{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,7,1]],"date-time":"2025-07-01T06:25:19Z","timestamp":1751351119583},"reference-count":7,"publisher":"IEEE","license":[{"start":{"date-parts":[[2023,11,5]],"date-time":"2023-11-05T00:00:00Z","timestamp":1699142400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2023,11,5]],"date-time":"2023-11-05T00:00:00Z","timestamp":1699142400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2023,11,5]]},"DOI":"10.1109\/a-sscc58667.2023.10347909","type":"proceedings-article","created":{"date-parts":[[2023,12,18]],"date-time":"2023-12-18T19:25:44Z","timestamp":1702927544000},"page":"1-3","source":"Crossref","is-referenced-by-count":1,"title":["A 10TFLOPS Datacenter-Oriented GPU with 4-Corner Stacked 64GB Memory by The Means of 2.5D Packaging Technology"],"prefix":"10.1109","author":[{"given":"Shuang","family":"Wang","sequence":"first","affiliation":[{"name":"Tsinqhua University,Beijing,China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Weiliang","family":"Chen","sequence":"additional","affiliation":[{"name":"Tsinqhua University,Beijing,China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Xueqing","family":"Li","sequence":"additional","affiliation":[{"name":"Tsinqhua University,Beijing,China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Leibo","family":"Liu","sequence":"additional","affiliation":[{"name":"Tsinqhua University,Beijing,China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Huazhong","family":"Yang","sequence":"additional","affiliation":[{"name":"Tsinqhua University,Beijing,China"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/jproc.2008.917757"},{"key":"ref2","article-title":"The A100 Datacenter GPU and Ampere Architecture","author":"Jack","year":"2021","journal-title":"ISSCC"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC19947.2020.9062947"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC32696.2021.00028"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.23919\/DATE51398.2021.9474021"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2017.8203849"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/EuroSimE54907.2022.9758914"}],"event":{"name":"2023 IEEE Asian Solid-State Circuits Conference (A-SSCC)","start":{"date-parts":[[2023,11,5]]},"location":"Haikou, China","end":{"date-parts":[[2023,11,8]]}},"container-title":["2023 IEEE Asian Solid-State Circuits Conference (A-SSCC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/10347557\/10347908\/10347909.pdf?arnumber=10347909","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,1,12]],"date-time":"2024-01-12T02:35:54Z","timestamp":1705026954000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10347909\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023,11,5]]},"references-count":7,"URL":"https:\/\/doi.org\/10.1109\/a-sscc58667.2023.10347909","relation":{},"subject":[],"published":{"date-parts":[[2023,11,5]]}}}