{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,6,12]],"date-time":"2026-06-12T16:33:14Z","timestamp":1781281994083,"version":"3.54.1"},"reference-count":131,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","license":[{"start":{"date-parts":[[2020,1,1]],"date-time":"2020-01-01T00:00:00Z","timestamp":1577836800000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/legalcode"}],"funder":[{"name":"Canada Research Chair in Transportation Electrification and Smart Mobility"},{"DOI":"10.13039\/501100000038","name":"Natural Sciences and Engineering Research Council of Canada","doi-asserted-by":"publisher","id":[{"id":"10.13039\/501100000038","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Access"],"published-print":{"date-parts":[[2020]]},"DOI":"10.1109\/access.2020.3019775","type":"journal-article","created":{"date-parts":[[2020,8,27]],"date-time":"2020-08-27T22:28:04Z","timestamp":1598567284000},"page":"160126-160144","source":"Crossref","is-referenced-by-count":186,"title":["Automotive Power Module Packaging: Current Status and Future Trends"],"prefix":"10.1109","volume":"8","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-3268-131X","authenticated-orcid":false,"given":"Yuhang","family":"Yang","sequence":"first","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-9954-0135","authenticated-orcid":false,"given":"Lea","family":"Dorn-Gomba","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-2315-3440","authenticated-orcid":false,"given":"Romina","family":"Rodriguez","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Christopher","family":"Mak","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-0676-1455","authenticated-orcid":false,"given":"Ali","family":"Emadi","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref39","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2017.2712694"},{"key":"ref38","doi-asserted-by":"publisher","DOI":"10.1109\/ICEPT.2007.4441448"},{"key":"ref33","doi-asserted-by":"publisher","DOI":"10.1088\/0960-1317\/23\/1\/015017"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.3390\/mi9070346"},{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2010.2100432"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1002\/adem.201800039"},{"key":"ref37","doi-asserted-by":"publisher","DOI":"10.1109\/IEMDC.2017.8002341"},{"key":"ref36","doi-asserted-by":"publisher","DOI":"10.1109\/MIE.2013.2252958"},{"key":"ref35","doi-asserted-by":"publisher","DOI":"10.1115\/1.4033069"},{"key":"ref34","doi-asserted-by":"publisher","DOI":"10.1179\/136217104225021724"},{"key":"ref28","first-page":"1","article-title":"Adjust the mechanical properties of sintered silver layers using additives","author":"wolfgang","year":"2019","journal-title":"Proc CIPS 9th Int Conf Integr Power Electron Syst"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1007\/s11665-002-0016-0"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1007\/s10853-011-5561-1"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/TVT.2019.2897899"},{"key":"ref22","article-title":"The 2018 GaN power electronics roadmap IOPscience","volume":"501","author":"amano","year":"2018","journal-title":"J Phys D Appl Phys"},{"key":"ref21","author":"kane","year":"2019","journal-title":"EVs Are Switching To Silicon Carbide Power Electronics"},{"key":"ref24","doi-asserted-by":"crossref","first-page":"34001","DOI":"10.1088\/0268-1242\/31\/3\/034001","article-title":"Recent progress in Ga 2 O 3 power devices","volume":"31","author":"masataka","year":"2016","journal-title":"Semicond Sci Technol"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/EnergyTech.2013.6645298"},{"key":"ref101","year":"2015","journal-title":"How to Handle a PCB Project With Embedded Components"},{"key":"ref26","year":"2020","journal-title":"PowerAmerica&sgrave Strategic Roadmap for Next GenerationWide Bandgap Power Electronics"},{"key":"ref100","first-page":"20","article-title":"Integrated packaging allows for improvement in switching characteristics of silicon carbide devices","author":"buttay","year":"2014","journal-title":"Proc PCIM Eur Int Exhib Conf Power Electron Intell Motion Renew Energy Energy Manage"},{"key":"ref25","author":"morancho","year":"2008","journal-title":"State of the Art and Trends in Power Semiconductor Devices for Optimized Power Management"},{"key":"ref50","year":"2020","journal-title":"Material Properties"},{"key":"ref51","first-page":"1335","article-title":"Al-SiC improves reliability Of IGBT power modules","author":"lefranc","year":"1999","journal-title":"Proc ICC"},{"key":"ref59","year":"2019","journal-title":"Hitachi Automotive Systems’ EV Inverter Adopted