{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,5,17]],"date-time":"2026-05-17T06:12:03Z","timestamp":1778998323745,"version":"3.51.4"},"reference-count":49,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","license":[{"start":{"date-parts":[[2021,1,1]],"date-time":"2021-01-01T00:00:00Z","timestamp":1609459200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by-nc-nd\/4.0\/"}],"funder":[{"DOI":"10.13039\/100012024","name":"Multimedia University, Cyberjaya, Malaysia","doi-asserted-by":"publisher","id":[{"id":"10.13039\/100012024","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Access"],"published-print":{"date-parts":[[2021]]},"DOI":"10.1109\/access.2021.3076193","type":"journal-article","created":{"date-parts":[[2021,4,28]],"date-time":"2021-04-28T20:05:49Z","timestamp":1619640349000},"page":"65418-65439","source":"Crossref","is-referenced-by-count":26,"title":["A Realizable Overlay Virtual Metrology System in Semiconductor Manufacturing: Proposal, Challenges and Future Perspective"],"prefix":"10.1109","volume":"9","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-6055-5628","authenticated-orcid":false,"given":"Tze Chiang","family":"Tin","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Saw Chin","family":"Tan","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-1235-2850","authenticated-orcid":false,"given":"Hing","family":"Yong","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Jimmy Ook Hyun","family":"Kim","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Eric Ken Yong","family":"Teo","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-6708-3654","authenticated-orcid":false,"given":"Ching Kwang","family":"Lee","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Peter","family":"Than","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Angela Pei San","family":"Tan","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Siew Chee","family":"Phang","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref39","doi-asserted-by":"publisher","DOI":"10.1109\/LSENS.2018.2884735"},{"key":"ref38","doi-asserted-by":"publisher","DOI":"10.1109\/TSM.2019.2931328"},{"key":"ref33","doi-asserted-by":"publisher","DOI":"10.1016\/j.cie.2018.06.024"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.1016\/j.jprocont.2017.12.004"},{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1016\/j.jprocont.2017.02.002"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1109\/ICCSCE.2016.7893629"},{"key":"ref37","doi-asserted-by":"publisher","DOI":"10.1016\/j.compchemeng.2019.05.016"},{"key":"ref36","doi-asserted-by":"publisher","DOI":"10.1007\/s10845-018-1447-2"},{"key":"ref35","doi-asserted-by":"publisher","DOI":"10.1109\/ISSM.2018.8651162"},{"key":"ref34","doi-asserted-by":"publisher","DOI":"10.1109\/TSM.2017.2787550"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1016\/j.jprocont.2016.04.002"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1109\/TSM.2016.2594033"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1016\/j.procir.2016.11.100"},{"key":"ref2","author":"quirk","year":"2001","journal-title":"Semiconductor Manufacturing Technology"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1002\/0471790281"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/TSM.2014.2321192"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/TSM.2013.2286498"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/TMECH.2013.2273435"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1016\/j.cor.2014.05.008"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/TSM.2015.2409299"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/ISSC.2015.7163771"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/TSM.2015.2432576"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1016\/j.jprocont.2008.04.014"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1016\/j.eswa.2009.05.053"},{"key":"ref40","first-page":"1297","article-title":"A structure data-driven framework for virtual metrology modeling","volume":"17","author":"yang","year":"2020","journal-title":"IEEE Trans Autom Sci Eng"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/TSM.2008.2011185"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/TSM.2009.2031750"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1016\/j.eswa.2010.08.040"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1016\/j.eswa.2011.09.088"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1016\/j.jprocont.2012.01.012"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/TSM.2011.2176759"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/TSM.2013.2257897"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/CoASE.2013.6653980"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TSM.2010.2065531"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/TSM.2010.2041289"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TSM.2014.2374339"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/TSM.2011.2154850"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TSM.2019.2902657"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TSM.2017.2676245"},{"key":"ref49","doi-asserted-by":"publisher","DOI":"10.1016\/j.compind.2012.10.002"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TSM.2007.907607"},{"key":"ref46","doi-asserted-by":"publisher","DOI":"10.1109\/VLSI-DAT.2016.7482565"},{"key":"ref45","doi-asserted-by":"publisher","DOI":"10.1016\/j.conengprac.2019.104262"},{"key":"ref48","doi-asserted-by":"publisher","DOI":"10.1186\/2251-712X-9-37"},{"key":"ref47","doi-asserted-by":"publisher","DOI":"10.1109\/TASE.2013.2280618"},{"key":"ref42","doi-asserted-by":"publisher","DOI":"10.1109\/TSM.2019.2932377"},{"key":"ref41","doi-asserted-by":"publisher","DOI":"10.1016\/j.jprocont.2019.08.006"},{"key":"ref44","doi-asserted-by":"publisher","DOI":"10.1016\/j.compind.2020.103228"},{"key":"ref43","doi-asserted-by":"publisher","DOI":"10.1016\/j.isatra.2020.03.031"}],"container-title":["IEEE Access"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/6287639\/9312710\/09417222.pdf?arnumber=9417222","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2021,12,17]],"date-time":"2021-12-17T19:57:35Z","timestamp":1639771055000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9417222\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2021]]},"references-count":49,"URL":"https:\/\/doi.org\/10.1109\/access.2021.3076193","relation":{},"ISSN":["2169-3536"],"issn-type":[{"value":"2169-3536","type":"electronic"}],"subject":[],"published":{"date-parts":[[2021]]}}}