{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,1,30]],"date-time":"2025-01-30T05:34:41Z","timestamp":1738215281458,"version":"3.34.0"},"reference-count":0,"publisher":"IEEE","license":[{"start":{"date-parts":[[2024,11,18]],"date-time":"2024-11-18T00:00:00Z","timestamp":1731888000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2024,11,18]],"date-time":"2024-11-18T00:00:00Z","timestamp":1731888000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100017607","name":"Shenzhen Fundamental Research Program","doi-asserted-by":"publisher","id":[{"id":"10.13039\/501100017607","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2024,11,18]]},"DOI":"10.1109\/a-sscc60305.2024.10849005","type":"proceedings-article","created":{"date-parts":[[2025,1,28]],"date-time":"2025-01-28T18:32:10Z","timestamp":1738089130000},"page":"1-3","source":"Crossref","is-referenced-by-count":0,"title":["A 4-Phase Integrated Voltage Regulator with In-Package Inductors Achieving 89.0% Peak Efficiency and 65% Droop Improvement for 6A\/2ns Transient"],"prefix":"10.1109","author":[{"given":"Kai","family":"Yuan","sequence":"first","affiliation":[{"name":"Chinese University of Hong Kong,Shenzhen,China"}]},{"given":"Chenzhou","family":"Ding","sequence":"additional","affiliation":[{"name":"Chinese University of Hong Kong,Shenzhen,China"}]},{"given":"Junmin","family":"Jiang","sequence":"additional","affiliation":[{"name":"Southern University of Science and Technology,Shenzhen,China"}]},{"given":"Tiantian","family":"Tang","sequence":"additional","affiliation":[{"name":"Southern University of Science and Technology,Shenzhen,China"}]},{"given":"Junyi","family":"Ruan","sequence":"additional","affiliation":[{"name":"Chinese University of Hong Kong,Shenzhen,China"}]},{"given":"Yelei","family":"Xie","sequence":"additional","affiliation":[{"name":"Sanechips Technology Co. Ltd,Shenzhen,China"}]},{"given":"Faen","family":"Liu","sequence":"additional","affiliation":[{"name":"Sanechips Technology Co. Ltd,Shenzhen,China"}]},{"given":"Shuguo","family":"Jiang","sequence":"additional","affiliation":[{"name":"Sanechips Technology Co. Ltd,Shenzhen,China"}]},{"given":"Tao","family":"Liu","sequence":"additional","affiliation":[{"name":"Sanechips Technology Co. Ltd,Shenzhen,China"}]},{"given":"Ka Nang","family":"Leung","sequence":"additional","affiliation":[{"name":"Chinese University of Hong Kong,Hong Kong,China"}]},{"given":"Xun","family":"Liu","sequence":"additional","affiliation":[{"name":"Chinese University of Hong Kong,Shenzhen,China"}]}],"member":"263","event":{"name":"2024 IEEE Asian Solid-State Circuits Conference (A-SSCC)","start":{"date-parts":[[2024,11,18]]},"location":"Hiroshima, Japan","end":{"date-parts":[[2024,11,21]]}},"container-title":["2024 IEEE Asian Solid-State Circuits Conference (A-SSCC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/10848544\/10848535\/10849005.pdf?arnumber=10849005","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,1,28]],"date-time":"2025-01-28T18:32:23Z","timestamp":1738089143000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10849005\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,11,18]]},"references-count":0,"URL":"https:\/\/doi.org\/10.1109\/a-sscc60305.2024.10849005","relation":{},"subject":[],"published":{"date-parts":[[2024,11,18]]}}}