{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,1,30]],"date-time":"2025-01-30T06:13:12Z","timestamp":1738217592091,"version":"3.34.0"},"reference-count":11,"publisher":"IEEE","license":[{"start":{"date-parts":[[2024,11,18]],"date-time":"2024-11-18T00:00:00Z","timestamp":1731888000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2024,11,18]],"date-time":"2024-11-18T00:00:00Z","timestamp":1731888000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/100006422","name":"Cadence Design Systems","doi-asserted-by":"publisher","id":[{"id":"10.13039\/100006422","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/100007053","name":"Mentor Graphics","doi-asserted-by":"publisher","id":[{"id":"10.13039\/100007053","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/100016320","name":"Keysight Technologies","doi-asserted-by":"publisher","id":[{"id":"10.13039\/100016320","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2024,11,18]]},"DOI":"10.1109\/a-sscc60305.2024.10849327","type":"proceedings-article","created":{"date-parts":[[2025,1,28]],"date-time":"2025-01-28T18:32:10Z","timestamp":1738089130000},"page":"1-3","source":"Crossref","is-referenced-by-count":0,"title":["35-60GHz Switchless IF Bi-Directional Amplifier Using 65nm CMOS for 300GHz-Band Transceivers"],"prefix":"10.1109","author":[{"given":"Abanob","family":"Shehata","sequence":"first","affiliation":[{"name":"Tokyo Institute of Technology,Tokyo,Japan"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Hans","family":"Herdian","sequence":"additional","affiliation":[{"name":"Tokyo Institute of Technology,Tokyo,Japan"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Chun","family":"Wang","sequence":"additional","affiliation":[{"name":"Tokyo Institute of Technology,Tokyo,Japan"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Chenxin","family":"Liu","sequence":"additional","affiliation":[{"name":"Tokyo Institute of Technology,Tokyo,Japan"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Kazuaki","family":"Kunihiro","sequence":"additional","affiliation":[{"name":"Tokyo Institute of Technology,Tokyo,Japan"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Hiroyuki","family":"Sakai","sequence":"additional","affiliation":[{"name":"Tokyo Institute of Technology,Tokyo,Japan"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Atsushi","family":"Shirane","sequence":"additional","affiliation":[{"name":"Tokyo Institute of Technology,Tokyo,Japan"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Kenichi","family":"Okada","sequence":"additional","affiliation":[{"name":"Tokyo Institute of Technology,Tokyo,Japan"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2013.6724649"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2017.7870294"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2022.3179166"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2016.2549527"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.23919\/EuMC.2011.6101839"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/CICC.2011.6055322"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/LED.2013.2274452"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/LMWC.2017.2661678"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2019.2938160"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2013.2279573"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/LMWC.2021.3123573"}],"event":{"name":"2024 IEEE Asian Solid-State Circuits Conference (A-SSCC)","start":{"date-parts":[[2024,11,18]]},"location":"Hiroshima, Japan","end":{"date-parts":[[2024,11,21]]}},"container-title":["2024 IEEE Asian Solid-State Circuits Conference (A-SSCC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/10848544\/10848535\/10849327.pdf?arnumber=10849327","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,1,29]],"date-time":"2025-01-29T18:44:32Z","timestamp":1738176272000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10849327\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,11,18]]},"references-count":11,"URL":"https:\/\/doi.org\/10.1109\/a-sscc60305.2024.10849327","relation":{},"subject":[],"published":{"date-parts":[[2024,11,18]]}}}