{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,5,15]],"date-time":"2026-05-15T15:42:43Z","timestamp":1778859763137,"version":"3.51.4"},"reference-count":70,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","license":[{"start":{"date-parts":[[2018,1,1]],"date-time":"2018-01-01T00:00:00Z","timestamp":1514764800000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/OAPA.html"}],"funder":[{"DOI":"10.13039\/501100003246","name":"Nederlandse Organisatie voor Wetenschappelijk Onderzoek","doi-asserted-by":"publisher","id":[{"id":"10.13039\/501100003246","id-type":"DOI","asserted-by":"publisher"}]},{"name":"NXP Semiconductors through the framework of the Partnership Program on Advanced 5G Solutions, Antenna Topologies and Front-end Configurations for Multiple Beam Generation"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Access"],"published-print":{"date-parts":[[2018]]},"DOI":"10.1109\/access.2018.2873977","type":"journal-article","created":{"date-parts":[[2018,10,8]],"date-time":"2018-10-08T22:57:22Z","timestamp":1539039442000},"page":"58868-58882","source":"Crossref","is-referenced-by-count":95,"title":["Thermal-Aware Synthesis of 5G Base Station Antenna Arrays: An Overview and a Sparsity-Based Approach"],"prefix":"10.1109","volume":"6","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-6834-8375","authenticated-orcid":false,"given":"Yanki","family":"Aslan","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Jan","family":"Puskely","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"J. H. J.","family":"Janssen","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Marcel","family":"Geurts","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Antoine","family":"Roederer","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Alexander","family":"Yarovoy","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref70","doi-asserted-by":"publisher","DOI":"10.1109\/APS.2016.7696089"},{"key":"ref39","author":"aslan","year":"0","journal-title":"Thermal-aware multiple beam synthesis of 5G planar arrays using convex optimization"},{"key":"ref38","doi-asserted-by":"publisher","DOI":"10.1049\/cp.2018.0422"},{"key":"ref33","doi-asserted-by":"publisher","DOI":"10.1109\/TAP.2010.2096400"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.1109\/LAWP.2006.880693"},{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1109\/58.753023"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1109\/LAWP.2015.2494839"},{"key":"ref37","doi-asserted-by":"publisher","DOI":"10.1109\/TAP.2011.2167901"},{"key":"ref36","doi-asserted-by":"publisher","DOI":"10.1109\/TAP.2013.2292529"},{"key":"ref35","doi-asserted-by":"publisher","DOI":"10.1049\/iet-map.2015.0775"},{"key":"ref34","doi-asserted-by":"publisher","DOI":"10.1109\/TAP.2013.2267195"},{"key":"ref60","doi-asserted-by":"publisher","DOI":"10.1109\/TADVP.2009.2023858"},{"key":"ref62","doi-asserted-by":"publisher","DOI":"10.1109\/LAWP.2010.2091104"},{"key":"ref61","doi-asserted-by":"publisher","DOI":"10.1109\/TAP.2006.872647"},{"key":"ref63","year":"2008","journal-title":"Two-Resistor Compact Thermal Model Guideline"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1109\/TAP.2013.2288363"},{"key":"ref64","year":"2008","journal-title":"DELPHI Compact Thermal Model Guideline"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1109\/TAP.2010.2046831"},{"key":"ref65","doi-asserted-by":"publisher","DOI":"10.1109\/TAP.2017.2738065"},{"key":"ref66","doi-asserted-by":"publisher","DOI":"10.1109\/JPROC.2015.2512389"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1109\/TAP.2010.2046858"},{"key":"ref67","doi-asserted-by":"publisher","DOI":"10.3384\/lic.diva-112780"},{"key":"ref68","doi-asserted-by":"publisher","DOI":"10.1109\/MAP.2017.2706668"},{"key":"ref69","doi-asserted-by":"publisher","DOI":"10.1631\/FITEE.1601817"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/MCOM.2014.6815889"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/MCOM.2014.6736744"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1016\/j.icheatmasstransfer.2011.03.004"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1016\/j.ijheatmasstransfer.2016.05.011"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1016\/j.ijheatmasstransfer.2015.09.041"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1016\/j.ijheatmasstransfer.2018.02.001"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1016\/j.ijheatmasstransfer.2016.12.007"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1155\/2009\/624035"},{"key":"ref25","author":"vigano","year":"2011","journal-title":"Sunflower array antenna for multi-beam satellite