{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,2,5]],"date-time":"2026-02-05T07:05:22Z","timestamp":1770275122050,"version":"3.49.0"},"reference-count":345,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","license":[{"start":{"date-parts":[[2018,1,1]],"date-time":"2018-01-01T00:00:00Z","timestamp":1514764800000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/OAPA.html"}],"funder":[{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["61862048"],"award-info":[{"award-number":["61862048"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["61502255"],"award-info":[{"award-number":["61502255"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["61762070"],"award-info":[{"award-number":["61762070"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"name":"Inner Mongolia Science and Technology Plan"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Access"],"published-print":{"date-parts":[[2018]]},"DOI":"10.1109\/access.2018.2866840","type":"journal-article","created":{"date-parts":[[2018,8,30]],"date-time":"2018-08-30T19:05:52Z","timestamp":1535655952000},"page":"48867-48901","source":"Crossref","is-referenced-by-count":48,"title":["Air Flow Measurement and Management for Improving Cooling and Energy Efficiency in Raised-Floor Data Centers: A Survey"],"prefix":"10.1109","volume":"6","author":[{"ORCID":"https:\/\/orcid.org\/0000-0003-3236-3036","authenticated-orcid":false,"given":"Jianxiong","family":"Wan","sequence":"first","affiliation":[]},{"given":"Xiang","family":"Gui","sequence":"additional","affiliation":[]},{"given":"Shoji","family":"Kasahara","sequence":"additional","affiliation":[]},{"given":"Yuanyu","family":"Zhang","sequence":"additional","affiliation":[]},{"given":"Ran","family":"Zhang","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref275","doi-asserted-by":"publisher","DOI":"10.1016\/j.jobe.2017.01.002"},{"key":"ref274","doi-asserted-by":"publisher","DOI":"10.1115\/1.1827266"},{"key":"ref277","first-page":"493","article-title":"Airflow uniformity through perforated tiles in a raised-floor data center","author":"vangilder","year":"2005","journal-title":"Proc ASME Pacific Rim Tech Conf Exhib Integr Packag MEMS NEMS Electron Syst"},{"key":"ref276","doi-asserted-by":"publisher","DOI":"10.1109\/THETA.2010.5766384"},{"key":"ref271","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2017.2737878"},{"key":"ref270","doi-asserted-by":"publisher","DOI":"10.1109\/ITHERM.2016.7517697"},{"key":"ref273","article-title":"Enclosed-aisle data center cooling system","author":"khalifa","year":"2012"},{"key":"ref170","year":"2012","journal-title":"New Data Center Energy Efficiency Evaluation Index DPPE"},{"key":"ref272","doi-asserted-by":"publisher","DOI":"10.1109\/ITHERM.2016.7517581"},{"key":"ref172","first-page":"44","article-title":"Optimizing data center TCO: Efficiency metrics and an infrastructure cost model","volume":"114","author":"malone","year":"2008","journal-title":"ASHRAE Trans"},{"key":"ref171","year":"2009","journal-title":"DCEP Data Center Energy Productivity"},{"key":"ref174","first-page":"3091","article-title":"Dimensionless parameters for evaluation of thermal design and performance of large-scale data centers","author":"sharma","year":"2002","journal-title":"Proc 8th AIAA\/ASME Joint Thermophys Heat Transf Conf Fluid Dyn Co-Located Conf"},{"key":"ref173","article-title":"Self-benchmarking guide for data center infrastructure: Metrics, benchmarks, actions","author":"mathew","year":"2010"},{"key":"ref176","first-page":"702","article-title":"Is energy efficiency enough? Filling the engineering gap in data center design and operation","author":"seymour","year":"2016","journal-title":"Proc 6th Intersoc Conf Thermal Thermomech Phenom Electron Syst (ITHERM)"},{"key":"ref175","first-page":"725","article-title":"Rack cooling effectiveness in data centers and telecom central offices: The rack cooling index (RCI)","volume":"111","author":"herrlin","year":"2005","journal-title":"ASHRAE Trans"},{"key":"ref178","first-page":"452","article-title":"Dynamic thermal management of air cooled data centers","author":"bash","year":"2006","journal-title":"Proc 6th Intersoc Conf Thermal Thermomech Phenom Electron Syst (ITHERM)"},{"key":"ref177","first-page":"10","article-title":"Improved data center energy efficiency and thermal performance by advanced airflow analysis","author":"herrlin","year":"2007","journal-title":"Digital Power Forum Proceedings"},{"key":"ref168","first-page":"617","article-title":"Seeking an energy-efficient modular data center: Impact of pressure loss on the server fan power","author":"sato","year":"2015","journal-title":"Proc Int Conf Electron Packag iMAPS Asia Conf (ICEP-IACC)"},{"key":"ref169","doi-asserted-by":"publisher","DOI":"10.1016\/j.enbuild.2013.04.015"},{"key":"ref39","doi-asserted-by":"publisher","DOI":"10.1109\/COMST.2016.2545109"},{"key":"ref38","doi-asserted-by":"publisher","DOI":"10.1016\/j.rser.2016.04.034"},{"key":"ref33","first-page":"206","article-title":"Best practices for data center thermal and energy management—Review of literature","volume":"113","author":"schmidt","year":"2007","journal-title":"ASHRAE J"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.1115\/1.4000703"},{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1016\/j.apenergy.2017.08.037"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1016\/j.rser.2014.11.056"},{"key":"ref267","first-page":"556","article-title":"Effect of raised floor height on different arrangement of under-floor air distribution performance in data center","author":"zhang","year":"2017","journal-title":"Proc 10th Int Symp Heating Ventilation Air Conditioning (ISHVAC)"},{"key":"ref37","doi-asserted-by":"publisher","DOI":"10.1016\/j.rser.2015.12.283"},{"key":"ref268","doi-asserted-by":"publisher","DOI":"10.1016\/j.applthermaleng.2015.01.065"},{"key":"ref36","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2012.2212898"},{"key":"ref269","doi-asserted-by":"crossref","first-page":"20904","DOI":"10.1115\/1.4005907","article-title":"Optimization of enclosed aisle data centers using bypass recirculation","volume":"134","author":"demetriou","year":"2012","journal-title":"J Electron Packag"},{"key":"ref35","doi-asserted-by":"publisher","DOI":"10.1147\/rd.494.0709"},{"key":"ref34","doi-asserted-by":"publisher","DOI":"10.1007\/978-3-319-25892-8"},{"key":"ref288","first-page":"1346","article-title":"A holistic and optimal approach for data center cooling management","author":"zhou","year":"2011","journal-title":"Proc Amer Control Conf"},{"key":"ref287","first-page":"338","article-title":"Optimization and control of cooling microgrids for data centers","author":"zhou","year":"2012","journal-title":"Proc 