{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,1,19]],"date-time":"2026-01-19T08:07:31Z","timestamp":1768810051056,"version":"3.49.0"},"reference-count":33,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","license":[{"start":{"date-parts":[[2020,1,1]],"date-time":"2020-01-01T00:00:00Z","timestamp":1577836800000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/legalcode"}],"funder":[{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["51435009"],"award-info":[{"award-number":["51435009"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100002858","name":"China Postdoctoral Science Foundation","doi-asserted-by":"publisher","award":["2018M641890"],"award-info":[{"award-number":["2018M641890"]}],"id":[{"id":"10.13039\/501100002858","id-type":"DOI","asserted-by":"publisher"}]},{"name":"Shanghai Sailing Program","award":["18YF1400800"],"award-info":[{"award-number":["18YF1400800"]}]},{"name":"National Engineering and Research Center for Commercial Aircraft Manufacturing, China","award":["COMAC-SFGS-2018-36175"],"award-info":[{"award-number":["COMAC-SFGS-2018-36175"]}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Access"],"published-print":{"date-parts":[[2020]]},"DOI":"10.1109\/access.2020.2966520","type":"journal-article","created":{"date-parts":[[2020,1,14]],"date-time":"2020-01-14T21:08:33Z","timestamp":1579036113000},"page":"17320-17330","source":"Crossref","is-referenced-by-count":36,"title":["Hybrid Feature Selection for Wafer Acceptance Test Parameters in Semiconductor Manufacturing"],"prefix":"10.1109","volume":"8","author":[{"ORCID":"https:\/\/orcid.org\/0000-0003-4220-5154","authenticated-orcid":false,"given":"Hongwei","family":"Xu","sequence":"first","affiliation":[]},{"ORCID":"https:\/\/orcid.org\/0000-0002-6215-0237","authenticated-orcid":false,"given":"Jie","family":"Zhang","sequence":"additional","affiliation":[]},{"ORCID":"https:\/\/orcid.org\/0000-0001-7201-8603","authenticated-orcid":false,"given":"Youlong","family":"Lv","sequence":"additional","affiliation":[]},{"ORCID":"https:\/\/orcid.org\/0000-0001-8208-4057","authenticated-orcid":false,"given":"Peng","family":"Zheng","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref33","doi-asserted-by":"publisher","DOI":"10.1016\/j.engappai.2016.02.002"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.1109\/ACCESS.2018.2833746"},{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1109\/ACCESS.2017.2705642"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1109\/ACCESS.2018.2826048"},{"key":"ref10","first-page":"1","author":"tseng","year":"2011","journal-title":"Hybird recursive statistical methods to improve features selection and data mining process"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1016\/j.eswa.2006.04.014"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/TSM.2017.2788501"},{"key":"ref13","first-page":"1","author":"chongwei","year":"2011","journal-title":"Using molecular-inspired particle swarm optimization to solve the design of process parameters in semiconductor test vehicle"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1002\/9780470397428.ch6"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1007\/s10845-005-0008-7"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/ICCIE.2010.5668273"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1016\/j.eswa.2005.09.024"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1002\/spe.2426"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/WSC.2016.7822290"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1016\/j.bbagen.2016.06.003"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TSM.2016.2574130"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1016\/j.bbadis.2017.10.036"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/TII.2015.2490039"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/ACCESS.2017.2763778"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1007\/s00438-017-1372-7"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/ACCESS.2016.2549546"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/COASE.2017.8256192"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/ACCESS.2019.2894121"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/ASMC.2016.7491077"},{"key":"ref9","first-page":"519","article-title":"Modeling of wafer die yield by WAT parameters","volume":"18","author":"bingyu","year":"2011","journal-title":"J Quality"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/TSM.2016.2630705"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/ACCESS.2018.2815606"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/ACCESS.2018.2882545"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/ACCESS.2017.2678598"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2017.2682012"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/ACCESS.2019.2895375"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1016\/j.csbj.2018.12.002"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/TPAMI.2005.159"}],"container-title":["IEEE Access"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/6287639\/8948470\/08959151.pdf?arnumber=8959151","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,1,27]],"date-time":"2022-01-27T10:31:55Z","timestamp":1643279515000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/8959151\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2020]]},"references-count":33,"URL":"https:\/\/doi.org\/10.1109\/access.2020.2966520","relation":{},"ISSN":["2169-3536"],"issn-type":[{"value":"2169-3536","type":"electronic"}],"subject":[],"published":{"date-parts":[[2020]]}}}