{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,5,9]],"date-time":"2026-05-09T17:29:44Z","timestamp":1778347784800,"version":"3.51.4"},"reference-count":25,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","license":[{"start":{"date-parts":[[2021,1,1]],"date-time":"2021-01-01T00:00:00Z","timestamp":1609459200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/legalcode"}],"funder":[{"DOI":"10.13039\/501100004608","name":"School of Electronic Science and Engineering of Southeast University through the Natural Science Foundation of Jiangsu Province of China","doi-asserted-by":"publisher","award":["BK20171156"],"award-info":[{"award-number":["BK20171156"]}],"id":[{"id":"10.13039\/501100004608","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100012226","name":"Fundamental Research Funds for the Central Universities","doi-asserted-by":"publisher","id":[{"id":"10.13039\/501100012226","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Access"],"published-print":{"date-parts":[[2021]]},"DOI":"10.1109\/access.2021.3061125","type":"journal-article","created":{"date-parts":[[2021,2,22]],"date-time":"2021-02-22T23:13:05Z","timestamp":1614035585000},"page":"33512-33521","source":"Crossref","is-referenced-by-count":15,"title":["Field-Circuit Co-Simulation Method for Electrostatic Discharge Investigation in Electronic Products"],"prefix":"10.1109","volume":"9","author":[{"given":"Lanlan","family":"Yang","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Chang","family":"Yang","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yan","family":"Tu","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Xiangji","family":"Wang","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Qian","family":"Wang","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/TEMC.2015.2424259"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/ISEMC.2016.7571736"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/ISEMC.2016.7571735"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/TEMC.2017.2705619"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TEMC.2010.2087025"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/TEMC.2011.2171040"},{"key":"ref16","first-page":"1","article-title":"Advanced full wave ESD generator model for system level coupling simulation","author":"qing","year":"2008","journal-title":"Proc IEEE Int Symp Electromagn Compat"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/TEMC.2019.2926962"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/TEMC.2017.2787721"},{"key":"ref19","doi-asserted-by":"crossref","first-page":"248","DOI":"10.1109\/TEMC.2010.2048755","article-title":"Progress review of electromagnetic compatibility analysis technologies for packages, printed circuit boards, and novel interconnects","volume":"52","author":"li","year":"2010","journal-title":"IEEE Trans Electromagn Compat"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/ISEMC.2012.6351825"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.3390\/en3111728"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TIA.2006.882686"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/TEMC.2015.2443844"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/ISEMC.2009.5284625"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/ISEMC.2003.1236564"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/ELMAGC.2002.1177476"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/ISEMC.2014.6899034"},{"key":"ref1","first-page":"2","author":"liu","year":"2004","journal-title":"Electrostatic Discharge and Hazard Protection"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/MEMC.2015.7336756"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.23919\/EOSESD.2017.8073436"},{"key":"ref21","year":"0"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/TEMC.2018.2815024"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.23919\/EOSESD.2017.8073452"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/TEMC.2015.2418715"}],"container-title":["IEEE Access"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/6287639\/9312710\/09360627.pdf?arnumber=9360627","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2021,12,17]],"date-time":"2021-12-17T19:56:58Z","timestamp":1639771018000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9360627\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2021]]},"references-count":25,"URL":"https:\/\/doi.org\/10.1109\/access.2021.3061125","relation":{},"ISSN":["2169-3536"],"issn-type":[{"value":"2169-3536","type":"electronic"}],"subject":[],"published":{"date-parts":[[2021]]}}}