6th Intersoc Conf Thermal Thermomech Phenom Electron Syst (ITHERM)"},{"key":"ref286","first-page":"645","article-title":"Local cooling control of data centers with adaptive vent tiles","author":"beitelmal","year":"2009","journal-title":"Proc ASME\/Pacific Rim Tech Conf Exhib Packag Integr Electron Photonic Syst MEMS NEMS (InterPACK)"},{"key":"ref285","article-title":"Improving cooling efficiency by using mixed tiles to control airflow uniformity of perforated tiles in a data center model","author":"phan","year":"2017","journal-title":"Proc ASME Summer Heat Transfer Conf"},{"key":"ref284","doi-asserted-by":"publisher","DOI":"10.1115\/1.4024994"},{"key":"ref181","year":"2012","journal-title":"Thermal Guidelines for Data Processing Environments"},{"key":"ref283","doi-asserted-by":"publisher","DOI":"10.1109\/ITHERM.2010.5501413"},{"key":"ref180","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2015.2508453"},{"key":"ref282","doi-asserted-by":"publisher","DOI":"10.1016\/j.applthermaleng.2017.03.003"},{"key":"ref281","first-page":"621","article-title":"Techniques for controlling airflow distribution in raised-floor data centers","author":"karki","year":"2003","journal-title":"Proc Pacific Rim\/ASME Int Electron Packag Tech Conf Exhib (InterPack)"},{"key":"ref280","doi-asserted-by":"publisher","DOI":"10.1016\/j.applthermaleng.2015.12.020"},{"key":"ref185","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2016.2599025"},{"key":"ref184","author":"yeh","year":"2016","journal-title":"Thermal Management of Microelectronic Equipment Heat Transfer Theory Analysis Methods and Design Practices"},{"key":"ref183","doi-asserted-by":"crossref","first-page":"163","DOI":"10.1145\/2254756.2254778","article-title":"Temperature management in data centers: Why some (might) like it hot","author":"el-sayed","year":"2012","journal-title":"Proc ACM SIGMETRICS Joint Int Conf Meas Model Comput Syst (SIGMETRICS)"},{"key":"ref182","first-page":"530","article-title":"Impact of temperature on hard disk drive reliability in large datacenters","author":"sankar","year":"2011","journal-title":"Proc IEEE\/IFIP Int Conf Depend Syst Netw (DSN)"},{"key":"ref189","author":"dubin","year":"1978","journal-title":"How to Save Energy and Cut Cost in Existing Industrial and Commercial Buildings Energy Conservation Manual"},{"key":"ref188","doi-asserted-by":"crossref","first-page":"469","DOI":"10.1145\/2745844.2745898","article-title":"Towards cooling Internet-scale distributed networks on the cheap","author":"gupta","year":"2015","journal-title":"Proc ACM Int Conf Meas Modeling Comput Syst (SIGMETRICS)"},{"key":"ref187","first-page":"147","article-title":"Key considerations to implement high ambient data center","author":"zhang","year":"2015","journal-title":"Proc 31st Therm Meas Modeling Manage Symp (SEMI-THERM)"},{"key":"ref186","article-title":"Data center air management research","author":"herrlin","year":"2010"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1016\/j.rser.2014.04.017"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1080\/01457632.2014.939032"},{"key":"ref179","first-page":"126","article-title":"Capture index: An airflow-based rack cooling performance metric","volume":"113","author":"vangilder","year":"2007","journal-title":"ASHRAE Trans"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2012.2185797"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1145\/2187671.2187675"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1115\/1.4031326"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1016\/j.rser.2016.09.050"},{"key":"ref344","doi-asserted-by":"publisher","DOI":"10.1038\/nature14236"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1016\/j.rser.2017.10.058"},{"key":"ref345","author":"evans","year":"2016","journal-title":"DeepMind AI Reduces Google Data Centre Cooling Bill by 40%"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1016\/j.rser.2013.12.007"},{"key":"ref278","doi-asserted-by":"publisher","DOI":"10.1109\/6144.926380"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1016\/j.applthermaleng.2016.03.056"},{"key":"ref279","doi-asserted-by":"publisher","DOI":"10.1115\/1.4023214"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/TCAPT.2003.811482"},{"key":"ref293","doi-asserted-by":"publisher","DOI":"10.1016\/j.ijheatmasstransfer.2017.04.022"},{"key":"ref50","doi-asserted-by":"publisher","DOI":"10.1016\/j.buildenv.2014.08.021"},{"key":"ref292","doi-asserted-by":"publisher","DOI":"10.1016\/j.ijheatmasstransfer.2015.12.060"},{"key":"ref51","first-page":"299","article-title":"Measuring energy efficiency in data centers","author":"chinnici","year":"2018","journal-title":"Pervasive Computing Next Generation Platforms for Intelligent Data Collection"},{"key":"ref295","year":"2018","journal-title":"California Energy Code"},{"key":"ref294","first-page":"891","article-title":"Parametric investigation of a raised-floor data center cooling using a reversible fan system","author":"song","year":"2017","journal-title":"Proc 6th Intersoc Conf Thermal Thermomech Phenom Electron Syst (ITHERM)"},{"key":"ref297","year":"2016"},{"key":"ref296","year":"2018","journal-title":"European Code of Conduct on Data Centre Energy Efficiency"},{"key":"ref299","article-title":"Effect of cold aisle containment leakage on flow rates and temperatures in a data center","author":"alkharabsheh","year":"2013","journal-title":"Proc Int Tech Conf Exhib Packag Integr Electron Photonic Microsyst"},{"key":"ref298","year":"2018","journal-title":"Data Center Optimization Initiative (DCOI)"},{"key":"ref154","first-page":"30","article-title":"Effect of rack server population on temperatures in data centers","author":"ghosh","year":"2012","journal-title":"Proc 6th Intersoc Conf Thermal Thermomech Phenom Electron Syst (ITHERM)"},{"key":"ref153","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2017.2682863"},{"key":"ref156","first-page":"401","article-title":"Distributed leakage flow in raised-floor data centers","author":"radmehr","year":"2005","journal-title":"Proc ASME Pacific Rim Tech Conf Exhib Integr Packag MEMS NEMS Electron Syst"},{"key":"ref155","first-page":"163","article-title":"Experimental methods to characterize the impact of cross flow orientation on jets of air after a perforated tile","author":"khalili","year":"2017","journal-title":"Proc 33rd Therm Meas Modeling Manage Symp (SEMI-THERM)"},{"key":"ref150","doi-asserted-by":"publisher","DOI":"10.1109\/MCOM.2016.1600399CM"},{"key":"ref291","doi-asserted-by":"publisher","DOI":"10.1115\/1.4039025"},{"key":"ref152","first-page":"822","article-title":"A tele-operative RMMT system facilitating the management of cooling and energy in data