{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,3,11]],"date-time":"2026-03-11T16:48:23Z","timestamp":1773247703428,"version":"3.50.1"},"reference-count":9,"publisher":"IEEE","license":[{"start":{"date-parts":[[2024,11,18]],"date-time":"2024-11-18T00:00:00Z","timestamp":1731888000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2024,11,18]],"date-time":"2024-11-18T00:00:00Z","timestamp":1731888000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2024,11,18]]},"DOI":"10.1109\/a-sscc60305.2024.10849341","type":"proceedings-article","created":{"date-parts":[[2025,1,28]],"date-time":"2025-01-28T18:32:10Z","timestamp":1738089130000},"page":"1-3","source":"Crossref","is-referenced-by-count":2,"title":["A 13-34 TOPS\/W Edge-AI Processor Featuring Booth-Value-Confined Accelerator, Near-Memory Computing, and Contiguity-Aware Mapping"],"prefix":"10.1109","author":[{"given":"Quan","family":"Cheng","sequence":"first","affiliation":[{"name":"Kyoto University,Japan"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Longyang","family":"Lin","sequence":"additional","affiliation":[{"name":"Southern University of Science and Technology,China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Mingqiang","family":"Huang","sequence":"additional","affiliation":[{"name":"Southern University of Science and Technology,China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Qiufeng","family":"Li","sequence":"additional","affiliation":[{"name":"Southern University of Science and Technology,China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Zhengke","family":"Yang","sequence":"additional","affiliation":[{"name":"Southern University of Science and Technology,China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Liuyao","family":"Dai","sequence":"additional","affiliation":[{"name":"Southern University of Science and Technology,China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Hao","family":"Yu","sequence":"additional","affiliation":[{"name":"Southern University of Science and Technology,China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yu-Jen","family":"Chen","sequence":"additional","affiliation":[{"name":"University of Notre Dame,USA"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yiyu","family":"Shi","sequence":"additional","affiliation":[{"name":"University of Notre Dame,USA"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Masanori","family":"Hashimoto","sequence":"additional","affiliation":[{"name":"Kyoto University,Japan"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD57390.2023.10323637"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2022.3178474"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2022.3141050"},{"key":"ref4","first-page":"466","article-title":"A 28 nm 15.59 \u03bc J\/Token Full-Digital Bitline-Transpose CIM-Based Sparse Transformer Accelerator with Pipeline\/Parallel Reconfigurable Modes","volume-title":"ISSCC","author":"Tu"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2022.3213521"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/isscc42615.2023.10067774"},{"key":"ref7","first-page":"21","article-title":"22.1 A 12.4TOPS\/W @ 136GOPS AI-loT System-on-Chip with 16 RISC-V, 2-to-8b Precision-Scalable DNN Acceleration and 30%-Boost Adaptive Body Biasing","author":"Conti","year":"2023","journal-title":"ISSCC"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2022.3152921"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/CVPR.2019.01099"}],"event":{"name":"2024 IEEE Asian Solid-State Circuits Conference (A-SSCC)","location":"Hiroshima, Japan","start":{"date-parts":[[2024,11,18]]},"end":{"date-parts":[[2024,11,21]]}},"container-title":["2024 IEEE Asian Solid-State Circuits Conference (A-SSCC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/10848544\/10848535\/10849341.pdf?arnumber=10849341","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,1,29]],"date-time":"2025-01-29T18:44:34Z","timestamp":1738176274000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10849341\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,11,18]]},"references-count":9,"URL":"https:\/\/doi.org\/10.1109\/a-sscc60305.2024.10849341","relation":{},"subject":[],"published":{"date-parts":[[2024,11,18]]}}}