{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,12,18]],"date-time":"2025-12-18T19:48:09Z","timestamp":1766087289370,"version":"3.37.3"},"reference-count":35,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","license":[{"start":{"date-parts":[[2018,1,1]],"date-time":"2018-01-01T00:00:00Z","timestamp":1514764800000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/OAPA.html"}],"funder":[{"name":"National Program on Key Basic Research Project (\u201c973\u201d Program) of China","award":["2015CB057203"],"award-info":[{"award-number":["2015CB057203"]}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["51675211"],"award-info":[{"award-number":["51675211"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"name":"National High Technology Research and Development Program (\u201c863\u201d Program) of China","award":["2015AA033304"],"award-info":[{"award-number":["2015AA033304"]}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Access"],"published-print":{"date-parts":[[2018]]},"DOI":"10.1109\/access.2018.2842199","type":"journal-article","created":{"date-parts":[[2018,5,31]],"date-time":"2018-05-31T18:48:45Z","timestamp":1527792525000},"page":"33099-33110","source":"Crossref","is-referenced-by-count":7,"title":["Morphology Evaluation of Microelectronic Packaging Substrates Using Shadow Moir\u00e9 Technique"],"prefix":"10.1109","volume":"6","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-0756-9051","authenticated-orcid":false,"given":"Fulong","family":"Zhu","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Xinxin","family":"Lin","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Wei","family":"Zhang","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Jiajie","family":"Fan","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Sheng","family":"Liu","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref33","doi-asserted-by":"publisher","DOI":"10.1117\/1.1592803"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.1007\/BF02322552"},{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1109\/6040.803456"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1115\/1.1347987"},{"journal-title":"Two-Dimensional Phase Unwrapping Theory Algorithms and Software","year":"1998","author":"ghiglia","key":"ref35"},{"key":"ref34","doi-asserted-by":"crossref","first-page":"349","DOI":"10.1016\/S0079-6638(08)70178-1","article-title":"V phase-measurement interferometry techniques","volume":"26","author":"creath","year":"1988","journal-title":"Progress in Optics"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1080\/713855954"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1016\/S0167-6636(03)00076-0"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/6144.926397"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1115\/1.1286315"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1115\/1.2792619"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1115\/1.2792146"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1016\/S0026-2714(03)00057-X"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/6104.873247"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/95.554938"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1016\/S0026-2714(02)00283-4"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1016\/S0030-4018(01)01038-0"},{"key":"ref4","doi-asserted-by":"crossref","first-page":"43","DOI":"10.1111\/j.1747-1567.1994.tb02385.x","article-title":"High sensitivity Moiré","volume":"18","author":"post","year":"1994","journal-title":"Exp Techn"},{"key":"ref27","first-page":"15","article-title":"A projection Moiré system for measuring warpage with case studies","volume":"25","author":"ding","year":"2005","journal-title":"Int J Microcircuits Electron Packag"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1364\/AO.9.000942"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1115\/1.2792639"},{"key":"ref29","first-page":"132","article-title":"A fast full-field 3D measurement system for BGA coplanarity inspection","volume":"24","author":"yen","year":"2004","journal-title":"Int J Adv Manuf Technol"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1364\/AO.9.001467"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1111\/j.1747-1567.2002.tb00065.x"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/6040.883753"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/TEPM.2007.914220"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1115\/1.2905446"},{"journal-title":"Fundamentals of Microsystems Packaging","year":"2001","author":"tummala","key":"ref1"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1016\/S0924-0136(03)00028-1"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/6144.868849"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/IEMT.2003.1225913"},{"key":"ref24","first-page":"191","article-title":"On-line measurement of thermally induced warpage of BGAs with high sensitivity shadow Moiré","volume":"21","author":"wang","year":"1998","journal-title":"Int J Microcircuits Electron Packag"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2002.1008092"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/TCAPT.2002.808010"},{"key":"ref25","first-page":"283","article-title":"Measurement of thermally induced warpage of BGA packages\/substrates using phase-stepping shadow Moiré","author":"wang","year":"1997","journal-title":"Proc 1st Electron Packag Technol Conf"}],"container-title":["IEEE Access"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/6287639\/8274985\/08370237.pdf?arnumber=8370237","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,1,26]],"date-time":"2022-01-26T15:25:46Z","timestamp":1643210746000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/8370237\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2018]]},"references-count":35,"URL":"https:\/\/doi.org\/10.1109\/access.2018.2842199","relation":{},"ISSN":["2169-3536"],"issn-type":[{"type":"electronic","value":"2169-3536"}],"subject":[],"published":{"date-parts":[[2018]]}}}