centers","author":"zhou","year":"2010","journal-title":"Proc IEEE Int Conf Robot Biomimetics (RoBio)"},{"key":"ref290","first-page":"269","article-title":"Kratos: Automated management of cooling capacity in data centers with adaptive vent tiles","author":"wang","year":"2009","journal-title":"Proc ASME Int Mech Eng Congr Expo (IMECE)"},{"key":"ref151","article-title":"A robot as mobile sensor and agent in data center energy management","author":"chan","year":"2011","journal-title":"Proc 8th ACM Int Conf Auto Comput (ICAC)"},{"key":"ref146","doi-asserted-by":"publisher","DOI":"10.1109\/MMM.2014.2356151"},{"key":"ref147","first-page":"533","article-title":"Wireless sensor network for data-center environmental monitoring","author":"rodriguez","year":"2011","journal-title":"Proc 5th Int Conf Sens Technol (ICST)"},{"key":"ref148","article-title":"Towards discovering data center genome using sensor nets","author":"liu","year":"2008","journal-title":"Proc 5th Workshop Emb Netw Sens (HotEmNets)"},{"key":"ref149","first-page":"1","article-title":"Node level power profiling and thermal management in HPC system","author":"sherin","year":"2016","journal-title":"Proc 2nd Int Conf Green High Perform Comput (ICGHPC)"},{"key":"ref289","first-page":"1789","article-title":"Data center cooling efficiency improvement through localized and optimized cooling resources delivery","author":"zhou","year":"2012","journal-title":"Proc ASME Int Mech Eng Congr Expo (IMECE)"},{"key":"ref59","doi-asserted-by":"publisher","DOI":"10.1016\/j.enbuild.2013.12.015"},{"key":"ref58","doi-asserted-by":"publisher","DOI":"10.1007\/978-1-4419-7124-1_2"},{"key":"ref57","doi-asserted-by":"publisher","DOI":"10.1007\/978-1-4419-7124-1_5"},{"key":"ref56","doi-asserted-by":"publisher","DOI":"10.1109\/JSYST.2017.2700863"},{"key":"ref55","first-page":"497","article-title":"Cold aisle air distribution in a raised floor data center with heterogeneous opposing orientation racks","author":"kumar","year":"2011","journal-title":"Proc ASME Pacific Rim Tech Conf Exhib Packag Integr Electron Photon Syst"},{"key":"ref54","doi-asserted-by":"publisher","DOI":"10.1007\/978-1-4419-7124-1_6"},{"key":"ref53","doi-asserted-by":"publisher","DOI":"10.1007\/978-1-4419-7124-1_7"},{"key":"ref52","doi-asserted-by":"publisher","DOI":"10.1007\/978-1-4419-7124-1_8"},{"key":"ref40","doi-asserted-by":"publisher","DOI":"10.1109\/JSYST.2014.2315823"},{"key":"ref167","doi-asserted-by":"crossref","first-page":"253","DOI":"10.1145\/2768510.2768525","article-title":"Modeling impact of power- and thermal-aware fans management on data center energy consumption","author":"piatek","year":"2015","journal-title":"Proc ACM 6th Int Conf Future e-Energy Syst"},{"key":"ref166","author":"avelar","year":"2012","journal-title":"PUE A Comprehensive Examination of the Metric"},{"key":"ref165","first-page":"141","article-title":"Quantifying data center performance","author":"nemati","year":"2018","journal-title":"Proc of the 34th SEMI-THERM"},{"key":"ref164","author":"seymour","year":"2016","journal-title":"The Performance Indicator Assessing and Visualizing Data Centre Cooling Performance"},{"key":"ref163","doi-asserted-by":"publisher","DOI":"10.1109\/ITHERM.2010.5501366"},{"key":"ref162","doi-asserted-by":"publisher","DOI":"10.1080\/10789669.2003.10391061"},{"key":"ref161","doi-asserted-by":"publisher","DOI":"10.1109\/TCC.2015.2424892"},{"key":"ref160","doi-asserted-by":"publisher","DOI":"10.1016\/j.enbuild.2014.04.036"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TII.2018.2791537"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/TII.2017.2692775"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TPDS.2014.2361519"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/COMST.2015.2481183"},{"key":"ref8","doi-asserted-by":"crossref","first-page":"23","DOI":"10.1145\/3143314.3078545","article-title":"Why ‘some’ like it hot too: Thermal attack on data centers","author":"gao","year":"2017","journal-title":"Proc ACM SIGMETRICS Conf Meas Mod Comp Sys"},{"key":"ref159","doi-asserted-by":"publisher","DOI":"10.1016\/j.enbuild.2004.12.014"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1016\/j.suscom.2012.04.002"},{"key":"ref49","first-page":"391","article-title":"Thermal metrics for data centers: A critical review","volume":"62","author":"capozzoli","year":"2014","journal-title":"Proc 6th Int Conf Sustainability Energy Buildings"},{"key":"ref157","first-page":"88","article-title":"Measurement of perforated tile airflow in data centers","volume":"122","author":"vangilder","year":"2016","journal-title":"ASHRAE Trans"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1145\/3190619.3191681"},{"key":"ref158","first-page":"90","article-title":"Effect of server load variation on rack air flow distribution in a raised floor data center","author":"kumar","year":"2011","journal-title":"Proc IEEE Semiconductor Thermal Measurement and Management (Semi-Therm) Symp"},{"key":"ref46","first-page":"1","article-title":"Data center green performance measurement: State of the art and open research challenges","author":"sch\u00f6dwell","year":"2013","journal-title":"Proc 9th Amer Conf Inform Syst"},{"key":"ref45","doi-asserted-by":"publisher","DOI":"10.1108\/14777830910990870"},{"key":"ref48","first-page":"135","article-title":"Review on performance metrics for energy efficiency in data center: The role of thermal management","author":"capozzoli","year":"2014","journal-title":"Second International Workshop on Energy Efficient Data Centers (E2DC)"},{"key":"ref47","doi-asserted-by":"publisher","DOI":"10.1007\/s11227-011-0704-3"},{"key":"ref42","doi-asserted-by":"publisher","DOI":"10.1016\/j.apenergy.2013.02.047"},{"key":"ref41","doi-asserted-by":"publisher","DOI":"10.1016\/j.rser.2014.10.035"},{"key":"ref44","doi-asserted-by":"publisher","DOI":"10.1007\/s10619-006-7007-3"},{"key":"ref43","doi-asserted-by":"publisher","DOI":"10.1108\/09615531011048231"},{"key":"ref320","doi-asserted-by":"publisher","DOI":"10.1016\/j.future.2014.09.012"},{"key":"ref321","first-page":"5591","article-title":"Shutter control for cooling air flow management in data center servers","author":"noguchi","year":"2016","journal-title":"Proc IEEE Ind Electron Soc Annu Conf (IECON)"},{"key":"ref73","doi-asserted-by":"publisher","DOI":"10.1016\/j.applthermaleng.2015.05.069"},{"key":"ref72","doi-asserted-by":"publisher","DOI":"10.1016\/j.enbuild.2013.09.013"},{"key":"ref71","doi-asserted-by":"publisher","DOI":"10.1115\/IMECE2015-50782"},{"key":"ref70","doi-asserted-by":"publisher","DOI":"10.1109\/ITHERM.2016.7517717"},{"key":"ref318","doi-asserted-by":"crossref","first-page":"175","DOI":"10.1145\/2254756.2254779","article-title":"Renewable and cooling aware workload management