01T00:00:00Z","timestamp":1572566400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2019,11]]},"DOI":"10.1109\/a-sscc47793.2019.9056919","type":"proceedings-article","created":{"date-parts":[[2020,4,7]],"date-time":"2020-04-07T02:38:37Z","timestamp":1586227117000},"page":"125-128","source":"Crossref","is-referenced-by-count":4,"title":["Drop-In Energy-Performance Range Extension in Microcontrollers Beyond VDD Scaling"],"prefix":"10.1109","author":[{"given":"Saurabh","family":"Jain","sequence":"first","affiliation":[]},{"given":"Longyang","family":"Lin","sequence":"additional","affiliation":[]},{"given":"Massimo","family":"Alioto","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/VLSI.Design.2009.54"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2017.2768406"},{"key":"ref10","article-title":"A modular 1mm3 die-stacked sensing platform with optical communication and multi-modal harvesting","author":"lee","year":"2012","journal-title":"ISSCC"},{"journal-title":"DSP Architecture Design Essentials","year":"2011","author":"markovic","key":"ref6"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/CICC.2010.5617629"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.23919\/VLSIC.2017.8008529"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1145\/611817.611845"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/MM.2017.3711645"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2017.2693241"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1007\/978-3-319-51482-6"}],"event":{"name":"2019 IEEE Asian Solid-State Circuits Conference (A-SSCC)","start":{"date-parts":[[2019,11,4]]},"location":"Macau, Macao","end":{"date-parts":[[2019,11,6]]}},"container-title":["2019 IEEE Asian Solid-State Circuits Conference (A-SSCC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/9043348\/9056889\/09056919.pdf?arnumber=9056919","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,7,17]],"date-time":"2022-07-17T21:48:47Z","timestamp":1658094527000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9056919\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2019,11]]},"references-count":10,"URL":"https:\/\/doi.org\/10.1109\/a-sscc47793.2019.9056919","relation":{},"subject":[],"published":{"date-parts":[[2019,11]]}}}