{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,2,21]],"date-time":"2025-02-21T01:49:54Z","timestamp":1740102594330,"version":"3.37.3"},"reference-count":7,"publisher":"IEEE","license":[{"start":{"date-parts":[[2023,11,5]],"date-time":"2023-11-05T00:00:00Z","timestamp":1699142400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2023,11,5]],"date-time":"2023-11-05T00:00:00Z","timestamp":1699142400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/100000185","name":"Defense Advanced Research Projects Agency (DARPA)","doi-asserted-by":"publisher","award":["HR001121C0134"],"award-info":[{"award-number":["HR001121C0134"]}],"id":[{"id":"10.13039\/100000185","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2023,11,5]]},"DOI":"10.1109\/a-sscc58667.2023.10347978","type":"proceedings-article","created":{"date-parts":[[2023,12,18]],"date-time":"2023-12-18T19:25:44Z","timestamp":1702927544000},"page":"1-3","source":"Crossref","is-referenced-by-count":1,"title":["3D-ISC: A 65nm 3D Compatible In-Sensor Computing Accelerator with Reconfigurable Tile Architecture for Real-Time DVS Data Compression"],"prefix":"10.1109","author":[{"given":"Gokul","family":"Krishnan","sequence":"first","affiliation":[{"name":"Arizona State University"}]},{"given":"Gopikrishnan Raveendran","family":"Nair","sequence":"additional","affiliation":[{"name":"Arizona State University"}]},{"given":"Jonghyun","family":"Oh","sequence":"additional","affiliation":[{"name":"Columbia University"}]},{"given":"Anupreetham","family":"Anupreetham","sequence":"additional","affiliation":[{"name":"Arizona State University"}]},{"given":"Pragnya Sudershan","family":"Nalla","sequence":"additional","affiliation":[{"name":"Arizona State University"}]},{"given":"Ahmed","family":"Hassan","sequence":"additional","affiliation":[{"name":"Arizona State University"}]},{"given":"Injune","family":"Yeo","sequence":"additional","affiliation":[{"name":"Arizona State University"}]},{"given":"Kishore","family":"Kasichainula","sequence":"additional","affiliation":[{"name":"Arizona State University"}]},{"given":"Jae-sun","family":"Seo","sequence":"additional","affiliation":[{"name":"Arizona State University"}]},{"given":"Mingoo","family":"Seok","sequence":"additional","affiliation":[{"name":"Columbia University"}]},{"given":"Yu","family":"Cao","sequence":"additional","affiliation":[{"name":"Arizona State University"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/isscc42614.2022.9731545"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC19947.2020.9062985"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42613.2021.9365788"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42613.2021.9365958"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/A-SSCC56115.2022.9980613"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2022.3197516"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/IEEECONF56349.2022.10051946"}],"event":{"name":"2023 IEEE Asian Solid-State Circuits Conference (A-SSCC)","start":{"date-parts":[[2023,11,5]]},"location":"Haikou, China","end":{"date-parts":[[2023,11,8]]}},"container-title":["2023 IEEE Asian Solid-State Circuits Conference (A-SSCC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/10347557\/10347908\/10347978.pdf?arnumber=10347978","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,1,12]],"date-time":"2024-01-12T03:08:11Z","timestamp":1705028891000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10347978\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023,11,5]]},"references-count":7,"URL":"https:\/\/doi.org\/10.1109\/a-sscc58667.2023.10347978","relation":{},"subject":[],"published":{"date-parts":[[2023,11,5]]}}}