{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,5,13]],"date-time":"2026-05-13T18:38:25Z","timestamp":1778697505264,"version":"3.51.4"},"reference-count":77,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","license":[{"start":{"date-parts":[[2021,1,1]],"date-time":"2021-01-01T00:00:00Z","timestamp":1609459200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/legalcode"}],"funder":[{"DOI":"10.13039\/100006602","name":"U.S. Air Force Research Laboratory (AFRL) Small Business Technology Transfer (STTR) Program","doi-asserted-by":"publisher","award":["FA864919PA080"],"award-info":[{"award-number":["FA864919PA080"]}],"id":[{"id":"10.13039\/100006602","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Access"],"published-print":{"date-parts":[[2021]]},"DOI":"10.1109\/access.2021.3075429","type":"journal-article","created":{"date-parts":[[2021,4,26]],"date-time":"2021-04-26T21:20:44Z","timestamp":1619472044000},"page":"64499-64509","source":"Crossref","is-referenced-by-count":15,"title":["AI-Powered Terahertz VLSI Testing Technology for Ensuring Hardware Security and Reliability"],"prefix":"10.1109","volume":"9","author":[{"ORCID":"https:\/\/orcid.org\/0000-0003-1094-5318","authenticated-orcid":false,"given":"Naznin","family":"Akter","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-4149-6260","authenticated-orcid":false,"given":"Masudur R.","family":"Siddiquee","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-0976-6232","authenticated-orcid":false,"given":"Michael","family":"Shur","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-6136-9811","authenticated-orcid":false,"given":"Nezih","family":"Pala","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref73","first-page":"4","article-title":"Assessment of required minimum sample size in variation signature based approaches to device authentication","author":"eakins","year":"2018","journal-title":"Proc Government Microcircuit Appl Crit Technol Conf (GOMACTech)"},{"key":"ref72","doi-asserted-by":"publisher","DOI":"10.1049\/el:20089418"},{"key":"ref71","doi-asserted-by":"publisher","DOI":"10.1109\/TTHZ.2019.2952248"},{"key":"ref70","doi-asserted-by":"publisher","DOI":"10.1109\/22.841969"},{"key":"ref76","doi-asserted-by":"publisher","DOI":"10.1109\/JSEN.2017.2725744"},{"key":"ref77","first-page":"1988","article-title":"Subwavelength detection of terahertz radiation using GaAs HEMTs","author":"elkhatib","year":"2008","journal-title":"Proc IEEE Sensors"},{"key":"ref74","article-title":"X-ray tech lays chip secrets bare","author":"moore","year":"2019","journal-title":"IEEE Spectr Nanoclast Blog Semicond Designs Sect"},{"key":"ref39","doi-asserted-by":"publisher","DOI":"10.1364\/AO.54.003826"},{"key":"ref75","doi-asserted-by":"publisher","DOI":"10.1103\/PhysRevB.95.104111"},{"key":"ref38","doi-asserted-by":"publisher","DOI":"10.1109\/TIFS.2016.2571260"},{"key":"ref33","doi-asserted-by":"publisher","DOI":"10.1007\/s10762-006-9106-7"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.1126\/sciadv.1600190"},{"key":"ref31","first-page":"753","article-title":"Inspection of space shuttle insulation foam defects using a 0.2 THz Gunn diode oscillator","author":"zhong","year":"2004","journal-title":"Infr Millim Waves Conf Dig Joint 29th Int Conf 12th Int Conf THz Electron"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1109\/TTHZ.2016.2519263"},{"key":"ref37","doi-asserted-by":"publisher","DOI":"10.1063\/1.4935495"},{"key":"ref36","article-title":"New algorithm for detection of dangerous objects hidden on a human body using passive THz camera","volume":"9993","author":"trofimov","year":"2016","journal-title":"Proc 9th Millimetre Wave THz Sensors Technol"},{"key":"ref35","doi-asserted-by":"publisher","DOI":"10.5772\/63734"},{"key":"ref34","doi-asserted-by":"publisher","DOI":"10.1109\/TTHZ.2011.2159553"},{"key":"ref60","doi-asserted-by":"publisher","DOI":"10.1109\/NATW.2018.8388865"},{"key":"ref62","doi-asserted-by":"publisher","DOI":"10.1142\/S0129156411006374"},{"key":"ref61","doi-asserted-by":"publisher","DOI":"10.1109\/16.485650"},{"key":"ref63","doi-asserted-by":"publisher","DOI":"10.1109\/ICSENS.2007.4388556"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1364\/JOSAA.25.003120"},{"key":"ref64","doi-asserted-by":"publisher","DOI":"10.1049\/el:20073475"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1364\/OPN.15.10.000034"},{"key":"ref65","article-title":"Terahertz testing of very large scale integrated circuits","author":"shur","year":"2019","journal-title":"Semiconductor Technology for Ultra Large Scale Integrated Circuits and Thin Film Transistors VII"},{"key":"ref66","doi-asserted-by":"publisher","DOI":"10.1016\/j.sse.2019.03.007"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1364\/AO.55.003462"},{"key":"ref67","doi-asserted-by":"publisher","DOI":"10.1109\/RAPID49481.2020.9195662"},{"key":"ref68","first-page":"1","article-title":"AI powered THz VLSI testing technology","author":"akter","year":"2020","journal-title":"Proc IEEE 29th North Atlantic Test Workshop (NATW)"},{"key":"ref69","article-title":"Terahertz plasmonics for testing very large-scale integrated circuits under bias","author":"rupper","year":"2021"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/NEWCAS.2011.5981325"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.31399\/asm.tb.mfadr7.t91110634"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1364\/OE.24.006425"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1364\/OPEX.13.000115"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1080\/10589759.2012.694882"},{"key":"ref24","first-page":"61","article-title":"Terahertz imaging: Terahertz reflectometry images faults in silicon chips","volume":"47","author":"nagel","year":"2011","journal-title":"Laser Focus World"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/IMFEDK.2004.1566392"},{"key":"ref26","article-title":"Sub-cycle terahertz microscopy down to the atomic scale","author":"cocker","year":"2018","journal-title":"Proc Workshop Adv Scanning Probe Microsc (ASPM)"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/IRMMW-THz.2018.8509936"},{"key":"ref50","doi-asserted-by":"publisher","DOI":"10.1063\/1.4954222"},{"key":"ref51","doi-asserted-by":"publisher","DOI":"10.1063\/1.4902999"},{"key":"ref59","author":"lapedus","year":"2021","journal-title":"10 nm Versus 7 nm"},{"key":"ref58","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2014.2311129"},{"key":"ref57","doi-asserted-by":"publisher","DOI":"10.1109\/TTHZ.2016.2530938"},{"key":"ref56","doi-asserted-by":"publisher","DOI":"10.1016\/j.phpro.2015.09.120"},{"key":"ref55","doi-asserted-by":"publisher","DOI":"10.1109\/TTHZ.2014.2325393"},{"key":"ref54","doi-asserted-by":"publisher","DOI":"10.1364\/OL.42.001828"},{"key":"ref53","doi-asserted-by":"publisher","DOI":"10.1364\/OE.11.002549"},{"key":"ref52","doi-asserted-by":"publisher","DOI":"10.3233\/JAE-131719"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2003.1216400"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1115\/1.1464878"},{"key":"ref40","doi-asserted-by":"publisher","DOI":"10.1364\/AO.49.00E106"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1016\/j.ymssp.2016.09.030"},{"key":"ref13","first-page":"408","article-title":"A novel method and device for solder joint quality inspection by using laser ultrasound","author":"liu","year":"2000","journal-title":"Proc 50th Electron Compon Technol Conf"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1007\/978-1-4615-5339-7_252"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1016\/j.optlaseng.2017.07.007"},{"key":"ref16","article-title":"Terahertz characterization of electronic components and comparison of terahertz imaging with X-ray imaging techniques","volume":"9483","author":"ahi","year":"2015","journal-title":"THz Phys Devices Syst Adv Appl Ind Defense"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1063\/1.1935032"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1063\/1.4955405"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/TTHZ.2015.2460671"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.3390\/s18071981"},{"key":"ref3","author":"ross","year":"2011","journal-title":"Microelectronics Failure Analysis Desk Reference"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1117\/12.360270"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/95.477473"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/RELPHY.1997.584251"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/ICMCM.1997.581167"},{"key":"ref49","doi-asserted-by":"publisher","DOI":"10.1021\/acs.nanolett.5b01970"},{"key":"ref9","first-page":"29","article-title":"Fault localization and functional testing of ICs by lock-in thermography","author":"breitenstein","year":"2002","journal-title":"Proc Conf 28th Int Symp Test Failure Anal (ISTFA)"},{"key":"ref46","doi-asserted-by":"publisher","DOI":"10.1063\/1.4907350"},{"key":"ref45","doi-asserted-by":"publisher","DOI":"10.1070\/QE2014v044n08ABEH015486"},{"key":"ref48","doi-asserted-by":"publisher","DOI":"10.1117\/1.OE.52.6.068203"},{"key":"ref47","doi-asserted-by":"publisher","DOI":"10.1109\/TTHZ.2015.2460677"},{"key":"ref42","doi-asserted-by":"publisher","DOI":"10.1109\/TTHZ.2013.2273226"},{"key":"ref41","doi-asserted-by":"publisher","DOI":"10.1007\/s10921-017-0414-8"},{"key":"ref44","doi-asserted-by":"publisher","DOI":"10.1364\/OL.27.001312"},{"key":"ref43","doi-asserted-by":"publisher","DOI":"10.1016\/j.neucom.2015.10.056"}],"container-title":["IEEE Access"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/6287639\/9312710\/09415742.pdf?arnumber=9415742","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2021,12,17]],"date-time":"2021-12-17T19:55:47Z","timestamp":1639770947000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9415742\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2021]]},"references-count":77,"URL":"https:\/\/doi.org\/10.1109\/access.2021.3075429","relation":{},"ISSN":["2169-3536"],"issn-type":[{"value":"2169-3536","type":"electronic"}],"subject":[],"published":{"date-parts":[[2021]]}}}