{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,1,17]],"date-time":"2026-01-17T01:50:31Z","timestamp":1768614631303,"version":"3.49.0"},"reference-count":60,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","license":[{"start":{"date-parts":[[2020,1,1]],"date-time":"2020-01-01T00:00:00Z","timestamp":1577836800000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/legalcode"}],"funder":[{"name":"MSIT (Ministry of Science and ICT), Korea, under the ITRC (Information Technology Research Center) support program","award":["IITP-2020-2018-0-01424"],"award-info":[{"award-number":["IITP-2020-2018-0-01424"]}]},{"DOI":"10.13039\/501100010418","name":"IITP","doi-asserted-by":"publisher","id":[{"id":"10.13039\/501100010418","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Access"],"published-print":{"date-parts":[[2020]]},"DOI":"10.1109\/access.2020.3044044","type":"journal-article","created":{"date-parts":[[2020,12,11]],"date-time":"2020-12-11T21:21:11Z","timestamp":1607721671000},"page":"224549-224564","source":"Crossref","is-referenced-by-count":9,"title":["Reliability Optimization of Real-Time Satellite Embedded System Under Temperature Variations"],"prefix":"10.1109","volume":"8","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-8992-7691","authenticated-orcid":false,"given":"Beomsik","family":"Kim","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-7929-7470","authenticated-orcid":false,"given":"Hoeseok","family":"Yang","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref39","article-title":"Grmon3 user’s manual","author":"gaisler","year":"2017"},{"key":"ref38","author":"yayla","year":"2020","journal-title":"Softwarebased Fault Tolerance Adding Fault Tolerance Feature in the Rate Monotonic Scheduler (ESA Summer Code Space)"},{"key":"ref33","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2017.2669144"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.1145\/1878961.1879013"},{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2007.895245"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1109\/MM.2005.54"},{"key":"ref37","doi-asserted-by":"publisher","DOI":"10.1109\/TC.2019.2935042"},{"key":"ref36","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2017.2707401"},{"key":"ref35","doi-asserted-by":"publisher","DOI":"10.23919\/DATE.2017.7927031"},{"key":"ref34","first-page":"1","article-title":"Combined DVFS and mapping exploration for lifetime and soft-error susceptibility improvement in MPSoCs","author":"das","year":"2014","journal-title":"Proc Design Autom Test Eur Conf Exhibition (DATE)"},{"key":"ref60","doi-asserted-by":"publisher","DOI":"10.1109\/RADECS.2009.5994733"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1145\/2980930.2907952"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1109\/CODESISSS.2015.7331368"},{"key":"ref29","article-title":"Thermal performance challenges from silicon to systems","author":"viswanath","year":"2000"},{"key":"ref2","year":"2011"},{"key":"ref1","author":"authority","year":"1992","journal-title":"Software Considerations in Airborne Systems and Equipment Certification"},{"key":"ref20","author":"martin","year":"2020","journal-title":"SMART"},{"key":"ref22","year":"2020","journal-title":"RTEMS Real Time Operating System (RTOS)"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.3390\/s19224902"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1145\/2024724.2024815"},{"key":"ref23","first-page":"35","article-title":"The effects of energy management on reliability in real-time embedded systems","author":"zhu","year":"2004","journal-title":"Proc IEEE\/ACM Int Conf Comput Aided Design ICCAD"},{"key":"ref26","first-page":"1","article-title":"On the scheduling of fault-tolerant mixed-criticality systems","author":"huang","year":"2014","journal-title":"Proc 51st ACM\/EDAC\/IEEE Design Autom Conf (DAC)"},{"key":"ref25","first-page":"1","article-title":"Reliability-aware mapping optimization of multi-core systems with mixed-criticality","author":"kang","year":"2014","journal-title":"Proc Design Autom Test Eur Conf Exhibition (DATE)"},{"key":"ref50","doi-asserted-by":"crossref","first-page":"717","DOI":"10.1109\/TVLSI.2006.878337","article-title":"Energy minimization for real-time systems with (m,k)-guarantee","volume":"14","author":"niu","year":"2006","journal-title":"IEEE Trans Very Large Scale Integr (VLSI) Syst"},{"key":"ref51","doi-asserted-by":"publisher","DOI":"10.1109\/T-ED.1969.16754"},{"key":"ref59","doi-asserted-by":"publisher","DOI":"10.1109\/AERO.2006.1655956"},{"key":"ref58","doi-asserted-by":"publisher","DOI":"10.1109\/REDW.2009.5336299"},{"key":"ref57","doi-asserted-by":"publisher","DOI":"10.1109\/2.62094"},{"key":"ref56","doi-asserted-by":"publisher","DOI":"10.1109\/40.45825"},{"key":"ref55","article-title":"Multilevel interconnect reliability on the effects of electro-thermomechanical stresses","author":"nguyen","year":"2004"},{"key":"ref54","doi-asserted-by":"publisher","DOI":"10.1557\/JMR.2000.0177"},{"key":"ref53","author":"gaisler","year":"2015","journal-title":"Reliability Assessment of gr712rc Dual-Core Leon3Ft Processor"},{"key":"ref52","doi-asserted-by":"publisher","DOI":"10.1145\/1080695.1070013"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2010.2058873"},{"key":"ref40","article-title":"Rcc user’s manual","author":"gaisler","year":"2018"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1145\/1150019.1136493"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/ASPDAC.2011.5722170"},{"key":"ref13","author":"gaisler","year":"2020","journal-title":"Gr712rc Dual-core leon3ft Sparc v8 Processor"},{"key":"ref14","article-title":"Rad750 radiation hardened powerpc microprocessor","author":"berger","year":"0","journal-title":"Lockheed Martin Space Electron Commun"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/JPROC.2018.2802438"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.4271\/2016-01-0131"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/SIES.2015.7185051"},{"key":"ref18","article-title":"Cubesat: A new generation of picosatellite for education and industry low-cost space experimentation","author":"heidt","year":"2000","journal-title":"Proc Small Satell Conf"},{"key":"ref19","author":"rossi","year":"2013","journal-title":"The Swisscube’s Technologies Results After Four Years of Flight"},{"key":"ref4","first-page":"8","article-title":"Measurement and reporting of alpha particle and terrestrial cosmic ray-induced soft errors in semiconductor devices","volume":"1","year":"2006","journal-title":"JEDEC Solid State Technol Assoc"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1049\/cce:20000101"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1145\/2847263.2847278"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/24.994926"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TNS.2009.2033381"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TNS.2016.2635028"},{"key":"ref49","doi-asserted-by":"publisher","DOI":"10.1109\/REAL.2000.895998"},{"key":"ref9","year":"2003","journal-title":"Failure Mechanisms and Models for Semiconductor Devices"},{"key":"ref46","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2006.876103"},{"key":"ref45","doi-asserted-by":"publisher","DOI":"10.1109\/DATE.2011.5763104"},{"key":"ref48","author":"gaisler","year":"2017","journal-title":"Handling of External Memory Edac Errors in Leon\/Grlib Systems"},{"key":"ref47","author":"chhabra","year":"2017","journal-title":"CRC Handbook of Thermal Engineering"},{"key":"ref42","doi-asserted-by":"publisher","DOI":"10.1109\/DSN.2004.1311888"},{"key":"ref41","author":"gaisler","year":"2017","journal-title":"Examples of Core Supply Power Consumption of the gr712rc"},{"key":"ref44","doi-asserted-by":"publisher","DOI":"10.1145\/1594233.1594257"},{"key":"ref43","year":"2005","journal-title":"The International Technology Roadmap for Semiconductors (ITRS)"}],"container-title":["IEEE Access"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/6287639\/8948470\/09291428.pdf?arnumber=9291428","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,1,12]],"date-time":"2022-01-12T01:09:08Z","timestamp":1641949748000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9291428\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2020]]},"references-count":60,"URL":"https:\/\/doi.org\/10.1109\/access.2020.3044044","relation":{},"ISSN":["2169-3536"],"issn-type":[{"value":"2169-3536","type":"electronic"}],"subject":[],"published":{"date-parts":[[2020]]}}}