for the e-tron Audi’s First Mass Production Electric Vehicle"},{"key":"ref58","year":"2014","journal-title":"Hitachi Automotive Systems Delivers Compact High-Output Inverters and DC\/DC Converters for the First Plug-in Hybrid From Mercedes Benz"},{"key":"ref57","doi-asserted-by":"publisher","DOI":"10.1109\/ECCE.2016.7854931"},{"key":"ref56","first-page":"331","article-title":"An experimental study on the thermal performance of double-side direct-cooling power module structure","author":"matsushita","year":"2016","journal-title":"Proc PCIM Eur Int Exhib Conf Power Electron Intell Motion Renew Energy Energy Manage"},{"key":"ref55","first-page":"96","article-title":"High-power-density inverter technology for hybrid and electric vehicle applications","volume":"63","author":"kimura","year":"2014","journal-title":"Hitachi Rev"},{"key":"ref54","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2019.113430"},{"key":"ref53","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2013.2279997"},{"key":"ref52","first-page":"145","article-title":"BASEPLATES in metallic matrix composites for power and microwave","author":"massiot","year":"1997","journal-title":"Proc Workshop Metal Ceram Mater Funct Appl"},{"key":"ref40","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2012.6249098"},{"key":"ref4","year":"2013","journal-title":"Inverter Market to Grow From $45bn in~2012~to 71$bn in 2020"},{"key":"ref3","author":"kochhan","year":"2014","journal-title":"An Overview of Costs for Vehicle Components Fuels and Greenhouse Gas Emissions"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2009.07.055"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.5772\/64173"},{"key":"ref8","first-page":"1","article-title":"Application requirements for automotive power modules","author":"castro","year":"2016","journal-title":"Proc SIA APE"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1007\/978-1-4614-1053-9"},{"key":"ref49","first-page":"2","article-title":"AlSiC Baseplates for power IGBT modules: Design, performance and reliability","author":"occhionero","year":"2002","journal-title":"Proc Process Convers Intell Motion"},{"key":"ref9","author":"demuth","year":"2013","journal-title":"Power modules for hybrid and electric vehicles"},{"key":"ref46","doi-asserted-by":"publisher","DOI":"10.1115\/1.4047409"},{"key":"ref45","author":"tong","year":"2014","journal-title":"DPC (Direct Plated Copper)Metallized Ceramic"},{"key":"ref48","author":"luedtke","year":"2004","journal-title":"High Performance Thermal Management Materials"},{"key":"ref47","doi-asserted-by":"publisher","DOI":"10.1016\/j.ceramint.2018.02.072"},{"key":"ref42","first-page":"6","article-title":"Planar interconnect technology for power module system integration","volume":"9","author":"weidner","year":"2012","journal-title":"Proc 7th Int Conf Integr Power Electron Syst (CIPS)"},{"key":"ref41","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2015.06.012"},{"key":"ref44","author":"bajwa","year":"2015","journal-title":"New Assembly and Packaging Technologies for High-Power and High-Temperature GaN and SiC"},{"key":"ref43","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2006.889898"},{"key":"ref127","doi-asserted-by":"publisher","DOI":"10.1016\/j.matdes.2016.06.099"},{"key":"ref126","doi-asserted-by":"publisher","DOI":"10.1016\/j.matdes.2016.07.027"},{"key":"ref125","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2017.01.010"},{"key":"ref124","doi-asserted-by":"publisher","DOI":"10.4028\/www.scientific.net\/MSF.924.845"},{"key":"ref73","first-page":"232","article-title":"New assembly and interconnects beyond sintering methods","author":"guth","year":"2010","journal-title":"Proc Int Exhib Conf Power Electron Intell Motion Renew Energy Energy Manage (PCIM)"},{"key":"ref72","year":"2019","journal-title":"Application Note Assembly instructions on HybridPACK DSC"},{"key":"ref71","doi-asserted-by":"publisher","DOI":"10.3390\/wevj7020250"},{"key":"ref129","doi-asserted-by":"publisher","DOI":"10.1007\/s10854-016-5600-4"},{"key":"ref70","doi-asserted-by":"publisher","DOI":"10.1109\/ITEC.2016.7520237"},{"key":"ref128","doi-asserted-by":"crossref","first-page":"168","DOI":"10.1109\/TCPMT.2014.2337300","article-title":"Survey of high-temperature polymeric encapsulants for power electronics packaging","volume":"5","author":"yao","year":"2015","journal-title":"IEEE Trans Compon Packag Manuf Technol"},{"key":"ref76","doi-asserted-by":"publisher","DOI":"10.4271\/2011-01-0351"},{"key":"ref77","first-page":"1","article-title":"Impact of SiC and RC-IGBT on drive and power supply","author":"fujihira","year":"2018","journal-title":"Proceedings