for sustainable data centers","author":"liu","year":"2012","journal-title":"Proc ACM SIGMETRICS Joint Int Conf Meas Model Comput Syst (SIGMETRICS)"},{"key":"ref76","first-page":"v002t09a021","article-title":"Benefit of cold aisle containment during cooling failure","author":"shrivastava","year":"2013","journal-title":"Proc ASME Int Tech Conf Exhib Packag Integr Electron Photon Microsyst"},{"key":"ref317","first-page":"116","article-title":"Towards thermal aware workload scheduling in a data center","author":"wang","year":"2009","journal-title":"Proc 10th IEEE Int Symp Pervas Syst Algorithm Netw"},{"key":"ref77","article-title":"Impact of hot and cold aisle containment on data center temperature and efficiency","author":"niemann","year":"2011"},{"key":"ref316","doi-asserted-by":"publisher","DOI":"10.1145\/1254810.1254834"},{"key":"ref74","doi-asserted-by":"publisher","DOI":"10.1109\/ITHERM.2014.6892362"},{"key":"ref315","doi-asserted-by":"publisher","DOI":"10.1109\/CCGrid.2013.89"},{"key":"ref75","doi-asserted-by":"publisher","DOI":"10.1115\/1.4029344"},{"key":"ref314","doi-asserted-by":"publisher","DOI":"10.1016\/j.future.2006.03.007"},{"key":"ref313","first-page":"798","article-title":"Effectiveness of rack-level containment in removing data center hot-spots","author":"onyiorah","year":"2014","journal-title":"Proc 6th Intersoc Conf Thermal Thermomech Phenom Electron Syst (ITHERM)"},{"key":"ref312","doi-asserted-by":"publisher","DOI":"10.1016\/j.ijrefrig.2015.10.027"},{"key":"ref78","doi-asserted-by":"publisher","DOI":"10.1109\/ITHERM.2012.6231415"},{"key":"ref311","doi-asserted-by":"publisher","DOI":"10.1016\/j.enbuild.2011.04.025"},{"key":"ref79","first-page":"38","article-title":"High-density heat containment","volume":"49","author":"martin","year":"2007","journal-title":"ASHRAE J"},{"key":"ref319","doi-asserted-by":"publisher","DOI":"10.1145\/1965724.1965752"},{"key":"ref310","doi-asserted-by":"publisher","DOI":"10.1115\/1.4026540"},{"key":"ref60","year":"2013","journal-title":"Lulea goes live"},{"key":"ref62","doi-asserted-by":"publisher","DOI":"10.1109\/MSPEC.2017.7864753"},{"key":"ref61","doi-asserted-by":"publisher","DOI":"10.1080\/01998595.2017.11810158"},{"key":"ref305","doi-asserted-by":"publisher","DOI":"10.1145\/2018536.2018539"},{"key":"ref63","first-page":"1","article-title":"Opportunities and challenges to unify workload, power, and cooling management in data centers","author":"wang","year":"2010","journal-title":"Proc 5th ACM Int Workshop Feedback Control Implement Design Comput Syst Netw (FeBiD)"},{"key":"ref304","doi-asserted-by":"publisher","DOI":"10.1016\/j.enbuild.2014.02.042"},{"key":"ref64","doi-asserted-by":"publisher","DOI":"10.1109\/TNET.2012.2226216"},{"key":"ref307","first-page":"743","article-title":"Building cavities used as ducts: Air leakage characteristics and impacts in light commercial buildings","volume":"104","author":"cummings","year":"1998","journal-title":"ASHRAE Trans"},{"key":"ref65","doi-asserted-by":"publisher","DOI":"10.1016\/j.enbuild.2016.01.037"},{"key":"ref306","doi-asserted-by":"publisher","DOI":"10.1115\/1.4023597"},{"key":"ref66","first-page":"479","article-title":"An investigation into cooling system control strategies for data center airflow containment architectures","author":"patterson","year":"2011","journal-title":"Proc ASME Pacific Rim Tech Conf Exhib Packag Integr Electron Photon Syst MEMS NEMS"},{"key":"ref301","year":"2018"},{"key":"ref67","first-page":"1346","article-title":"Real time thermal management controller for data center","author":"zhang","year":"2014","journal-title":"Proc 6th Intersoc Conf Thermal Thermomech Phenom Electron Syst (ITHERM)"},{"key":"ref300","year":"2018"},{"key":"ref68","doi-asserted-by":"publisher","DOI":"10.1080\/14733315.2002.11683619"},{"key":"ref303","doi-asserted-by":"publisher","DOI":"10.1016\/j.buildenv.2018.05.043"},{"key":"ref69","first-page":"1","article-title":"Experimental and numerical characterization of a raised floor data center using rapid operational flow curves model","author":"alissa","year":"2015","journal-title":"Proc ASME Int Tech Conf Exhib Packag Integr Electron Photon Microsyst (InterPACK)"},{"key":"ref302","year":"2018"},{"key":"ref309","first-page":"43","article-title":"A comparative study of raised-floor and hard-floor configurations in an air-cooled data centre","author":"srinarayana","year":"2012","journal-title":"Proc 9th Intersoc Conf Therm Thermomech Phenom Electron Syst (ITHERM)"},{"key":"ref308","first-page":"3789","article-title":"Enclosed aisle effect on cooling efficiency in small scale data center","author":"lyu","year":"2017","journal-title":"Proc 10th Int Symp Heating Ventilation Air Conditioning (ISHVAC)"},{"key":"ref197","first-page":"1","article-title":"Accurate temperature-dependent integrated circuit leakage power estimation is easy","author":"liu","year":"2007","journal-title":"Proc Conf Design Autom Test Eur (DATE)"},{"key":"ref198","first-page":"1167","article-title":"The effect of data center temperature on energy efficiency","author":"patterson","year":"2008","journal-title":"Proc 5th Intersociety Conf Thermal and Thermomechanical Phenomena in Electronics Systems (ITHERM)"},{"key":"ref199","doi-asserted-by":"publisher","DOI":"10.1115\/1.4024945"},{"key":"ref193","doi-asserted-by":"publisher","DOI":"10.1109\/MC.2003.1250885"},{"key":"ref194","first-page":"652","article-title":"Energy-optimal dynamic thermal management for green computing","author":"shin","year":"2009","journal-title":"Proc IEEE\/ACM Int Conf Comput -Aided-Design Tech Papers"},{"key":"ref195","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2005.850895"},{"key":"ref196","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2005.850860"},{"key":"ref95","first-page":"v002t09a013","article-title":"A field investigation into the limits of high-density air-cooling","author":"patterson","year":"2013","journal-title":"Proc ASME Int Tech Conf Exhib Packag Integr Electron Photon Microsyst"},{"key":"ref94","doi-asserted-by":"publisher","DOI":"10.1016\/j.enbuild.2011.08.034"},{"key":"ref190","doi-asserted-by":"crossref","first-page":"356","DOI":"10.1145\/2806777.2806938","article-title":"CoolProvision: Underprovisioning datacenter cooling","author":"manousakis","year":"2015","journal-title":"Proc of ACM Symp on Cloud Computing (SOCC)"},{"key":"ref93","doi-asserted-by":"publisher","DOI":"10.1115\/1.4031079"},{"key":"ref191","first-page":"1369","article-title":"Effect of supply air temperature on rack cooling in a high density raised floor data center facility","author":"kumar","year":"2011","journal-title":"Proc ASME Int Mech Eng Congr