{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,3,18]],"date-time":"2026-03-18T13:18:00Z","timestamp":1773839880868,"version":"3.50.1"},"reference-count":42,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","license":[{"start":{"date-parts":[[2020,1,1]],"date-time":"2020-01-01T00:00:00Z","timestamp":1577836800000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/legalcode"}],"funder":[{"DOI":"10.13039\/501100000038","name":"Natural Science and Engineering Research Council of Canada","doi-asserted-by":"publisher","id":[{"id":"10.13039\/501100000038","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100004543","name":"China Scholarship Council","doi-asserted-by":"publisher","id":[{"id":"10.13039\/501100004543","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Access"],"published-print":{"date-parts":[[2020]]},"DOI":"10.1109\/access.2020.3006904","type":"journal-article","created":{"date-parts":[[2020,7,3]],"date-time":"2020-07-03T20:27:58Z","timestamp":1593808078000},"page":"122348-122359","source":"Crossref","is-referenced-by-count":30,"title":["Real-Time Hardware-in-the-Loop Emulation of High-Speed Rail Power System With SiC-Based Energy Conversion"],"prefix":"10.1109","volume":"8","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-1501-9789","authenticated-orcid":false,"given":"Tian","family":"Liang","sequence":"first","affiliation":[]},{"ORCID":"https:\/\/orcid.org\/0000-0003-0836-4469","authenticated-orcid":false,"given":"Qin","family":"Liu","sequence":"additional","affiliation":[]},{"ORCID":"https:\/\/orcid.org\/0000-0001-7438-9547","authenticated-orcid":false,"given":"Venkata R.","family":"Dinavahi","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref39","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2018.2885060"},{"key":"ref38","doi-asserted-by":"publisher","DOI":"10.1109\/TIA.2015.2416154"},{"key":"ref33","doi-asserted-by":"publisher","DOI":"10.1109\/TAC.1971.1099787"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.1109\/TAC.1966.1098387"},{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1109\/16.3380"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2017.2717444"},{"key":"ref37","doi-asserted-by":"publisher","DOI":"10.1049\/iet-cta.2015.0116"},{"key":"ref36","doi-asserted-by":"publisher","DOI":"10.1109\/63.575667"},{"key":"ref35","doi-asserted-by":"publisher","DOI":"10.1109\/ACCESS.2018.2849002"},{"key":"ref34","doi-asserted-by":"publisher","DOI":"10.1109\/TSP.2002.1011202"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2017.2652401"},{"key":"ref40","doi-asserted-by":"publisher","DOI":"10.1109\/41.925592"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/LPEL.2003.821026"},{"key":"ref12","first-page":"227","article-title":"Static electro-thermal model of SiC merged p-i-n Schottky diodes","author":"zubert","year":"2002","journal-title":"Proc of International Seminar on Power Semiconductors"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/TTE.2018.2823059"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2015.2503281"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/63.622999"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2004.826420"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1016\/j.sse.2006.01.013"},{"key":"ref18","first-page":"567","article-title":"Silvaco modeling of a 10 kV SiC p-i-n diode","author":"thomas","year":"2004","journal-title":"Proc 26th Int Conf Power Modular Symp"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2009.2012388"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1109\/TIA.2019.2918048"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2012.2206358"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1109\/28.287517"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/TIA.2016.2574770"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2015.2417122"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.1976.1050825"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2016.2563379"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1049\/jiee-1.1904.0117"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2009.2023632"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2017.2748063"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/MPEL.2014.2381995"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/MELE.2013.2271839"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/JESTPE.2016.2531631"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2019.2905824"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/TEMC.2019.2915340"},{"key":"ref42","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2018.2868309"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/TPWRD.2017.2774806"},{"key":"ref41","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2016.2598286"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2018.2860566"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2009.2033241"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2017.2685423"}],"container-title":["IEEE Access"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/6287639\/8948470\/09133101.pdf?arnumber=9133101","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,1,12]],"date-time":"2022-01-12T01:09:28Z","timestamp":1641949768000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9133101\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2020]]},"references-count":42,"URL":"https:\/\/doi.org\/10.1109\/access.2020.3006904","relation":{},"ISSN":["2169-3536"],"issn-type":[{"value":"2169-3536","type":"electronic"}],"subject":[],"published":{"date-parts":[[2020]]}}}