of PEA"},{"key":"ref130","author":"zhang","year":"2014","journal-title":"High temperature LTCC based SiC double-sided cooling power electronic module"},{"key":"ref74","first-page":"25","article-title":"Aging of new interconnect-technologies of power-modules during power-cycling","author":"heuck","year":"2014","journal-title":"Proc CIPS-8th Int Conf Integr Power Electron Syst"},{"key":"ref75","doi-asserted-by":"publisher","DOI":"10.4271\/2011-01-0350"},{"key":"ref78","first-page":"1","article-title":"Trends in Automotive Power Electronics","volume":"14","author":"satheesh","year":"0"},{"key":"ref131","doi-asserted-by":"publisher","DOI":"10.23919\/IPEC.2018.8507647"},{"key":"ref79","year":"2015","journal-title":"2015 Electric Drive Technologies Annual Report"},{"key":"ref60","doi-asserted-by":"publisher","DOI":"10.4271\/2015-01-1201"},{"key":"ref62","first-page":"16","article-title":"650V, 7mOhm SiC MOSFET development for dual-side power modules in electric drive vehicles","author":"hayes","year":"2017","journal-title":"Proc PCIM Eur Int Exhib Conf Power Electron Intell Motion Renew Energy Energy Manage"},{"key":"ref61","first-page":"357","article-title":"Building blocks and opportunities for power electronics integration","author":"taylor","year":"2011","journal-title":"Proc IEEE Applied Power Electronics Conf Expo (APEC)"},{"key":"ref63","first-page":"1","year":"2018","journal-title":"650V SiC Integrated Power Module for Automotive Inverters"},{"key":"ref64","doi-asserted-by":"publisher","DOI":"10.4271\/2016-01-1227"},{"key":"ref65","doi-asserted-by":"publisher","DOI":"10.4271\/2017-01-1244"},{"key":"ref66","doi-asserted-by":"publisher","DOI":"10.1109\/ISPSD.2014.6856072"},{"key":"ref67","author":"feustel","year":"2020","journal-title":"Power electronics for hybrid and electric vehicles Postgraduate Summer School 2016–Nottingham Power Electronics in Hybrid and Electric Vehicles"},{"key":"ref68","first-page":"7","article-title":"Next-generation power module for automotive applications—J1-series","volume":"149","author":"ishihara","year":"2015","journal-title":"Mitsubishi Elect Adv"},{"key":"ref69","author":"adlkofer","year":"2017","journal-title":"Bernstein Conference on EVs and Energy Storage"},{"key":"ref2","author":"macdonald","year":"2016","journal-title":"Electric vehicles to be 35% of global new car sales by 2040"},{"key":"ref1","author":"emadi","year":"2014","journal-title":"Advanced Electric Drive Vehicles"},{"key":"ref95","first-page":"1","article-title":"Integration of cooling function into 3-D power module packaging","author":"liang","year":"2014","journal-title":"Proc 25th IEEE Appl Power Electron Conf Expo"},{"key":"ref109","first-page":"2","article-title":"Compact power electronic modules realized by PCB embedding technology","author":"l\u00f6her","year":"2016","journal-title":"Proc IEEE CPMT Symp Jpn (ICSJ)"},{"key":"ref94","doi-asserted-by":"publisher","DOI":"10.1109\/IWIPP.2017.7936764"},{"key":"ref108","doi-asserted-by":"publisher","DOI":"10.1109\/LED.2017.2748223"},{"key":"ref93","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2017.2686365"},{"key":"ref107","doi-asserted-by":"publisher","DOI":"10.1109\/JESTPE.2019.2952238"},{"key":"ref92","doi-asserted-by":"publisher","DOI":"10.1109\/ECCE.2017.8096698"},{"key":"ref106","doi-asserted-by":"publisher","DOI":"10.1109\/ESTC.2016.7764706"},{"key":"ref105","doi-asserted-by":"publisher","DOI":"10.1109\/IWIPP.2015.7295990"},{"key":"ref91","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2018.00208"},{"key":"ref104","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2017.2651646"},{"key":"ref90","doi-asserted-by":"publisher","DOI":"10.1109\/IWIPP.2019.8799099"},{"key":"ref103","doi-asserted-by":"publisher","DOI":"10.1109\/ESTC.2012.6542167"},{"key":"ref102","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2019.2904533"},{"key":"ref111","author":"sheng","year":"2005","journal-title":"Power Electronic Modules design and Manufacture"},{"key":"ref112","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2012.06.079"},{"key":"ref110","year":"2020","journal-title":"FR408 High performance Lminate and Prepreg"},{"key":"ref98","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2013.2289013"},{"key":"ref99","doi-asserted-by":"publisher","DOI":"10.1109\/TIA.2010.2057401"},{"key":"ref96","article-title":"Packaging technology for a highly integrated 10kV SiC MOSFET module","author":"mouawad","year":"0"},{"key":"ref97","doi-asserted-by":"publisher","DOI":"10.1109\/55.406801"},{"key":"ref10","first-page":"22","article-title":"Analysis of innovation trends in