{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,10,29]],"date-time":"2024-10-29T10:51:12Z","timestamp":1730199072657,"version":"3.28.0"},"reference-count":11,"publisher":"IEEE","license":[{"start":{"date-parts":[[2019,11,1]],"date-time":"2019-11-01T00:00:00Z","timestamp":1572566400000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2019,11,1]],"date-time":"2019-11-01T00:00:00Z","timestamp":1572566400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2019,11,1]],"date-time":"2019-11-01T00:00:00Z","timestamp":1572566400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2019,11]]},"DOI":"10.1109\/a-sscc47793.2019.9056949","type":"proceedings-article","created":{"date-parts":[[2020,4,6]],"date-time":"2020-04-06T22:38:37Z","timestamp":1586212717000},"page":"305-308","source":"Crossref","is-referenced-by-count":2,"title":["T\/R-Switch Composed of 3 High-Voltage MOSFETs with 12.1 \u00b5W Consumption that can Perform Per-channel TX to RX Self-Loopback AC Tests for 3D Ultrasound Imaging with 3072-channel Transceiver"],"prefix":"10.1109","author":[{"given":"Shinya","family":"Kajiyama","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yutaka","family":"Igarashi","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Toru","family":"Yazaki","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yusaku","family":"Katsube","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Takuma","family":"Nishimoto","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Tatsuo","family":"Nakagawa","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yohei","family":"Nakamura","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yoshihiro","family":"Hayashi","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Taizo","family":"Yamawaki","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/ISPSD.2016.7520866"},{"key":"ref3","first-page":"78","article-title":"Digitally controlled highvoltage analog switch array for medical ultrasound applications in thin-layer silicon-on-insulator process","author":"dufort","year":"0","journal-title":"IEEE Int'l SOI Conference"},{"key":"ref10","first-page":"359","article-title":"A New 80V 32x32ch Low Loss Multiplexer LSI for a 3D Ultrasound Imaging System","author":"hara","year":"2005","journal-title":"IEEE ISPSD"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2010.2096113"},{"key":"ref11","first-page":"271","article-title":"HV Floating Switch Matrix with Parachute Safety Driving for 3D Echography Systems","author":"ricotti","year":"2018","journal-title":"ESSCIRC"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/CICC.2006.320856"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2015.2495723"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1049\/el.2014.1906"},{"key":"ref2","first-page":"2065","article-title":"A Reconfigurable Ultrasound Transceiver ASIC With 24 × 40 Elements for 3-D Carotid Artery Imaging","volume":"53","author":"kang","year":"2018","journal-title":"IEEE JSSC"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TUFFC.2018.2837127"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2019.2921697"}],"event":{"name":"2019 IEEE Asian Solid-State Circuits Conference (A-SSCC)","start":{"date-parts":[[2019,11,4]]},"location":"Macau, Macao","end":{"date-parts":[[2019,11,6]]}},"container-title":["2019 IEEE Asian Solid-State Circuits Conference (A-SSCC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/9043348\/9056889\/09056949.pdf?arnumber=9056949","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,7,17]],"date-time":"2022-07-17T17:47:11Z","timestamp":1658080031000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9056949\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2019,11]]},"references-count":11,"URL":"https:\/\/doi.org\/10.1109\/a-sscc47793.2019.9056949","relation":{},"subject":[],"published":{"date-parts":[[2019,11]]}}}