Expo"},{"key":"ref92","doi-asserted-by":"publisher","DOI":"10.1115\/1.4028520"},{"key":"ref192","doi-asserted-by":"publisher","DOI":"10.1016\/j.applthermaleng.2014.12.021"},{"key":"ref342","first-page":"77","article-title":"Neural network-based task scheduling with preemptive fan control","author":"acun","year":"2016","journal-title":"Proc of International Workshop on Energy Efficient Supercomputing"},{"key":"ref91","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2018.2811545"},{"key":"ref343","first-page":"1","article-title":"Deep reinforcement learning for building HVAC control","author":"wei","year":"2017","journal-title":"Proc of Annual Design Automation Conf (DAC)"},{"key":"ref90","first-page":"109","article-title":"Data centers’ energy auditing and benchmarking-progress update","volume":"116","author":"munther","year":"2010","journal-title":"ASHRAE Trans"},{"key":"ref340","doi-asserted-by":"publisher","DOI":"10.1109\/MCC.2018.1081063"},{"key":"ref341","doi-asserted-by":"publisher","DOI":"10.1109\/ICDCS.2017.123"},{"key":"ref336","first-page":"767","article-title":"Thermal considerations in cooling large scale high compute density data centers","author":"patel","year":"2002","journal-title":"Proc 8th Intersociety Conf Thermal and Thermomechanical Phenomena in Electronics Systems (ITHERM)"},{"key":"ref335","author":"rasmussen","year":"2003","journal-title":"Air distribution architecture options for mission critical facilities"},{"key":"ref334","first-page":"1209","article-title":"Multi-objective optimization of temperature distributions using artificial neural networks","author":"song","year":"2012","journal-title":"Proc 9th Intersoc Conf Therm Thermomech Phenom Electron Syst (ITHERM)"},{"key":"ref333","doi-asserted-by":"publisher","DOI":"10.1007\/s10619-007-7009-9"},{"key":"ref98","doi-asserted-by":"publisher","DOI":"10.1016\/j.applthermaleng.2016.03.157"},{"key":"ref339","article-title":"Green resource allocation based on deep reinforcement learning in content-centric IoT","author":"he","year":"0","journal-title":"IEEE Trans Emerg Topics Comput"},{"key":"ref99","first-page":"426","article-title":"Parametric investigation for performance of the active tile in data centers","author":"song","year":"2016","journal-title":"Proc 9th Intersoc Conf Therm Thermomech Phenom Electron Syst (ITHERM)"},{"key":"ref338","first-page":"425","article-title":"Effect of CRAC location on fixed rack layout","author":"bedekar","year":"2006","journal-title":"Proc 8th Intersoc Conf Thermal Thermomechanical Phenomena Electronics Systems (ITHERM)"},{"key":"ref96","doi-asserted-by":"publisher","DOI":"10.1115\/1.2356866"},{"key":"ref337","doi-asserted-by":"publisher","DOI":"10.1080\/10407780500496562"},{"key":"ref97","doi-asserted-by":"publisher","DOI":"10.1016\/j.applthermaleng.2016.10.089"},{"key":"ref82","first-page":"1","article-title":"Measurements and predictions of the flow distribution through perforated tiles in raised floor data centers","author":"schmidt","year":"2001","journal-title":"Proc Pacific Rim\/ASME Int Electron Packag Tech Conf Exhib"},{"key":"ref81","first-page":"426","article-title":"Effect of under floor blockages on data center performance","author":"bhopte","year":"2006","journal-title":"Proc 8th Intersoc Conf Thermal Thermomechanical Phenomena Electronics Systems (ITHERM)"},{"key":"ref84","first-page":"96","article-title":"Underfloor air containment","author":"pervila","year":"2013","journal-title":"Proc IEEE Online Conf Green Commun (OnlineGreenComm)"},{"key":"ref83","first-page":"1153","article-title":"The impact of air flow leakage on server inlet air temperature in a raised floor data center","author":"hamann","year":"2008","journal-title":"Proc 8th Intersociety Conf Thermal and Thermomechanical Phenomena in Electronics Systems (ITHERM)"},{"key":"ref330","first-page":"3568","article-title":"The effect air-intake format of equipment gives to air conditioning system in a data center","volume":"e87 b","author":"furihata","year":"2004","journal-title":"IEICE Trans Commun"},{"key":"ref331","doi-asserted-by":"publisher","DOI":"10.1016\/j.suscom.2014.08.005"},{"key":"ref80","first-page":"786","article-title":"Cooling performance of ceiling-plenum-ducted containment systems in data centers","author":"vangilder","year":"2014","journal-title":"Proc 6th Intersoc Conf Thermal Thermomech Phenom Electron Syst (ITHERM)"},{"key":"ref332","doi-asserted-by":"publisher","DOI":"10.1115\/1.4024946"},{"key":"ref323","doi-asserted-by":"publisher","DOI":"10.1016\/j.enbuild.2009.05.017"},{"key":"ref89","first-page":"1","article-title":"Experimental investigations on the effect of perforated tile air jet velocity on server air distribution in a high density data center","author":"kumar","year":"2010","journal-title":"Proc 9th Intersoc Conf Therm Thermomech Phenom Electron Syst (ITHERM)"},{"key":"ref322","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2013.2248195"},{"key":"ref325","doi-asserted-by":"publisher","DOI":"10.1147\/JRD.2018.2803438"},{"key":"ref324","doi-asserted-by":"publisher","DOI":"10.1109\/TCC.2015.2440245"},{"key":"ref327","first-page":"297","article-title":"Raised floor computer data center: Effect on rack inlet temperatures when high powered racks are situated amongst lower powered racks","author":"schmidt","year":"2002","journal-title":"Proc ASME Int Mech Eng Congr Expo"},{"key":"ref85","first-page":"1668","article-title":"Active controlled shutter for effective cooling of servers in data center","author":"noguchi","year":"2015","journal-title":"Proc IEEE Ind Electron Soc Annu Conf (IECON)"},{"key":"ref326","doi-asserted-by":"publisher","DOI":"10.1007\/s00231-017-1966-y"},{"key":"ref86","first-page":"v002t09a018","article-title":"Open and contained cold aisle experimentally validated CFD model implementing CRAC and server fan curves for a data center test laboratory","author":"alkharabsheh","year":"2013","journal-title":"Proc ASME Int Tech Conf Exhib Packag Integr Electron Photon Microsyst"},{"key":"ref329","doi-asserted-by":"publisher","DOI":"10.1115\/1.2056575"},{"key":"ref87","doi-asserted-by":"publisher","DOI":"10.1109\/ITHERM.2014.6892360"},{"key":"ref328","doi-asserted-by":"crossref","first-page":"245","DOI":"10.1145\/2627369.2627639","article-title":"Thermal-aware layout planning for heterogeneous datacenters","author":"azimi","year":"2014","journal-title":"Proc IEEE\/ACM Int Symp Low Power Electron Design (ISLPED)"},{"key":"ref88","doi-asserted-by":"publisher","DOI":"10.1016\/j.apenergy.2016.03.076"},{"key":"ref200","doi-asserted-by":"publisher","DOI":"10.1016\/j.enbuild.2014.03.060"},{"key":"ref101","doi-asserted-by":"publisher","DOI":"10.1016\/j.applthermaleng.2011.03.025"},{"key":"ref100","doi-asserted-by":"publisher","DOI":"10.1080\/01457632.2013.828559"},{"key":"ref209","doi-asserted-by":"publisher","DOI":"10.1109\/TPDS.2008.111"},{"key":"ref203","first-page":"70","article-title":"De-risking