{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,6,4]],"date-time":"2026-06-04T16:09:15Z","timestamp":1780589355128,"version":"3.54.1"},"reference-count":43,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","license":[{"start":{"date-parts":[[2021,1,1]],"date-time":"2021-01-01T00:00:00Z","timestamp":1609459200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/legalcode"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Access"],"published-print":{"date-parts":[[2021]]},"DOI":"10.1109\/access.2021.3083063","type":"journal-article","created":{"date-parts":[[2021,5,24]],"date-time":"2021-05-24T19:47:47Z","timestamp":1621885667000},"page":"84217-84230","source":"Crossref","is-referenced-by-count":29,"title":["An Extended Multilayer Thermal Model for Multichip IGBT Modules Considering Thermal Aging"],"prefix":"10.1109","volume":"9","author":[{"ORCID":"https:\/\/orcid.org\/0000-0003-4137-6912","authenticated-orcid":false,"given":"Mohsen","family":"Akbari","sequence":"first","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-9344-146X","authenticated-orcid":false,"given":"Mohammad","family":"Tavakoli Bina","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Amir Sajjad","family":"Bahman","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Bahman","family":"Eskandari","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-2217-5293","authenticated-orcid":false,"given":"Edris","family":"Pouresmaeil","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-8311-7412","authenticated-orcid":false,"given":"Frede","family":"Blaabjerg","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref39","first-page":"810","article-title":"A new lifetime model for advanced power modules with sintered chips and optimized Al wire bonds","author":"scheuermann","year":"2013","journal-title":"Proc PCIM Eur"},{"key":"ref38","doi-asserted-by":"publisher","DOI":"10.1109\/TEC.2016.2614526"},{"key":"ref33","first-page":"1","article-title":"A real time measurement of junction temperature variation in high power IGBT modules for wind power converter application","author":"ghimire","year":"2014","journal-title":"Proc 8th Int Conf Integr Power Electron Syst"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.5772\/38268"},{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1109\/EPE.2005.219580"},{"key":"ref30","article-title":"Thermal characterization of die-attach degradation in the power MOSFET","author":"katsis","year":"2003"},{"key":"ref37","article-title":"An experimental assessment of numerical predictive accuracy for electronic component heat transfer","author":"rodgers","year":"2000"},{"key":"ref36","doi-asserted-by":"publisher","DOI":"10.1109\/PEDES.2012.6484482"},{"key":"ref35","doi-asserted-by":"publisher","DOI":"10.1109\/28.767018"},{"key":"ref34","doi-asserted-by":"publisher","DOI":"10.1109\/TCE.1961.6373039"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2014.2331285"},{"key":"ref40","doi-asserted-by":"publisher","DOI":"10.1109\/MIE.2014.2311829"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1049\/cp:20080533"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2015.2418711"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/IECON.2013.6699260"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2017.2694548"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2020.2969350"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/TDMR.2016.2606483"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/TDMR.2017.2746571"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/JESTPE.2018.2796624"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/JESTPE.2020.2973181"},{"key":"ref28","author":"giedt","year":"1957","journal-title":"Engineering Heat Transfer"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2009.2036728"},{"key":"ref27","first-page":"5","year":"2019","journal-title":"Introduction to the Heat Transfer Module"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2004.830089"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2016.2539208"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1109\/95.725210"},{"key":"ref5","year":"2002","journal-title":"PLECS User Manual The Simulation Platform for Power Electronic Systems"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2015.2397955"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2015.2509506"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2012.2229472"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2006.870714"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/TIA.2005.863905"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2020.3010064"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/STHERM.1999.762434"},{"key":"ref21","year":"2013","journal-title":"IFS75B12N3E4_B31 Datasheet MIPAQTM Base Module With Trench\/Field Stop IGBT4 Emitter Controlled 4 Diode and Current Sense Shunt"},{"key":"ref42","first-page":"1","article-title":"Model for power cycling lifetime of IGBT modules-various factors influencing lifetime","author":"bayerer","year":"2008","journal-title":"Proc 5th Int Conf Integr Power Electron Syst"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1007\/978-3-319-70917-8_11"},{"key":"ref41","year":"0","journal-title":"Dynasolve 700 Series Cured Polymer Cleaning Solvents"},{"key":"ref23","year":"0","journal-title":"High Performance Thermal Paste With Good Thermal Conductivity"},{"key":"ref26","year":"2018","journal-title":"COMSOL Multiphysics 4"},{"key":"ref43","first-page":"126","year":"2015","journal-title":"Application Manual Power Semiconductors"},{"key":"ref25","first-page":"13","year":"2015","journal-title":"Fuji IGBT module application manual"}],"container-title":["IEEE Access"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/6287639\/9312710\/09439476.pdf?arnumber=9439476","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2021,12,17]],"date-time":"2021-12-17T19:56:16Z","timestamp":1639770976000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9439476\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2021]]},"references-count":43,"URL":"https:\/\/doi.org\/10.1109\/access.2021.3083063","relation":{},"ISSN":["2169-3536"],"issn-type":[{"value":"2169-3536","type":"electronic"}],"subject":[],"published":{"date-parts":[[2021]]}}}