{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,5,8]],"date-time":"2026-05-08T15:55:17Z","timestamp":1778255717362,"version":"3.51.4"},"reference-count":36,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","license":[{"start":{"date-parts":[[2020,1,1]],"date-time":"2020-01-01T00:00:00Z","timestamp":1577836800000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/legalcode"}],"funder":[{"DOI":"10.13039\/501100004543","name":"China Scholarship Council","doi-asserted-by":"publisher","award":["201906020125"],"award-info":[{"award-number":["201906020125"]}],"id":[{"id":"10.13039\/501100004543","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Access"],"published-print":{"date-parts":[[2020]]},"DOI":"10.1109\/access.2020.3031022","type":"journal-article","created":{"date-parts":[[2020,10,14]],"date-time":"2020-10-14T19:28:33Z","timestamp":1602703713000},"page":"188154-188170","source":"Crossref","is-referenced-by-count":12,"title":["Reliability Evaluation of Multi-Mechanism Failure for Semiconductor Devices Using Physics-of-Failure Technique and Maximum Entropy Principle"],"prefix":"10.1109","volume":"8","author":[{"given":"Bo","family":"Wan","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-2909-5715","authenticated-orcid":false,"given":"Ye","family":"Wang","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-7756-2560","authenticated-orcid":false,"given":"Yutai","family":"Su","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Guicui","family":"Fu","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref33","doi-asserted-by":"publisher","DOI":"10.1109\/TR.2018.2829721"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.1002\/j.1538-7305.1948.tb01338.x"},{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1115\/1.2904353"},{"key":"ref30","author":"steinberg","year":"1988","journal-title":"Vibration Analysis for Electronic Equipment"},{"key":"ref36","doi-asserted-by":"publisher","DOI":"10.1109\/6144.974964"},{"key":"ref35","doi-asserted-by":"publisher","DOI":"10.1109\/16.848285"},{"key":"ref34","doi-asserted-by":"publisher","DOI":"10.1007\/s00158-011-0656-5"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1016\/j.engfailanal.2019.05.021"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1002\/sys.21451"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1002\/9781118841716"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1103\/PhysRev.106.620"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1016\/j.jcp.2009.09.011"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.3390\/e15031100"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1016\/j.measurement.2014.07.012"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1016\/j.strusafe.2016.08.001"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.3390\/e21070649"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1061\/(ASCE)HE.1943-5584.0001637"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2014.6897318"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2018.06.119"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1116\/1.583609"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/TR.2015.2456183"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TCAPT.2009.2015231"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2000.853299"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2017.2725742"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/ICRSE.2015.7366465"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2010.5490854"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1016\/B978-1-78242-221-1.00003-4"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1016\/j.ijepes.2018.09.044"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.4271\/2018-01-0100"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/I2MTC.2017.7969851"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/IRPS.1979.362863"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/TR.1980.5220804"},{"key":"ref24","year":"2016","journal-title":"Failure Mechanisms and Models for Semiconductor Devices"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/IRPS.1981.362997"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/IRPS.1985.362087"},{"key":"ref25","doi-asserted-by":"crossref","first-page":"1587","DOI":"10.1109\/PROC.1969.7340","article-title":"electromigration failure modes in aluminum metallization for semiconductor devices","volume":"57","author":"black","year":"1969","journal-title":"Proceedings of the IEEE"}],"container-title":["IEEE Access"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/6287639\/8948470\/09223700.pdf?arnumber=9223700","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,1,12]],"date-time":"2022-01-12T15:57:43Z","timestamp":1642003063000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9223700\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2020]]},"references-count":36,"URL":"https:\/\/doi.org\/10.1109\/access.2020.3031022","relation":{},"ISSN":["2169-3536"],"issn-type":[{"value":"2169-3536","type":"electronic"}],"subject":[],"published":{"date-parts":[[2020]]}}}