data center temperature increases, part 2","volume":"58","author":"beaty","year":"2016","journal-title":"ASHRAE J"},{"key":"ref204","first-page":"396","article-title":"Joint optimization of computing and cooling energy: Analytic model and a machine room case study","author":"li","year":"2012","journal-title":"Proc IEEE 32nd Int Conf Distrib Comput Syst (ICDCS)"},{"key":"ref201","author":"santarini","year":"2005","journal-title":"Thermal integrity A must for low-power-IC digital design"},{"key":"ref202","first-page":"74","article-title":"De-risking data center temperature increases, part 1","volume":"58","author":"beaty","year":"2016","journal-title":"ASHRAE J"},{"key":"ref207","doi-asserted-by":"publisher","DOI":"10.1145\/1594233.1594268"},{"key":"ref208","first-page":"461","article-title":"Spatially-aware optimization of energy consumption in consolidated data center systems","author":"chen","year":"2011","journal-title":"Proc ASME Pacific Rim Tech Conf Exhib Packag Integr Electron Photonic Syst MEMS NEMS (InterPACK)"},{"key":"ref205","first-page":"1","article-title":"ATAC: Ambient temperature-aware capping for power efficient datacenters","author":"yeo","year":"2014","journal-title":"Proc Symp Cloud Computing (SoCC)"},{"key":"ref206","doi-asserted-by":"publisher","DOI":"10.1109\/JPROC.2011.2161244"},{"key":"ref211","article-title":"Data center control strategy for participation in demand response programs","author":"cupelli","year":"0","journal-title":"IEEE Trans Ind Informat"},{"key":"ref210","first-page":"675","article-title":"A dynamic stochastic optimization control model for data centers based on numerical modeling","author":"sakaino","year":"2016","journal-title":"Proc 6th Intersoc Conf Thermal Thermomech Phenom Electron Syst (ITHERM)"},{"key":"ref212","first-page":"762","article-title":"Integrated management of cooling resources in air-cooled data centers","author":"wang","year":"2010","journal-title":"Proc 6th Annu IEEE Conf Autom Sci Eng"},{"key":"ref213","year":"2011","journal-title":"Mission critical facilities technology spaces and electronic equipment thermal guidelines for data processing environments"},{"key":"ref214","doi-asserted-by":"crossref","first-page":"253","DOI":"10.1145\/2694344.2694378","article-title":"CoolAir: Temperature- and variation-aware management for free-cooled datacenters","author":"goiri","year":"2015","journal-title":"Proc Int Conf Archit Support Program Languages Oper Syst (ASPLOS)"},{"key":"ref215","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2011.2175926"},{"key":"ref216","first-page":"1","article-title":"Long-term SLOs for reclaimed cloud computing resources","author":"carvalho","year":"2014","journal-title":"Proc Symp Cloud Computing (SoCC)"},{"key":"ref217","first-page":"435","article-title":"A measurement study of server utilization in public clouds","author":"liu","year":"2011","journal-title":"Proc IEEE 9th Int Conf Dependable Auto Secure Comput (DASC)"},{"key":"ref218","doi-asserted-by":"publisher","DOI":"10.1109\/Trustcom.2015.641"},{"key":"ref219","doi-asserted-by":"publisher","DOI":"10.1109\/ITHERM.2010.5501418"},{"key":"ref220","first-page":"1","article-title":"Thermal zones for more efficient data center energy management","author":"hamann","year":"2010","journal-title":"Proc 12th IEEE Intersoc Conf Therm Thermomech Phenomena Electron Syst (SEMI-THERM)"},{"key":"ref222","doi-asserted-by":"publisher","DOI":"10.1007\/978-1-4419-7124-1_3"},{"key":"ref221","first-page":"138","article-title":"On demand cooling with real time thermal information","author":"zhang","year":"2015","journal-title":"Proc 31st Therm Meas Modeling Manage Symp (SEMI-THERM)"},{"key":"ref229","first-page":"1","article-title":"Decoupling fan speed control design of server based on fuzzy logic","author":"lee","year":"2013","journal-title":"Proc IEEE Int Symp Ind Electron"},{"key":"ref228","first-page":"201","article-title":"Power-performance management on an IBM POWER7 server","author":"rajamani","year":"2010","journal-title":"Proc Int Symp Low Power Electronics and Design (ISLPED)"},{"key":"ref227","doi-asserted-by":"publisher","DOI":"10.1109\/SEMI-THERM.2013.6526802"},{"key":"ref226","first-page":"131","article-title":"System-level, unified in-band and out-of-band dynamic thermal control","author":"li","year":"2010","journal-title":"Proc 39th Int Conf Parallel Process"},{"key":"ref225","first-page":"20","article-title":"Energy reduction in server cooling via real time thermal control","author":"han","year":"2012","journal-title":"Proc 28th Annu IEEE Semicond Therm Meas Manage Symp (SEMI-THERM)"},{"key":"ref224","first-page":"423","article-title":"TECfan: Coordinating thermoelectric cooler, fan, and DVFS for CMP energy optimization","author":"zheng","year":"2016","journal-title":"Proc IEEE Int Parallel Distrib Process Symp (IPDPS)"},{"key":"ref223","doi-asserted-by":"publisher","DOI":"10.1016\/j.applthermaleng.2016.07.186"},{"key":"ref127","doi-asserted-by":"publisher","DOI":"10.1109\/SEMI-THERM.2013.6526833"},{"key":"ref126","doi-asserted-by":"crossref","first-page":"5905","DOI":"10.1109\/ICRA.2011.5980554","article-title":"Robotic mapping and monitoring of data centers","author":"mansley","year":"2011","journal-title":"Proc IEEE Int Conf Robot Automat (ICRA)"},{"key":"ref125","doi-asserted-by":"publisher","DOI":"10.1016\/j.applthermaleng.2016.08.097"},{"key":"ref124","first-page":"28","article-title":"Multipoint temperature measurement technology using optical fiber","volume":"46","author":"takei","year":"2010","journal-title":"FUJITSU Sci Tech J"},{"key":"ref129","doi-asserted-by":"publisher","DOI":"10.1016\/j.jmsy.2014.06.008"},{"key":"ref128","first-page":"469","article-title":"Dynamo: Facebook’s data center-wide power management system","author":"wu","year":"2016","journal-title":"Proc ACM\/IEEE 43rd Annu Int Symp Comput Archit (ISCA)"},{"key":"ref130","doi-asserted-by":"publisher","DOI":"10.1145\/1925861.1925877"},{"key":"ref133","doi-asserted-by":"publisher","DOI":"10.1115\/1.4028835"},{"key":"ref134","doi-asserted-by":"publisher","DOI":"10.1080\/01457632.2015.1051386"},{"key":"ref131","first-page":"313","article-title":"A novel IoT-based energy management system for large scale data centers","author":"sharad","year":"2015","journal-title":"Proc 5th Int Conf Future Energy Syst (e-Energy)"},{"key":"ref132","first-page":"1","article-title":"Efficient monitoring system for Data Center: Agorà case study","author":"isidori","year":"2016","journal-title":"Proc IEEE 16th Int Conf Environ Elect Eng (EEEIC)"},{"key":"ref232","doi-asserted-by":"publisher","DOI":"10.1109\/GreenCom-CPSCom.2010.49"},{"key":"ref233","doi-asserted-by":"publisher","DOI":"10.1007\/s10586-011-0174-7"},{"key":"ref230","first-page":"1","article-title":"Global fan speed control considering non-ideal temperature measurements in enterprise servers","author":"kim","year":"2014","journal-title":"Proc Conf Design Autom Test Eur (DATE)"},{"key":"ref231","doi-asserted-by":"publisher","DOI":"10.1115\/InterPACK2009-89074"},{"key":"ref239","first-page":"1453","article-title":"Study of air flow energy within data center room and sizing of hot aisle containment for an active vs passive cooling design","author":"sahini","year":"2016","journal-title":"Proc 9th Intersoc Conf Therm Thermomech Phenom Electron Syst (ITHERM)"},{"key":"ref238","doi-asserted-by":"publisher","DOI":"10.1115\/1.4038014"},{"key":"ref235","first-page":"1","article-title":"Intake fan implementation to allow high ambient temperatures","author":"diemunsch","year":"2014","journal-title":"Proc 17th Int Workshop Therm Invest ICs Syst (THERMINIC)"},{"key":"ref234","author":"miller","year":"2008","journal-title":"Cloudrack Rackables Form Factor for the Cloud"},{"key":"ref237","first-page":"171","article-title":"Thermal management in rack scale architecture system with shared power and shared cooling","author":"gong","year":"2016","journal-title":"Proc 32nd Thermal Meas Modelling Manage Symp (SEMI-THERM)"},{"key":"ref236","first-page":"1","article-title":"Rack server solution in data center","author":"kang","year":"2015","journal-title":"Proc ASME Int Tech Conf Exhib Packag Integr Electron Photon Microsyst Collocated ASME 13th Int Conf Nanochannels Microchannels Minichannels"},{"key":"ref136","first-page":"304","article-title":"Modeling of HVAC system in data center with super-multipoint temperature sensing technology","author":"wasa","year":"2014","journal-title":"Proc IEEE Conf Control Appl (CCA)"},{"key":"ref135","first-page":"395","article-title":"Evaluation of a new data center air-cooling architecture: The down-flow plenum","author":"hackenberg","year":"2016","journal-title":"Proc 9th Intersoc Conf Therm Thermomech Phenom Electron Syst (ITHERM)"},{"key":"ref138","year":"2018","journal-title":"Fall 2014 Data Center Users’ Group Survey Results"},{"key":"ref137","first-page":"13","article-title":"Optimal and distributed automatic discrete control of air conditioning units in data centers","author":"bermudez","year":"2015","journal-title":"Proc 31st Therm Meas Modeling Manage Symp (SEMI-THERM)"},{"key":"ref139","doi-asserted-by":"publisher","DOI":"10.1109\/ITHERM.2014.6892408"},{"key":"ref140","doi-asserted-by":"publisher","DOI":"10.1016\/j.enbuild.2005.08.012"},{"key":"ref141","doi-asserted-by":"publisher","DOI":"10.1109\/TPDS.2012.254"},{"key":"ref142","first-page":"645","article-title":"Optimization of sensor deployment in data center","author":"jung","year":"2016","journal-title":"Proc 3rd Int Conf Comput Inf Sci (ICCOINS)"},{"key":"ref143","first-page":"163","article-title":"Anemometric tool for air flow rate measurement through perforated tiles in a raised floor data center","author":"arghode","year":"2015","journal-title":"Proc 31st Therm Meas Modeling Manage Symp (SEMI-THERM)"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1016\/j.apenergy.2012.10.046"},{"key":"ref144","doi-asserted-by":"publisher","DOI":"10.1115\/1.4035596"},{"key":"ref1","article-title":"America’s data centers consuming and wasting growing amounts of energy","author":"delforge","year":"2014"},{"key":"ref145","first-page":"540","article-title":"The GENiC architecture for integrated data centre energy management","author":"pesch","year":"2015","journal-title":"Proc IEEE\/ACM 8th Int Conf Utility Cloud Comput (UCC)"},{"key":"ref241","doi-asserted-by":"publisher","DOI":"10.1115\/1.4038235"},{"key":"ref242","first-page":"61","article-title":"Utility-function-driven energy-efficient cooling in data centers","author":"das","year":"2010","journal-title":"Proc 7th Int Conf Auto Comput (ICAC)"},{"key":"ref243","first-page":"377","article-title":"Air filter effects on data center supply fan power","author":"eiland","year":"2012","journal-title":"Proc 6th Intersoc Conf Thermal Thermomech Phenomena in Electron Syst"},{"key":"ref244","first-page":"34","article-title":"Cooperative control architecture of fan-less servers and fresh-air cooling in container servers for low power operation","author":"endo","year":"2013","journal-title":"Workshop on Power-aware Computing and Systems (HotPower)"},{"key":"ref240","doi-asserted-by":"publisher","DOI":"10.1109\/ITHERM.2014.6892332"},{"key":"ref248","first-page":"1","article-title":"Trends and effects of energy proportionality on server provisioning in data centers","author":"varsamopoulos","year":"2010","journal-title":"Proc IEEE Int Conf High Perform Comput (HiPC)"},{"key":"ref247","doi-asserted-by":"publisher","DOI":"10.1109\/SEMI-THERM.2013.6526836"},{"key":"ref246","article-title":"Ramification of server airflow leakage in data centers with aisle containment","author":"kennedy","year":"2012"},{"key":"ref245","first-page":"645","article-title":"Employing thermal zones for energy optimization in data centers","author":"yarlanki","year":"2011","journal-title":"Proc ASME Pacific Rim Tech Conf Exhib Packag Integr Electron Photon Syst MEMS NEMS"},{"key":"ref249","doi-asserted-by":"publisher","DOI":"10.1109\/NOMS.2010.5488433"},{"key":"ref109","first-page":"409","article-title":"Energy efficiency and reliability transformation at the ibm india software lab data center","author":"demetriou","year":"2016","journal-title":"Proc 9th Intersoc Conf Therm Thermomech Phenom Electron Syst (ITHERM)"},{"key":"ref108","doi-asserted-by":"publisher","DOI":"10.1109\/TII.2016.2569399"},{"key":"ref107","doi-asserted-by":"publisher","DOI":"10.1016\/j.enbuild.2016.11.050"},{"key":"ref106","doi-asserted-by":"publisher","DOI":"10.1109\/ITHERM.2004.1319226"},{"key":"ref105","article-title":"HPC cooling: A flexible modeling tool for effective design and management","author":"conficoni","year":"0","journal-title":"IEEE Trans Sustain Comput"},{"key":"ref104","doi-asserted-by":"publisher","DOI":"10.1007\/978-3-642-33645-4_10"},{"key":"ref103","doi-asserted-by":"publisher","DOI":"10.1115\/1.2165214"},{"key":"ref102","first-page":"8","article-title":"Modeling perforated tiles in data centers—What is required?","author":"seymour","year":"2015","journal-title":"Proc IEEE 31st SEMI-THERM Symp"},{"key":"ref111","doi-asserted-by":"publisher","DOI":"10.1109\/MCOM.2018.1700231"},{"key":"ref112","first-page":"218","article-title":"PTEC: A system for predictive thermal and energy control in data