packaging for power modules","author":"yannou","year":"2012","journal-title":"European Advanced Technology Workshop on Micropackaging and Thermal Management"},{"key":"ref11","first-page":"1","article-title":"Automotive Power Module solution for EV inverter application","author":"han","year":"2015","journal-title":"Proc PCIM-Asia"},{"key":"ref12","author":"spenke","year":"2019","journal-title":"Automotive High Capacity Power Module"},{"key":"ref13","author":"barbarini","year":"2018","journal-title":"STMicroelectronics SiC Module-Tesla"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.24295\/CPSSTPEA.2017.00017"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/JESTPE.2019.2947645"},{"key":"ref82","author":"zhang","year":"2015","journal-title":"Design Fabrication and Test of SiC MOSFET-Gate Driver Co-Packaged Power Module"},{"key":"ref118","doi-asserted-by":"publisher","DOI":"10.1115\/1.4040499"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1115\/1.4040828"},{"key":"ref81","first-page":"75","article-title":"Packaging technologies for SiC power modules","volume":"58","author":"horio","year":"2012","journal-title":"Fuji Electr Rev"},{"key":"ref117","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2015.02.019"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/ISPSD.2012.6229088"},{"key":"ref84","doi-asserted-by":"publisher","DOI":"10.1109\/WiPDA.2015.7369298"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1115\/1.4047472"},{"key":"ref83","first-page":"41","article-title":"Optimum gate driver design to reach SiC-MOSFET’s full potential—Speeding up to 200 kV\/$\\mu\\text{s}$","author":"kreutzer","year":"2015","journal-title":"Proc IEEE 3rd Workshop Wide Bandgap Power Devices Appl (WiPDA)"},{"key":"ref119","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2017.317"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/TIA.2019.2891214"},{"key":"ref114","doi-asserted-by":"publisher","DOI":"10.1109\/JESTPE.2018.2820046"},{"key":"ref113","first-page":"50","article-title":"The research on IGBT chip for Press-pack","volume":"36","author":"gao","year":"2016","journal-title":"Research & Progress of SSE"},{"key":"ref80","first-page":"1","article-title":"New concept package with 1 st generation trench gate SiC MOSFETs trench gate SiC MOSFETs","author":"iwasaki","year":"2017","journal-title":"Proc PCIM Asia Int Exhib Conf Power Electron Intell Motion Renew Energy Energy Manage"},{"key":"ref116","first-page":"1","article-title":"A hybrid integrated power electronic module based on pressure contact technology","author":"he","year":"2006","journal-title":"Proc 37th IEEE Power Electron Spec Conf"},{"key":"ref115","doi-asserted-by":"publisher","DOI":"10.1109\/EPE.2016.7695282"},{"key":"ref120","doi-asserted-by":"publisher","DOI":"10.1109\/ECCE.2015.7310352"},{"key":"ref89","first-page":"1","article-title":"Study on packaging and driver integration with GaN switches for fast switching opportunities for GaN parasitics influencing switching characteristics of power modules","author":"klein","year":"2016","journal-title":"Proc Int Conf Integr Power Electron Syst"},{"key":"ref121","doi-asserted-by":"publisher","DOI":"10.1109\/ECCE.2015.7310353"},{"key":"ref122","doi-asserted-by":"publisher","DOI":"10.1109\/TIA.2016.2604379"},{"key":"ref123","doi-asserted-by":"publisher","DOI":"10.1109\/APEC.2018.8340999"},{"key":"ref85","first-page":"128","article-title":"A SiC MOSFET power module with integrated gate drive for $2.~5$\n MHz class E resonant converters","author":"bj\u00f8rn","year":"2018","journal-title":"Proc CIPS 10th Int Conf Integr Power Electron Syst"},{"key":"ref86","doi-asserted-by":"publisher","DOI":"10.1109\/WiPDA.2014.6964620"},{"key":"ref87","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2003.820597"},{"key":"ref88","first-page":"97","article-title":"Integration of 1200V SOI gate driver ICs into a medium power IGBT module package","author":"vogler","year":"2010","journal-title":"Proc 22nd Int Symp Power Semiconductor Devices IC’s (ISPSD)"}],"container-title":["IEEE Access"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/6287639\/8948470\/09178734.pdf?arnumber=9178734","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2021,12,17]],"date-time":"2021-12-17T19:55:30Z","timestamp":1639770930000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9178734\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2020]]},"references-count":131,"URL":"https:\/\/doi.org\/10.1109\/access.2020.3019775","relation":{},"ISSN":["2169-3536"],"issn-type":[{"value":"2169-3536","type":"electronic"}],"subject":[],"published":{"date-parts":[[2020]]}}}