applications"},{"key":"ref50","doi-asserted-by":"publisher","DOI":"10.1109\/RAST.2015.7208439"},{"key":"ref51","doi-asserted-by":"publisher","DOI":"10.2514\/6.2003-2226"},{"key":"ref59","doi-asserted-by":"publisher","DOI":"10.1080\/01457630701686727"},{"key":"ref58","year":"2017","journal-title":"AC401 CPU Air Cooler Data Sheet"},{"key":"ref57","year":"2013","journal-title":"Power Semiconductor Cooling Solutions"},{"key":"ref56","first-page":"122","article-title":"Thermal management of Fujitsu’s high-performance servers","volume":"43","author":"wei","year":"2007","journal-title":"FUJITSU Sci Tech J"},{"key":"ref55","doi-asserted-by":"publisher","DOI":"10.1049\/joe.2015.0163"},{"key":"ref54","year":"2005","journal-title":"TGA4509-EPU 27–31 GHz 1 W Power Amplifier Data Sheet"},{"key":"ref53","author":"d\u00f6ring","year":"2005","journal-title":"Cooling system for a Ka band transmit antenna array"},{"key":"ref52","first-page":"22","article-title":"Advances in high-performance cooling for electronics","volume":"11","author":"lasance","year":"2005","journal-title":"Electron Cooling"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/TAP.2017.2712819"},{"key":"ref11","first-page":"121","article-title":"Digital beamforming for radar systems","volume":"32","author":"steyskal","year":"1989","journal-title":"Microw J"},{"key":"ref40","doi-asserted-by":"publisher","DOI":"10.2528\/PIER15120401"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2016.2620144"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/TAP.2015.2415527"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2012.2228221"},{"key":"ref15","author":"steinberg","year":"1991","journal-title":"Cooling Techniques for Electronic Equipment"},{"key":"ref16","author":"bencivenni","year":"2017","journal-title":"Aperiodic array synthesis for telecommunications"},{"key":"ref17","first-page":"1877","article-title":"Effects of regular and aperiodic array layout in multi-user MIMO applications","author":"bencivenni","year":"2017","journal-title":"Proc IEEE USNC\/URSI NRSM"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1016\/j.ijheatmasstransfer.2007.08.033"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1016\/j.ijthermalsci.2008.06.013"},{"key":"ref4","author":"hanafi","year":"2014","journal-title":"Design of silicon power ampliers and arrays for millimeter wave applications"},{"key":"ref3","year":"2014","journal-title":"Use of Spectrum Bands Above 24 GHz for Mobile Radio Services Notice of Inquiry"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/JPROC.2014.2299397"},{"key":"ref5","first-page":"352","article-title":"A 28 GHz efficient linear power amplifier for 5G phased arrays in 28 nm bulk CMOS","author":"shakib","year":"2016","journal-title":"Proc ISSCC"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/MCOM.2014.6736750"},{"key":"ref7","first-page":"3685","article-title":"Tens of Gbps support with mmWave beamforming systems for next generation communications","author":"kim","year":"2013","journal-title":"Proc IEEE Globecom"},{"key":"ref49","doi-asserted-by":"publisher","DOI":"10.1109\/TCAPT.2003.811464"},{"key":"ref9","author":"cho","year":"2010","journal-title":"Beam Division Multiple Access System and Method for Mobile Communication System"},{"key":"ref46","first-page":"18","article-title":"Challenges in thermal control of military electronics systems","volume":"9","author":"wilson","year":"2003","journal-title":"Electron Cooling Mag"},{"key":"ref45","year":"2017","journal-title":"SKY66184-11 LTE Power Amplifier Data Sheet"},{"key":"ref48","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2011.2169064"},{"key":"ref47","doi-asserted-by":"publisher","DOI":"10.1109\/INMMIC.2015.7330386"},{"key":"ref42","doi-asserted-by":"publisher","DOI":"10.1109\/JPROC.2015.2494879"},{"key":"ref41","doi-asserted-by":"publisher","DOI":"10.1109\/LAWP.2017.2764069"},{"key":"ref44","doi-asserted-by":"publisher","DOI":"10.1109\/CICC.2017.7993614"},{"key":"ref43","author":"gresham","year":"2015","journal-title":"An AESA revolution utilizing the disruptive technology of highly-integrated silicon ICs"}],"container-title":["IEEE Access"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/6287639\/8274985\/08484977.pdf?arnumber=8484977","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,1,26]],"date-time":"2022-01-26T18:29:35Z","timestamp":1643221775000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/8484977\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2018]]},"references-count":70,"URL":"https:\/\/doi.org\/10.1109\/access.2018.2873977","relation":{},"ISSN":["2169-3536"],"issn-type":[{"value":"2169-3536","type":"electronic"}],"subject":[],"published":{"date-parts":[[2018]]}}}