centers","author":"chen","year":"2014","journal-title":"Proc IEEE Real-Time Syst Symp (RTSS)"},{"key":"ref110","first-page":"1","article-title":"Integrated design and management of a sustainable data center","author":"watson","year":"2009","journal-title":"Proc ASME InterPACK Conf"},{"key":"ref250","first-page":"61","article-title":"Making scheduling ‘cool’: Temperature-aware workload placement in data centers","author":"moore","year":"2005","journal-title":"Proc General Track USENIX Annual Technical Conf"},{"key":"ref251","first-page":"3","article-title":"Under-floor pressure control: A superior method of controlling data center cooling","volume":"118","author":"moss","year":"2012","journal-title":"ASHRAE Trans"},{"key":"ref254","first-page":"409","article-title":"Fan-speed-aware scheduling of data intensive jobs","author":"chan","year":"2012","journal-title":"Proc ACM\/IEEE Int Symp Low Power Electron Design (ISLPED)"},{"key":"ref255","doi-asserted-by":"publisher","DOI":"10.1145\/2567529.2567555"},{"key":"ref252","doi-asserted-by":"publisher","DOI":"10.1115\/1.4039028"},{"key":"ref253","doi-asserted-by":"publisher","DOI":"10.1080\/01998590209509336"},{"key":"ref257","first-page":"1","article-title":"Basic requirements for low noise cooling fans","author":"mather","year":"1992","journal-title":"Proc IEE Colloq Therm Aspects Mach"},{"key":"ref256","first-page":"645","article-title":"Acoustic analysis of an axial fan","author":"hashim","year":"2017","journal-title":"Proc 9th Intersoc Conf Therm Thermomech Phenom Electron Syst (ITHERM)"},{"key":"ref259","year":"2008","journal-title":"Environmental Guidelines for Datacom Equipment"},{"key":"ref10","year":"2018","journal-title":"Genic Project Globally Optimised Energy Efficient Data Centres"},{"key":"ref258","doi-asserted-by":"publisher","DOI":"10.1109\/TCAPT.2006.880512"},{"key":"ref11","year":"2018","journal-title":"Greendatanet Project Working to Reduce the Environmental Impact of the Data Explosion"},{"key":"ref12","year":"2018","journal-title":"RenewIT Project Developing Advanced Energy Simulation Tools for Integration of Renewable Energy Sources in it Data Centres"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1007\/s00450-013-0246-4"},{"key":"ref14","year":"2018","journal-title":"All4Green Project Finest Data Centres Exosystem"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2017.2679184"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1145\/2532637"},{"key":"ref118","doi-asserted-by":"publisher","DOI":"10.1109\/ISQED.2008.4479714"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1145\/2642708"},{"key":"ref117","first-page":"v001t02a019","article-title":"Comparison and evaluation of different monitoring methods in a data center environment","author":"tradat","year":"2017","journal-title":"Proc Int Tech Conf Exhib Packag Integr Electron Photon Microsyst"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/TPDS.2012.20"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1145\/2678278"},{"key":"ref119","first-page":"739","article-title":"Modeling and control for cooling management of data centers with hot aisle containment","author":"zhou","year":"2011","journal-title":"Proc ASME Int Mech Eng Congr Expo (IMECE)"},{"key":"ref114","first-page":"105","article-title":"Data center efficiency with higher ambient temperatures and optimized cooling control","author":"ahuja","year":"2011","journal-title":"27th Annual IEEE Semiconductor Thermal Measurement and Management (SEMI-THERM)"},{"key":"ref113","first-page":"1015","article-title":"Energy-efficiency through the integration of information and communications technology management and facilities controls","author":"patterson","year":"2009","journal-title":"Proc ASME InterPACK Conf"},{"key":"ref116","first-page":"23","article-title":"Temperature measurement in the Intel core duo processor","author":"rotem","year":"2006","journal-title":"Proc Int Workshop Therm Invest ICs"},{"key":"ref115","doi-asserted-by":"crossref","first-page":"63","DOI":"10.1145\/2851553.2851557","article-title":"Analyzing the efficiency of a green University data center","author":"pegus","year":"2016","journal-title":"Proc 7th ACM\/SPEC Int Conf Perform Eng (ICPE)"},{"key":"ref120","first-page":"59","article-title":"Data center heat monitoring using wireless sensor networks","author":"bazemore","year":"2014","journal-title":"Proc ACM Southeast Regional Conf (SE)"},{"key":"ref121","first-page":"312","article-title":"A measurement-based method for improving data center energy efficiency","author":"hamann","year":"2008","journal-title":"Proc IEEE Int Conf Sensor Netw Ubiquitous Trustworthy Comput (SUTC)"},{"key":"ref122","first-page":"1162","article-title":"Impact of active tiles on data center flow and temperature distribution","author":"athavale","year":"2016","journal-title":"Proc 9th Intersoc Conf Therm Thermomech Phenom Electron Syst (ITHERM)"},{"key":"ref123","first-page":"231","article-title":"Measured and simulated energy consumption analysis of a data center on an academic campus","author":"choo","year":"2013","journal-title":"Proc 29th SEMI-THERM Sympos"},{"key":"ref260","first-page":"1145","article-title":"Noise within a data center","author":"miljkovi?","year":"2016","journal-title":"Proc 36th Int Conv Inf Commun Technol Electron Microelectron (MIPRO)"},{"key":"ref261","doi-asserted-by":"publisher","DOI":"10.1109\/STHERM.2007.352412"},{"key":"ref262","first-page":"219","article-title":"Prediction of distributed air leakage in raised-floor data centers","volume":"113","author":"karki","year":"2007","journal-title":"ASHRAE Trans"},{"key":"ref263","article-title":"Control strategies for plenum optimization in raised floor data centers","author":"chen","year":"2006"},{"key":"ref264","doi-asserted-by":"publisher","DOI":"10.1016\/j.buildenv.2005.03.005"},{"key":"ref265","first-page":"v08at10a046","article-title":"Numerical investigation of data center raised-floor plenum","author":"beitelmal","year":"2015","journal-title":"Proc ASME Int Mech Eng Congr Expo (IMECE)"},{"key":"ref266","doi-asserted-by":"publisher","DOI":"10.1016\/j.ijthermalsci.2017.09.001"}],"container-title":["IEEE Access"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/6287639\/8274985\/08451865.pdf?arnumber=8451865","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,7,6]],"date-time":"2025-07-06T18:24:33Z","timestamp":1751826273000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/8451865\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2018]]},"references-count":345,"URL":"https:\/\/doi.org\/10.1109\/access.2018.2866840","relation":{},"ISSN":["2169-3536"],"issn-type":[{"value":"2169-3536","type":"electronic"}],"subject":[],"published":{"date-parts":[[2018]]}}}