{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,7,31]],"date-time":"2026-07-31T22:28:21Z","timestamp":1785536901256,"version":"3.56.0"},"reference-count":28,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","license":[{"start":{"date-parts":[[2014,12,1]],"date-time":"2014-12-01T00:00:00Z","timestamp":1417392000000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Access"],"published-print":{"date-parts":[[2014,12]]},"DOI":"10.1109\/access.2014.2311810","type":"journal-article","created":{"date-parts":[[2014,3,13]],"date-time":"2014-03-13T18:02:36Z","timestamp":1394733756000},"page":"234-242","source":"Crossref","is-referenced-by-count":543,"title":["3D Printing for the Rapid Prototyping of Structural Electronics"],"prefix":"10.1109","volume":"2","author":[{"given":"Eric","family":"Macdonald","sequence":"first","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Rudy","family":"Salas","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"David","family":"Espalin","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Mireya","family":"Perez","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Efrain","family":"Aguilera","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Dan","family":"Muse","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Ryan B.","family":"Wicker","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1080\/17452759.2012.721119"},{"key":"ref11","author":"wicker","year":"2013","journal-title":"Extrusion-based additive manufacturing system for 3D structural electronics electromagnetic and electromechanical components\/devices"},{"key":"ref12","author":"wicker","year":"2013","journal-title":"Methods and systems for embedding filaments in 3D structures structural components and structural electronic electromagnetic and electromechanical components\/devices"},{"key":"ref13","author":"wicker","year":"2013","journal-title":"Methods and systems for connecting inter-layer conductors and components in 3D structures structural components and structural electronic electromagnetic and electromechanical components\/devices"},{"key":"ref14","first-page":"272","article-title":"Manufacturing mechatronics using thermal spray shape deposition","author":"beck","year":"0","journal-title":"Proc Solid Freeform Fabrication Symp"},{"key":"ref15","author":"prinz","year":"1994","journal-title":"Electronic packages and smart structures formed by thermal spray deposition"},{"key":"ref16","first-page":"31","article-title":"Shape deposition manufacturing of wearable computers","author":"weiss","year":"0","journal-title":"Proc Solid Freeform Fabrication Symp"},{"key":"ref17","first-page":"12","article-title":"Layered manufacturing with embedded components: Process planning considerations","author":"cham","year":"0","journal-title":"Proc ASME DETC"},{"key":"ref18","article-title":"Rapid prototyping of high density circuitry","author":"palmer","year":"0","journal-title":"Proc Rapid Prototyping Manuf Conf"},{"key":"ref19","first-page":"1","article-title":"Expanding rapid prototyping for electronic systems integration of arbitrary form","author":"lopes","year":"0","journal-title":"Proc Solid Freeform Fabrication Symp"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1016\/j.matlet.2012.02.032"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1108\/13552540710719181"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.3390\/ma4060963"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1016\/j.ijmachtools.2006.09.022"},{"key":"ref6","first-page":"940","article-title":"Structural electronics through additive manufacturing and micro-dispensing","author":"olivas","year":"0","journal-title":"Proc IMAPS Nat Conf"},{"key":"ref5","first-page":"575","article-title":"Integrated layered manufacturing of a novel wireless motion sensor system with GPS","author":"navarrete","year":"0","journal-title":"Proc Solid Freeform Fabrication Symp"},{"key":"ref8","first-page":"287","article-title":"Realizing 3D interconnected direct write electronics within smart stereolithography structures","author":"palmer","year":"0","journal-title":"Proc ASME Int Mech Eng Congr Exposit"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1108\/13552541211212113"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1007\/s001700050108"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1007\/s00170-014-5717-7"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1016\/S0890-6955(97)00137-5"},{"key":"ref20","first-page":"575","article-title":"Integrated layered manufacturing of a novel wireless motion sensor system with GPS","author":"navarrete","year":"0","journal-title":"Proc Solid Freeform Fabrication Symp"},{"key":"ref22","first-page":"644","article-title":"Expanding rapid prototyping for electronic systems integration of arbitrary form","author":"lopes","year":"0","journal-title":"Proc Solid Freeform Fabrication Symp"},{"key":"ref21","author":"palmer","year":"2008","journal-title":"Methods and systems for rapid prototyping of high density circuits"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1557\/mrs2007.11"},{"key":"ref23","first-page":"503","article-title":"Printing embedded circuits","author":"periard","year":"0","journal-title":"Proc Solid Freeform Fabrication Symp"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1007\/s00170-009-2181-x"},{"key":"ref25","first-page":"1","article-title":"Structurally embedded electrical systems using ultrasonic consolidation (UC)","author":"siggard","year":"0","journal-title":"Proc Solid Freeform Fabrication Symp"}],"container-title":["IEEE Access"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/6287639\/6705689\/06766751.pdf?arnumber=6766751","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,1,12]],"date-time":"2022-01-12T16:17:58Z","timestamp":1642004278000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/6766751\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2014,12]]},"references-count":28,"URL":"https:\/\/doi.org\/10.1109\/access.2014.2311810","relation":{},"ISSN":["2169-3536"],"issn-type":[{"value":"2169-3536","type":"electronic"}],"subject":[],"published":{"date-parts":[[2014,12]]}}}