{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,1,15]],"date-time":"2026-01-15T21:56:24Z","timestamp":1768514184935,"version":"3.49.0"},"reference-count":5,"publisher":"IEEE","license":[{"start":{"date-parts":[[2024,11,18]],"date-time":"2024-11-18T00:00:00Z","timestamp":1731888000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2024,11,18]],"date-time":"2024-11-18T00:00:00Z","timestamp":1731888000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100012166","name":"National Key Research and Development Program of China","doi-asserted-by":"publisher","id":[{"id":"10.13039\/501100012166","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2024,11,18]]},"DOI":"10.1109\/a-sscc60305.2024.10848882","type":"proceedings-article","created":{"date-parts":[[2025,1,28]],"date-time":"2025-01-28T18:32:10Z","timestamp":1738089130000},"page":"1-3","source":"Crossref","is-referenced-by-count":1,"title":["A 428.4mW 6.78Mbps\/3.61Mbps Up\/Down Data Rate Wireless Chipset with TinyAI Regulation"],"prefix":"10.1109","author":[{"given":"Yunfang","family":"Zhang","sequence":"first","affiliation":[{"name":"Shanghai Jiao Tong University,Shanghai,China"}]},{"given":"Zhijie","family":"Lin","sequence":"additional","affiliation":[{"name":"Shanghai Jiao Tong University,Shanghai,China"}]},{"given":"Peiyi","family":"Zhou","sequence":"additional","affiliation":[{"name":"Shanghai Jiao Tong University,Shanghai,China"}]},{"given":"Jie","family":"Zhang","sequence":"additional","affiliation":[{"name":"Xi’an Jiaotong University,Xi’an,China"}]},{"given":"Zhezhi","family":"He","sequence":"additional","affiliation":[{"name":"Shanghai Jiao Tong University,Shanghai,China"}]},{"given":"Hong","family":"Zhang","sequence":"additional","affiliation":[{"name":"Xi’an Jiaotong University,Xi’an,China"}]},{"given":"Yongfu","family":"Li","sequence":"additional","affiliation":[{"name":"Shanghai Jiao Tong University,Shanghai,China"}]},{"given":"Yong","family":"Lian","sequence":"additional","affiliation":[{"name":"Shanghai Jiao Tong University,Shanghai,China"}]},{"given":"Yang","family":"Zhao","sequence":"additional","affiliation":[{"name":"Shanghai Jiao Tong University,Shanghai,China"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2022.3197415"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2018.2867293"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2016.2600864"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2020.3005772"},{"key":"ref5","article-title":"33.7 A Frequency-Splitting-Based Wireless Power and Data Transfer IC for Neural Prostheses with Simultaneous 115 mW Power and 2.5 Mb\/s Forward Data Delivery","author":"Park","year":"2021","journal-title":"ISSCC"}],"event":{"name":"2024 IEEE Asian Solid-State Circuits Conference (A-SSCC)","location":"Hiroshima, Japan","start":{"date-parts":[[2024,11,18]]},"end":{"date-parts":[[2024,11,21]]}},"container-title":["2024 IEEE Asian Solid-State Circuits Conference (A-SSCC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/10848544\/10848535\/10848882.pdf?arnumber=10848882","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,4,23]],"date-time":"2025-04-23T17:50:22Z","timestamp":1745430622000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10848882\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,11,18]]},"references-count":5,"URL":"https:\/\/doi.org\/10.1109\/a-sscc60305.2024.10848882","relation":{},"subject":[],"published":{"date-parts":[[2024,11,18]]}}}