{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,1,13]],"date-time":"2026-01-13T09:45:25Z","timestamp":1768297525289,"version":"3.49.0"},"reference-count":30,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","license":[{"start":{"date-parts":[[2019,1,1]],"date-time":"2019-01-01T00:00:00Z","timestamp":1546300800000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/OAPA.html"}],"funder":[{"name":"SMRT-NTU Smart Urban Rail Corporate Laboratory"},{"DOI":"10.13039\/100011512","name":"National Research Foundation","doi-asserted-by":"publisher","id":[{"id":"10.13039\/100011512","id-type":"DOI","asserted-by":"publisher"}]},{"name":"SMRT"},{"DOI":"10.13039\/501100001475","name":"Nanyang Technological University","doi-asserted-by":"publisher","id":[{"id":"10.13039\/501100001475","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Access"],"published-print":{"date-parts":[[2019]]},"DOI":"10.1109\/access.2019.2921005","type":"journal-article","created":{"date-parts":[[2019,6,5]],"date-time":"2019-06-05T15:52:37Z","timestamp":1559749957000},"page":"75330-75341","source":"Crossref","is-referenced-by-count":6,"title":["Noncontact Thickness Measurement of Cu Film on Silicon Wafer Using Magnetic Resonance Coupling for Stress Free Polishing Application"],"prefix":"10.1109","volume":"7","author":[{"given":"Zilian","family":"Qu","sequence":"first","affiliation":[]},{"ORCID":"https:\/\/orcid.org\/0000-0002-5773-8335","authenticated-orcid":false,"given":"Wensong","family":"Wang","sequence":"additional","affiliation":[]},{"given":"Shuhui","family":"Yang","sequence":"additional","affiliation":[]},{"given":"Quqin","family":"Sun","sequence":"additional","affiliation":[]},{"ORCID":"https:\/\/orcid.org\/0000-0002-6499-4353","authenticated-orcid":false,"given":"Zhongyuan","family":"Fang","sequence":"additional","affiliation":[]},{"given":"Yuanjin","family":"Zheng","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1080\/09205071.2015.1006733"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1063\/1.1354405"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1088\/0957-0233\/16\/11\/009"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1063\/1.4947234"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/TIM.2015.2406053"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2017.2650861"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1063\/1.1355298"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/TMAG.2004.828040"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/TIM.2008.923777"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/TIM.2004.830585"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/TIM.2015.2479106"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1103\/PhysRevB.54.3530"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1016\/S0167-9317(02)01024-9"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.5515\/JKIEES.2016.16.2.112"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1016\/S1369-7021(04)00053-7"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/66.857938"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1080\/00207217.2016.1138527"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/IITC.2003.1219719"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1007\/s11664-998-0140-1"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1504\/IJMPT.2003.002503"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1149\/1.1393256"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1016\/j.mee.2013.03.046"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1016\/j.mser.2004.06.002"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1016\/j.sna.2016.10.003"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1016\/j.ndteint.2004.09.007"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1016\/j.ndteint.2006.07.009"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/TMAG.2008.2006246"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1016\/j.ndteint.2013.12.012"},{"key":"ref26","first-page":"24","article-title":"Complex inductance and its computer modelling","volume":"53","author":"mayer","year":"2002","journal-title":"J Elect Eng"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1016\/j.ndteint.2013.09.007"}],"container-title":["IEEE Access"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/6287639\/8600701\/08731890.pdf?arnumber=8731890","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,1,12]],"date-time":"2022-01-12T11:54:14Z","timestamp":1641988454000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/8731890\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2019]]},"references-count":30,"URL":"https:\/\/doi.org\/10.1109\/access.2019.2921005","relation":{},"ISSN":["2169-3536"],"issn-type":[{"value":"2169-3536","type":"electronic"}],"subject":[],"published":{"date-parts":[[2019]]}}}