{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,2,22]],"date-time":"2026-02-22T22:51:07Z","timestamp":1771800667589,"version":"3.50.1"},"reference-count":31,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","license":[{"start":{"date-parts":[[2019,1,1]],"date-time":"2019-01-01T00:00:00Z","timestamp":1546300800000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/OAPA.html"}],"funder":[{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["61401202"],"award-info":[{"award-number":["61401202"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Access"],"published-print":{"date-parts":[[2019]]},"DOI":"10.1109\/access.2019.2913713","type":"journal-article","created":{"date-parts":[[2019,4,29]],"date-time":"2019-04-29T20:53:43Z","timestamp":1556571223000},"page":"56745-56752","source":"Crossref","is-referenced-by-count":20,"title":["Stopband-Improved SIW Triplexer and Triple-Band Filters Using Alternately Cascaded Triple- and Single-Mode Cavities"],"prefix":"10.1109","volume":"7","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-0170-2464","authenticated-orcid":false,"given":"Hao-Wei","family":"Xie","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-9353-4217","authenticated-orcid":false,"given":"Kang","family":"Zhou","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Chun-Xia","family":"Zhou","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Wen","family":"Wu","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1109\/MWSYM.2018.8439574"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1002\/0471221619"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/APMC.2016.7931378"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1049\/iet-map.2011.0448"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/LMWC.2015.2400916"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/MMM.2015.2487920"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2018.2833862"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2013.2287476"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/LMWC.2017.2678435"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2017.2694827"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2018.2793855"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2018.2833462"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2018.2865557"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2014.2319299"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2016.2645156"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.23919\/EuMC.2012.6459144"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2018.2830337"},{"key":"ref29","first-page":"239","author":"pozar","year":"1998","journal-title":"Microwave Engineering"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/LMWC.2014.2316242"},{"key":"ref8","first-page":"678","article-title":"Novel miniaturized triplexer using substrate integrated technology","author":"corona-chavez","year":"2010","journal-title":"Proc Asia&#x2013;Pacific Microw Conf"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/APMC.2009.5385239"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2007.909603"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2015.2483504"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/MWSYM.2014.6848514"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2017.2687424"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2018.2846725"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/ACCESS.2018.2837138"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/LMWC.2013.2274036"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2006.880653"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/LMWC.2018.2805881"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/EuMC.2015.7345873"}],"container-title":["IEEE Access"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/6287639\/8600701\/08701590.pdf?arnumber=8701590","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2021,8,10]],"date-time":"2021-08-10T19:40:20Z","timestamp":1628624420000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/8701590\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2019]]},"references-count":31,"URL":"https:\/\/doi.org\/10.1109\/access.2019.2913713","relation":{},"ISSN":["2169-3536"],"issn-type":[{"value":"2169-3536","type":"electronic"}],"subject":[],"published":{"date-parts":[[2019]]}}}