{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,3,5]],"date-time":"2026-03-05T16:11:11Z","timestamp":1772727071614,"version":"3.50.1"},"reference-count":44,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","license":[{"start":{"date-parts":[[2018,1,1]],"date-time":"2018-01-01T00:00:00Z","timestamp":1514764800000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/OAPA.html"}],"funder":[{"DOI":"10.13039\/501100004063","name":"Knut och Alice Wallenbergs Stiftelse","doi-asserted-by":"publisher","id":[{"id":"10.13039\/501100004063","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001858","name":"Vinnova","doi-asserted-by":"publisher","award":["324189"],"award-info":[{"award-number":["324189"]}],"id":[{"id":"10.13039\/501100001858","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100000781","name":"European Research Council through the ERC Starting Grant M&Ms","doi-asserted-by":"publisher","award":["277879"],"award-info":[{"award-number":["277879"]}],"id":[{"id":"10.13039\/501100000781","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001729","name":"Stiftelsen f\u00f6r\u00a0Strategisk Forskning","doi-asserted-by":"publisher","award":["GMT14-0071"],"award-info":[{"award-number":["GMT14-0071"]}],"id":[{"id":"10.13039\/501100001729","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001729","name":"Stiftelsen f\u00f6r\u00a0Strategisk Forskning","doi-asserted-by":"publisher","award":["RIF14-0017"],"award-info":[{"award-number":["RIF14-0017"]}],"id":[{"id":"10.13039\/501100001729","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Access"],"published-print":{"date-parts":[[2018]]},"DOI":"10.1109\/access.2018.2861886","type":"journal-article","created":{"date-parts":[[2018,8,1]],"date-time":"2018-08-01T18:38:58Z","timestamp":1533148738000},"page":"44306-44317","source":"Crossref","is-referenced-by-count":38,"title":["Through-Glass Vias for Glass Interposers and MEMS Packaging Applications Fabricated Using Magnetic Assembly of Microscale Metal Wires"],"prefix":"10.1109","volume":"6","author":[{"ORCID":"https:\/\/orcid.org\/0000-0003-1112-3308","authenticated-orcid":false,"given":"Miku J.","family":"Laakso","sequence":"first","affiliation":[]},{"given":"Simon J.","family":"Bleiker","sequence":"additional","affiliation":[]},{"given":"Jessica","family":"Liljeholm","sequence":"additional","affiliation":[]},{"given":"Gustaf E.","family":"Martensson","sequence":"additional","affiliation":[]},{"ORCID":"https:\/\/orcid.org\/0000-0002-8050-0042","authenticated-orcid":false,"given":"Mikhail","family":"Asiatici","sequence":"additional","affiliation":[]},{"given":"Andreas C.","family":"Fischer","sequence":"additional","affiliation":[]},{"given":"Goran","family":"Stemme","sequence":"additional","affiliation":[]},{"given":"Thorbjorn","family":"Ebefors","sequence":"additional","affiliation":[]},{"given":"Frank","family":"Niklaus","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref39","article-title":"Standard reference material 731: Borosilicate glass—Thermal expansion","author":"hahn","year":"1972"},{"key":"ref38","article-title":"Standard reference material 736: Copper—Thermal expansion","author":"reed","year":"1990"},{"key":"ref33","doi-asserted-by":"crossref","first-page":"479","DOI":"10.1520\/JTE11357J","article-title":"Instantaneous coefficient of linear thermal expansion—A new definition","volume":"25","author":"bhattachar","year":"1997","journal-title":"J Test Eval"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.1016\/j.nucengdes.2011.12.006"},{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1016\/j.mee.2014.09.020"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1002\/9783527670109.ch05"},{"key":"ref37","article-title":"Standard reference material 737: Tungsten-thermal expansion","author":"kirby","year":"1976"},{"key":"ref36","doi-asserted-by":"publisher","DOI":"10.1103\/PhysRev.60.597"},{"key":"ref35","year":"2017","journal-title":"Eagle XG Slim Glass Product Information Sheet"},{"key":"ref34","year":"1990","journal-title":"CarTech Kovar Alloy UNS K94610 Technical Datasheet"},{"key":"ref10","doi-asserted-by":"crossref","first-page":"1481","DOI":"10.1109\/TCPMT.2012.2236385","article-title":"Embedded wafer level packaging for 77-GHz automotive radar front-end with through silicon via and its 3-D integration","volume":"3","author":"li","year":"2013","journal-title":"IEEE Trans Compon Packag Manuf Technol"},{"key":"ref40","doi-asserted-by":"publisher","DOI":"10.1063\/1.333965"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/ASMC.2013.6552803"},{"key":"ref12","first-page":"247","article-title":"Thin glass substrates development and integration for through glass vias (TGV) with copper (Cu) interconnects","author":"wang","year":"2012","journal-title":"Proc IEEE 7th Int Microsyst Packag Assem Circuits Technol Conf"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1016\/B978-0-323-29965-7.00038-5"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2011.5898579"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/JMEMS.2015.2448681"},{"key":"ref16","doi-asserted-by":"crossref","first-page":"53","DOI":"10.3390\/mi8020053","article-title":"Micro-hole drilling on glass substrates—A review","volume":"8","author":"hof","year":"2017","journal-title":"Micromachines"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1063\/1.329392"},{"key":"ref18","article-title":"Low loss high linearity RF interposers enabled by through-glass vias","author":"shah","year":"0","journal-title":"IEEE Microw Wireless Compon Lett"},{"key":"ref19","doi-asserted-by":"crossref","DOI":"10.1038\/micronano.2017.2","article-title":"Inkjet printing technology for increasing the I\/O density of 3D TSV interposers","volume":"3","author":"khorramdel","year":"2017","journal-title":"Microsyst Nanoeng"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1214\/088342304000000297"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2010.5490917"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1007\/978-1-4471-5541-6"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1038\/micronano.2015.5"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/3DIC.2013.6702382"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1109\/ICICDT.2011.5783204"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2013.6575795"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2016.201"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2014.2303427"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/MEMSYS.2016.7421691"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2015.7159610"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/MEMSYS.2017.7863517"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1007\/s10854-016-6005-0"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2010.5490887"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.7567\/JJAP.54.047202"},{"key":"ref42","doi-asserted-by":"publisher","DOI":"10.1109\/TDMR.2010.2068572"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2014.2369236"},{"key":"ref41","article-title":"Standard reference material 739: Fused-silica thermal expansion","author":"reed","year":"1991"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1088\/0960-1317\/22\/10\/105001"},{"key":"ref44","first-page":"41","author":"rumble","year":"2018","journal-title":"CRC Handbook of Chemistry and Physics"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1201\/b15030-2"},{"key":"ref43","doi-asserted-by":"publisher","DOI":"10.1109\/JMEMS.2002.805211"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/JMEMS.2016.2624423"}],"container-title":["IEEE Access"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/6287639\/8274985\/08424149.pdf?arnumber=8424149","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,1,26]],"date-time":"2022-01-26T09:06:52Z","timestamp":1643188012000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/8424149\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2018]]},"references-count":44,"URL":"https:\/\/doi.org\/10.1109\/access.2018.2861886","relation":{},"ISSN":["2169-3536"],"issn-type":[{"value":"2169-3536","type":"electronic"}],"subject":[],"published":{"date-parts":[[2018]]}}}